It's Nearly Winter and the FPGAs are Migrating: Pin compatibility improvements among Kintex UltraScale and UltraScale+ FPGAs

by Steve Leibson - Xcell Daily Blog - Xilinx, Dec. 16, 2015 – 

Let's say you're planning a line of products and your design would really benefit from being able to solder a range of FPGAs onto the same site on your pc board depending on the amount of programmable-logic resources needed to realize the various members of your new product line. If that's you, then you're going to really interested in this new FPGA migration story because now, with careful up-front design, you can use the same device-package footprint to accommodate as many as seven different Xilinx Kintex FPGAs drawn from the 20nm Kintex UltraScale and 16nm Kintex UltraScale+ device families.

This 13-device migration chart should make your device-migration opportunities across seven package types crystal clear:

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