Xilinx Advances State-of-the-Art in Integrated and Adaptable Solutions for Aerospace and Defense with Introduction of 16nm Defense-Grade UltraScale+ Portfolio

SAN JOSE, Calif., Nov. 15, 2018 – Xilinx, Inc. (NASDAQ: XLNX), the leader in adaptive and intelligent computing, today announced the availability of its Defense-grade XQ UltraScale+ portfolio of products, providing the benefits of its UltraScale+ architecture plus extended temperature and ruggedized packages to address the needs of the aerospace and defense industry. The new products — encompassing the XQ Zynq^® UltraScale+ MPSoCs and RFSoCs as well as XQ UltraScale+ Kintex^® and Virtex^® FPGAs — represent the industry’s broadest line of high-performance programmable silicon for harsh environments, where the highest levels of security and reliability are critical, and size, weight and power (SWaP) are key considerations.

The XQ UltraScale+ product portfolio advances the state-of-the-art single-chip solutions for aerospace and defense applications, attaining at a minimum twice the performance-per-watt of preceding-generation systems, thanks to the high-level of integration implemented in TSMC’s 16nm FinFET process.

This portfolio includes the industry’s first Defense-grade heterogeneous multi-processor SoC devices, combining flexible and dynamically reconfigurable high-performance programmable logic and DSP, 16Gb/s and 28Gb/s transceivers, quad-core Arm^® Cortex^™-A53 embedded processors, and dual-core Arm Cortex-R5 embedded processors. In addition, optionally available features include high-speed 4Gsps ADCs and 6.4Gsps DACs, Arm Mali™-400 GPU, 4k60 H.265/H/264 video codec, and ruggedized packages with support of -55^oC to 125^oC and 256-bit physical unclonable function (PUF).

The portfolio’s highly integrated programmable SoC offers key advantages over alternative approaches, which typically require customers to source and use multiple chips. In addition to SWaP considerations, the devices provide many other benefits that make them ideally suited for applications in civil and military aircraft as well as other defense systems requiring support for extended temperature ranges, rugged environments, long life and the highest levels of security.

“With more than 30 years of continuous focus and heritage in the aerospace and defense industry, we’re excited to announce the industry’s most advanced Defense-grade product portfolio for our customers,” said David Gamba, senior director of aerospace and defense, Xilinx. “This line builds on our currently available UltraScale and 7 Series Defense-grade families, giving our customers a variety of powerful options to meet their most demanding applications.”

Features

Available features for the Defense-grade XQ UltraScale+ products include:

• Ruggedized packaging
• MIL-STD-883 group D Qualification testing
• Military-temperature range (-55^oC to 125^oC)
• Full range extended temperature testing
• Mask set control
• Full compliance with MIL-PRF-38535 Pb content standards
• Longer-term availability
• Anti-counterfeiting features
• Available information assurance (IA) methodology
• Available anti-tamper (AT) technology

Availability

Initial UltraScale+ Defense-grade products are available now. For more information, please contact Xilinx for specific product availability.

About Xilinx

Xilinx develops highly flexible and adaptive processing platforms that enable rapid innovation across a variety of technologies – from the endpoint to the edge to the cloud. Xilinx is the inventor of the FPGA, hardware programmable SoCs and the ACAP, designed to deliver the most dynamic processor technology in the industry and enable the adaptable, intelligent and connected world of the future. For more information, visit www.xilinx.com.

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