Find Top SoC Solutions
for AI, Automotive, IoT, Security, Audio & Video...

Adapting an embedded FPGA for Aerospace Applications

Jan. 30, 2018, Jan. 30, 2018 – The IC industry is commonly divided into different market segments – consumer, mobile, industrial, commercial, medical, automotive, and aerospace. A key differentiation among these segments is the characterization and reliability qualification strategy for the fabrication process and design circuitry. For each segment, specific voltage and temperature environment ranges are input to electrical characterization and analysis flows to confirm functional operation. Reliability analysis expands upon these circuit characterization parameters to evaluate various failure mechanisms, which can lead to either "hard error" lifetime fails or "soft error" transient fails. The primary lifetime failure mechanisms are related to device and interconnect parameter drift due to "aging", associated with: the number of power-on hours; the on/off (thermal) cycles; interconnect current density; and, circuit switching activity. The primary source of soft errors is due to exposure to external radiation.

I was curious to learn more about the aerospace segment – but first, I needed to study up on radiation-hardened ("rad hard") soft error concerns and circuit design.

Rad Hard Design

Click here to read more ...


Partner with us

Visit our new Partnership Portal for more information.

Submit your material

Submit hot news, product or article.

List your Products

Suppliers, list and add your products for free.

More about D&R Privacy Policy

© 2018 Design And Reuse

All Rights Reserved.

No portion of this site may be copied, retransmitted,
reposted, duplicated or otherwise used without the
express written permission of Design And Reuse.