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Toshiba Electronic Devices & Storage Corporation Introduces New Bluetooth® low energy IC for Automotive Applications

TOKYO , Dec. 05, 2017 –  Toshiba Electronic Devices & Storage Corporation has announced a new IC that is compliant with Bluetooth® low energy (LE) [1] core specification 4.2 including support for secure connection, LE privacy features and extended packet length support. It is available for use in harsh automotive environments and extended temperature ranges. The mixed-signal TC35679IFTG contains both analog RF and baseband digital parts to provide a complete solution in a single, compact and low-profile, 40-pin 6mm x 6mm x 1mm QFN 'wettable flank' package, with a pin pitch of 0.5mm.

The TC35679IFTG provides Bluetooth® Host Control Interface (HCI) functions alongside low energy GATT profile functions (as defined by Bluetooth®) specifications. The new IC becomes a fully-fledged application processor when used in conjunction with an external non-volatile memory, or can be used in combination with an external host processor.

The highly integrated device is based on an Arm® Cortex®-M0 processor and includes a sizeable 384KB of on-board mask ROM to support the Bluetooth® baseband process and a further 192KB of on-board RAM for Bluetooth® application programs and data.

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