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CEVA at MWC 2015: Powering a New Era of Intelligent Mobile Devices with the Industry's Leading Portfolio of Communications, Multimedia and Connectivity IPs

Showcasing the latest advances in computer vision, computational photography, audio, voice, sensing, cellular communications, Bluetooth & Wi-Fi technologies; Visit CEVA at booth A50, hall 6

MOUNTAIN VIEW, Calif., Feb. 18, 2015 – 

CEVA, Inc. (NASDAQ: CEVA), the leading licensor of DSP and IP platforms for cellular, multimedia and connectivity, will showcase its portfolio of leading-edge licensable solutions for intelligent mobile devices at Mobile World Congress 2015. For a preview of what's on show at the Congress, please visit http://events.ceva-dsp.com/mwc15/

Building on its industry leadership in DSP cores and platforms that power 1 in every 3 handsets sold worldwide today, the Company's significantly expanded product offerings are designed to power a new era of intelligent mobile devices that can communicate, sense, recognize and analyze.

These technologies include:

Mobile World Congress 2015 takes place in Barcelona, Spain from March 2nd to 5th. CEVA will be located at stand A50 in Hall 6. To request a meeting with CEVA please email events@ceva-dsp.com or contact your local CEVA sales office.

About CEVA, Inc.

CEVA is the world s leading licensor of silicon intellectual property (SIP) DSP cores and platform solutions for the mobile handset, portable and consumer electronics markets. CEVA s IP portfolio includes comprehensive technologies for cellular baseband (2G / 3G / 4G), multimedia, HD video and audio, voice over packet (VoP), Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2010, CEVA s IP was shipped in over 600 million devices, powering handsets from 7 out of the top 8 handset OEMs, including Nokia, Samsung, LG, Motorola, Sony Ericsson and ZTE. Today, more than one in every three handsets shipped worldwide is powered by a CEVA DSP core.

CEVA is publicly traded in New York (NASDAQ: CEVA) and in London (LSE: CVA).

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