www.design-reuse-embedded.com
SEARCH SOLUTIONS   
    • Categories
    • RISC-V
    • Embedded Processing
    • 5G, 3GPP LTE SoCs
    • IoT SoCs
    • Artificial Intelligence SoCs
    • Automotive SoCs
    • Space and Avionics
    • Security Solutions & SoCs
    • Audio & Video SoCs
    • Design Platforms
    • Monitoring and Verification
    • SoC Design Services
    • Find your best SoC design partner
Partner Videos D&R Events
    • IP-SoC Days 2024
    • IP-SoC Days 2023
    • IP-SoC Days 2022
    • IP-SoC Days 2021
    • IP-SoC Days 2020
    • IP-SoC 2023
    • IP-SoC 2022
    • IP-SoC 2021
    • IP-SoC 2020
On Demand Webinars NEWS
Find Top SoC Solutions
for AI, Automotive, IoT, Security, Audio & Video...

Broadcom Announces Industry's First Silicon-Proven 7nm IP for ASICs in Deep Learning and Networking Applications

SAN JOSE, Calif., and SINGAPORE, Nov. 21, 2017 –  Broadcom Limited (NASDAQ:AVGO), a leading designer, developer and global supplier of a broad range of digital and analog semiconductor connectivity solutions, today announced the industry's first silicon-proven 7nm intellectual property (IP) for an ASIC platform targeting deep learning and networking applications. Based on TSMC 7nm process technology, the platform offers best-in-class IP cores which include high speed SerDes, HBM PHY, Die2Die PHY, mixed-signal IP, and foundation IP such as standard cells, SRAM, TCAM memory, and I/O cells. Click here to read more ...

 Back

Partner with us

Contact Us
Partnership Offers

List your Products

Suppliers, list and add your products for free.

List your Products

More about D&R Privacy Policy

© 2024 Design And Reuse

All Rights Reserved.

No portion of this site may be copied, retransmitted, reposted, duplicated or otherwise used without the express written permission of Design And Reuse.