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Kandou Announces 100th Patent Grant by U.S. Patent Office

Milestone Highlights Kandou Leadership in Architecture and Implementation of High-Speed, Chip-to-Chip Communication Links

LAUSANNE, Switzerland, Dec. 11, 2018 – Kandou Bus S.A., the global pioneer in multi-wire SerDes technology, today announced that the United States Patent and Trademark Office has awarded to Kandou Bus its 100th patent relating to Kandou’s multi-wire signaling. The patent, entitled, “Skew-Resistant Multi-Wire Channel”, patent number 10,153,591, was issued December 11, 2018.

“Our research and development teams continue to innovate new architectures and implementations for high-speed SerDes,” said Amin Shokrollahi, Founder and CEO of Kandou. “This milestone is a fantastic achievement by the Kandou Engineering team and represents outstanding creativity and best-in-class circuit implementations that will provide a roadmap for extending the life of copper interconnect for several generations.”

Learn more about : Kandou's 500Gb/s Throughput SerDes

Kandou maintains a large portfolio of patents and claims across multiple families addressing many aspects of high speed, low power SerDes.

Chord Signaling

Kandou’s patented technology is manifested in its Chord™ signaling architecture which is a generalization of differential signaling. While differential signaling delivers one bit on two correlated wires, Chord signaling delivers n bits on n+1 correlated wires. The combination of the signaling on the wires and the comparators that are used to identify the bits are together called a “chordal chord”.

This new signaling technology can provide 2-4X bandwidth of conventional SerDes technologies at half or less the total power consumption, enabling new system architectures for products ranging from mobile devices to hyperscale datacenters, artificial intelligence and machine learning.

About Kandou

Bandwidth and power challenges for next-generation links are being addressed by the industry’s leading standards development organizations such as the OIF, IEEE and JEDEC. Kandou advocates for industry standards, contributing its technology and support via membership and board positions within these organizations.

Headquartered in Lausanne, Switzerland and founded in 2011, with design centers in Switzerland, the UK and Germany, Kandou Bus is an innovative interface technology company specializing in the invention, design, license and implementation of industry leading chip-to-chip link solutions. Kandou’s Chord™ signaling is a disruptive interconnect technology that lowers the power consumption and improves the performance of semiconductors, unlocking new capabilities in electronic devices and systems. http://www.kandou.com.

Kandou Announces 100th Patent Grant by U.S. Patent Office


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