www.design-reuse-embedded.com
Find Top SoC Solutions
for AI, Automotive, IoT, Security, Audio & Video...

Moortec to exhibit at next week's TSMC China Technology Symposium

May. 17, 2016, May. 13, 2016 – 

As a member of the TSMC IP Alliance, Moortec Semiconductor will be attending the TSMC 2016 China Technology Symposium which is taking place next Tuesday in Shenzhen.

Why not come and meet us at booth 29 and discuss in person how your advanced node System on Chip (SoC) programme can benefit from Moortec's high performance analog IP?

Specialising in embedded Process, Voltage and Temperature (PVT) sensors, Energy Optimisation Sub-systems (EOS) and Global Device Monitoring (GDM) for advanced nodes, Moortec's IP enables SoC designs to be performance optimised and monitored on a per die basis.

Moortec specialises in the following IP solutions:

To arrange a meeting with Moortec Semiconductor at this event to discuss your analogue IP requirements please contact: ramsay.allen@moortec.com

 Back

Partner with us

List your Products

Suppliers, list and add your products for free.

More about D&R Privacy Policy

© 2024 Design And Reuse

All Rights Reserved.

No portion of this site may be copied, retransmitted, reposted, duplicated or otherwise used without the express written permission of Design And Reuse.