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Foundry Service

Brite provides full wafer service and technical supporting from tape-out to mass production for both design service projects and GDS-in projects, including IP merge, DRC, LVS, ANT, DFM, ESD check etc. Our engineers have a lot hands on experience on tape out, pilot run, excursion handling, production management, yield improvement and testing data analysis. We have strict flow on tape-out to provide high quality service for customers.

Currently Brite achieves about 60 tape-out projects in a year and around half of them are full mask tape-outs. The projects cover variety process and technology nodes, such as 40nmLL, 55/65nmLL, 65nmLL, 0.11/0.13um, 0.18um, and the process covers logic, mix-signal, eFlash, EEPROM and so on.

For brand new projects, we also provide MPW service for customers from 0.18um to 28nm on We also help customers on MPW projects from 0.18um to 40nm and process includes Logic, Mixed-Signal, RF, Low Power, High Voltage etc. After the project goes to full mask tape, we will also provide corner split support and recipe fine-tune. In production stage, we will closely monitor production status and quality index as well.

  • Tape out
  • Shuttle Booking
  • Corner split and analysis
  • In-line parameter fine-tune
  • DRC / DFM Check
  • ESD review result
  • Pre tape out mask check
Package Service

By closely working with package houses, Brite offers total solution and manufacturing service on package. Our packaging engineering staffs have many years? experience at package and substrate design. It is carefully considered at the beginning stage of projects that the bond pad lay-out and package design is fine-tuned. During package development, Brite?s package engineers co-work with designers from factory on routing guidance, thermal enhancement and electrical optimization.

Package is taking more and more ratio in the total chip cost currently. It?s pretty critical to achieve a cost competitive and good performance package to help product successful in end market. At the same time, a good package DFM can also reduce much yield loss during production.

Brite has many successful projects on production and engineering development, which includes FCBGA, HSPBGA, FBGAs, QFN, SiP, QFPs etc.

Testing Service and Product Engineering

Brite has the capability of software and hardware development for probing test and final test. Especially by co-working between our Testing engineers and DFT engineers, we can draw out high coverage test plan in design stage and quickly resolve issues in debugging, and to make sure fully debugged program releasing to production on time.

Quality Management

Brite Semiconductor is an ISO9001 certificate company

Quality management is the primary task of Brite Turnkey service. In order to better serve customers, we use MRB/DRB (Material/Disposition Review Board) electronic system on OA to track and record abnormal object handle for each quality issue, CAR(Corrective Action Report) electronic system is applied for taking corrective/preventive actions for each quality issue to obtain continuous quality improvement.

Supply Chain Management

Brites Production Control staffs take important roles during manufacturing. They are executing and monitoring multi tasks during production to ensure schedule and on-time delivery.

Production management: Planning, forecasting and capacity negotiation.

WIP Management: Co-ordinate schedule and arrangement on wafer, package and test, WIP tracking

Order Management: Order release and control, purchasing according to customer?s requests

Inventory Management: In & out monitoring, regular inventory audit

Logistics: Define the fastest logistics flow and tracking shipping status

Custom Clearance: Working with 1st tier partner and save time on custom requests

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