TSMC to offer embedded ReRAM in 2019

Leading foundry TSMC plans to offer embedded MRAM as a non-volatile memory option for SoCs in 2018 and to offer embedded resistive RAM in 2019, according to reports of an account in the Chinese language Economic Daily News (EDN).

By Peter Clarke, EENews Europe, Jun. 19, 2017 – 

Both technologies will be offered for a 22nm FinFET manufacturing process, the reports said.

TSMC will be catching up with rivals Samsung and Globalfoundries who are offering eMRAM on 28nm CMOS and 22nm FDSOI processes, respectively, and then potentially leapfrog them with the ReRAM offering in 2019. Neither Samsung nor Globalfoundries has made any move to move to embedded ReRAM.

TSMC plans to enter so-called "risk production" of its eMRAM in chips in 2018 and of eReRAM in chips in 2019 using a 22nm manufacturing process the report is said to have referenced TSMC CTO Jack Sun as saying.

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