Invensas DBI Technology Now Available at SMIC

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Leading semiconductor foundry ready to manufacture Invensas wafer bonding and 3D interconnect technology for image sensor solutions

SAN JOSE, Calif., Nov. 08, 2017 – Semiconductor Manufacturing International Corporation ("SMIC") (NYSE: SMI; SEHK: 981), one of the leading semiconductor foundries in the world and the largest and most advanced foundry in mainland China, and Invensas, a wholly owned subsidiary of Xperi Corporation ("Xperi") (NASDAQ: XPER), today announced the establishment of Invensas' Direct Bond Interconnect (DBI®) technology at SMIC's Avezzano facility. This capability enables SMIC to support the growing demand for high performance, hybrid stacked backside illuminated (BSI) image sensors, as well as other semiconductor devices, in a wide range of end applications including smartphones and automobiles. SMIC and Invensas previously signed a Development License in March 2017. "By working closely with the Invensas team, we have been able to quickly bring in the DBI manufacturing process and are now prepared to offer DBI for image sensors, MEMS sensor hubs, Power Management IC, and beyond to our customers at 200mm," said Roberto Bez, vice president of technology development at LFoundry, SMIC's subsidiary in Avezzano, Italy. "Invensas' DBI technology enables SMIC to manufacture the high performance image sensors required in mobile, automotive, and consumer electronics applications," said Sunny Hui, senior vice president of marketing at SMIC. "With this technology in place, SMIC is prepared to further expand this capability into volume manufacturing around the globe, both at 200mm and 300mm." Click here to read more...

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