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Open-Silicon to demonstrate its IoT Edge SoC Platform Solution, IoT Gateway SoC Reference Design and Comprehensive HBM2 IP Subsystem Solution for 2.5D ASICs in TSMC 16nm FF+ at ARM TechCon 2017


Oct. 16, 2017, Oct. 16, 2017 – Open-Silicon, a system-optimized ASIC solutions provider, will be exhibiting at ARM TechCon 2017. The company will demonstrate its IoT Edge SoC Platform Solution, IoT Gateway SoC Reference Design and Comprehensive High Bandwidth Memory (HBM2) IP Subsystem Solution for 2.5D ASICs in TSMC 16nm FF+.

Exhibit
When: October 24-27, 2017 – 8:30 noon – 5:30 pm
Where: Booth 918 on Exhibit Floor, Santa Clara convention Center, CA.

About Open-Silicon

Open-Silicon transforms ideas into system-optimized ASIC solutions within the time-to-market parameters desired by customers. The company enhances the value of customers' products by innovating at every stage of design – architecture, logic, physical, system, software and IP – and then continues to partner to deliver fully tested silicon and platforms. Open-Silicon applies an open business model that enables the company to uniquely choose best-in-industry IP, design methodologies, tools, software, packaging, manufacturing and test capabilities. The company has partnered with over 150 companies ranging from large semiconductor and systems manufacturers to high-profile start-ups, and has successfully completed 300+ designs and shipped over 130 million ASICs to date. Privately held, Open-Silicon employs over 250 people in Silicon Valley and around the world. To learn more, visit www.open-silicon.com

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