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- Arasan Announces the Immediate Availability of its 2nd Generation MIPI D-PHY v1.1 IP for TSMC 22nm Process Technology (Jan 14, 2021)
- Semiconductor Industry: Continuous Semiconductor Supply Shortage (Jan. 14, 2021)
- Ginger Lee Named Chief Financial Officer for Palma Ceia SemiDesign (Jan 14, 2021)
- Intel Appoints Tech Industry Leader Pat Gelsinger as New CEO (Jan 14, 2021)
- BeagleBoard.org and Seeed Introduce the First Affordable RISC-V Board Designed to Run Linux (Jan 14, 2021)
- TSMC Reports Fourth Quarter EPS of NT$5.51 (Jan 14, 2021)
- Chips&Media Adds Extraordinary Features in the Next-Generation Video Codec IPs, introducing the WAVE6 Series (Jan 14, 2021)
- Gartner Says Worldwide Semiconductor Revenue Grew 7.3% in 2020 (Jan 14, 2021)
- Andes Technology and Rafael Microelectronics Announce a Strategic Partnership to Provide High Power Efficiency Wireless IP Solutions for IoT Devices (Jan 14, 2021)
- TSMC to Kick off Mass Production of Intel CPUs in 2H21 as Intel Shifts its CPU Manufacturing Strategies, Says TrendForce (Jan 14, 2021)
- Qualcomm to Acquire NUVIA (Jan 14, 2021)
- Jim Keller joins Tenstorrent as President and CTO. (Jan 14, 2021)
- Value of Semiconductor Industry M&A Agreements Sets Record in 2020 (Jan 13, 2021)
- Arm's powerful compute and graphics platform at the heart of the new Samsung Exynos 2100 (Jan 13, 2021)
- Netflix Now Streaming xHE-AAC Audio on Android Mobile (Jan 13, 2021)
- Syntiant Surpasses Milestone of 10 Million Processors Shipped (Jan 13, 2021)
- SOI Industry Consortium Joins SEMI as Strategic Association Partner (Jan. 13, 2021)
- AMD's Xilinx Acquisition Moves Forward As Regulatory Waiting Period Expires (Jan. 13, 2021)
- Alibaba, Tencent and Baidu spared from US investor blacklist (Jan. 13, 2021)
- Synopsys and Socionext Expand Collaboration to Deploy HBM2E IP for 5-Nanometer Process in AI and High-Performance Computing SoCs (Jan 12, 2021)
- Arteris IP FlexNoc Interconnect and Resilience Package Licensed by Hailo for Artificial Intelligence (AI) Chip (Jan 12, 2021)
- Secure-IC And Menta Co-Develop Solution To Optimize Embedded Cybersecurity (Jan 12, 2021)
- CEVA Extends its Leadership in High Performance Scalable Sensor Hub DSPs with 2nd Generation SensPro Family (Jan 12, 2021)
- SEGGER introduces new Open Flashloader for direct programming of any RISC-V system (Jan 12, 2021)
- Flex Logix Appoints Dana McCarty as Vice President of Sales and Marketing for AI Inference Products (Jan 11, 2021)
- ESD Alliance Reports Strong Electronic Design Automation Industry Revenue Growth for Q3 2020 (Jan 11, 2021)
- Official Commercial Launch of Efficiera Ultra-Low Power AI Inference Accelerator IP Core (Jan 11, 2021)
- DSP Concepts and Cambridge Consultants work to accelerate audio and voice innovation (Jan 11, 2021)
- Wi-Fi Alliance Wi-Fi predictions for 2021 (Jan 11, 2021)
- Ambarella introduces CV5 high performance AI vision processor for single 8K and multi-imager AI cameras (Jan 11, 2021)
- UMC Reports Sales for December 2020 (Jan 08, 2021)
- Achronix to List on Nasdaq Through Merger with ACE Convergence (Jan 08, 2021)
- TSMC December 2020 Revenue Report (Jan 08, 2021)
- 6GHz for Wi-Fi or 5G? And the Winner is... (Jan. 07, 2021)
- China Forecast to Fall Far Short of its "Made in China 2025" Goals for ICs (Jan 07, 2021)
- Andes Technology Provides RISC-V CPU Core to SK Telecom (Jan 07, 2021)
- Syntiant Introduces Second Generation NDP120 Deep Learning Processor for Audio and Sensor Apps (Jan 07, 2021)
- DSP Group Unveils DBM10 Low-Power Edge AI/ML SoC with Dedicated Neural Network Inference Processor (Jan 07, 2021)
- Kevin Steptoe Joins Palma Ceia SemiDesign as EVP Program Management (Jan 07, 2021)
- GUC Monthly Sales Report - Dec 2020 (Jan 06, 2021)
- More HDMI 2.1 Enabled Products Reach The Market Bringing Advanced Consumer Entertainment Features To a Wide Audience (Jan 06, 2021)
- Achronix in talks to IPO (Jan 06, 2021)
- Industry Veterans Cathal Phelan, John Kent, and Michael Reiha Join Silvaco Technical Advisory Board (Jan 06, 2021)
- Edgewater Announces New Funding and Organizational Changes (Jan 06, 2021)
- Sequans Introduces Calliope 2: A New Generation of LTE Cat 1 Technology for IoT Applications Requiring Higher Than LTE-M Speed (Jan 06, 2021)
- Imagination, update on 2020 progress (Jan 06, 2021)
- CFX announces commercial availability of anti-fuse OTP technology on 90nm BCD process (Jan 06, 2021)
- Semiconductor Industry: Expect Record-high Foundry Investment in 2021 (Jan. 06, 2021)
- IQ-Analog Antenna Processor ASIC Powers Lockheed Martin Phased Array Sensors (Jan. 06, 2021)
- UK competition authority to investigate Arm-Nvidia deal (Jan. 06, 2021)
- CEVA and DARPA Establish Partnership for Technology Innovation (Jan 05, 2021)
- Arteris IP FlexNoC Interconnect and Resilience Package Licensed by MegaChips for Automotive Ethernet TSN Switch Chip (Jan 05, 2021)
- Global Smartphone Production Expected to Reach 1.36 Billion Units in 2021 as Huawei Drops Out of Top-Six Ranking, Says TrendForce (Jan 05, 2021)
- EPS Global and Intrinsic-ID Announce Strategic Partnership (Jan 05, 2021)
- Where Are GPUs Headed in 2021? (Jan. 05, 2021)
- EU Hexa-X Project Gets €12m to Develop 6G Vision (Jan. 05, 2021)
- SMIC gains a rise in their share value (Jan. 05, 2021)
- Greek IP company Adveos bought by Shanghai-based Beken (Jan 04, 2021)
- OmniVision Announces World's First Dedicated Driver Monitoring System ASIC With Integrated AI Neural Processing Unit, Image Signal Processor and DDR3 Memory (Jan 04, 2021)
- Global Semiconductor Sales Increase 7 Percent Year-to-Year in November (Jan 04, 2021)
- Edge AI: Energy-saving "building blocks" for smart end devices (Jan. 04, 2021)
- 4D Imaging Radar Looks to Advance ADAS and Level 5 Automation (Jan. 04, 2021)
- GaN Devices in LiDAR System Design (Jan. 04, 2021)
- TSMC and Samsung to face major issues in the development of 3nm (Jan. 02, 2021)
- TSMC, other foundries' revenue expected to reach new high in 2021 (Dec. 31, 2020)
- Foundry Revenue Expected to Reach New High in 2021 (Dec. 30, 2020)
- Prospects for the Semiconductor Industry in the Post-COVID Era (Dec. 30, 2020)
- Fabless Company Share of IC Sales to Set New Record in 2020 at 32.9% (Dec 29, 2020)
- Foundry Revenue Expected to Reach New High in 2021 with Close to 6% YoY Growth as Capacities Remain Scarce Across Industry, Says TrendForce (Dec 29, 2020)
- Graphcore raises $222 million in Series E Funding Round (Dec 29, 2020)
- Why the next 10 years may belong to ARM (Dec. 29, 2020)
- Advanced Packaging For More-than-Moore Era (Dec. 28, 2020)
- Wave Computing and MIPS Technologies Reach Agreement to Exit Bankruptcy (Dec. 28, 2020)
- United States, Europe and China Leading AI Development (Dec. 24, 2020)
- Chip Startups are Gaining Traction in Auto Industry (Dec. 24, 2020)
- New iPhone Models Become Key to Qualcomm's Top Spot in 3Q20 Revenue Ranking of Global Top 10 IC Design (Fabless) Companies, Says TrendForce (Dec 23, 2020)
- North American Semiconductor Equipment Industry Posts November 2020 Billings (Dec 23, 2020)
- WiLAN Subsidiary Acquires Substantial Patent Portfolio from MediaTek (Dec 23, 2020)
- iWave Unveils the Implementation of ARINC 818-2 IP Core On Microsemi PolarFire FPGA (Dec 23, 2020)
- Top deals in 2020 (Dec. 22, 2020)
- Creonic Participates in Horizon 2020 EPIC Research Project (Dec 21, 2020)
- MosChip Technologies Achieves ISO 9001:2015 Certification (Dec 21, 2020)
- Retune DSP's Wake Word Engine Now Available for CEVA Audio/Voice DSPs (Dec 21, 2020)
- Rianta Releases AES Crypto and HMAC Acceleration ASIC IP Cores (Dec 21, 2020)
- Secure-IC announces the availability of its protection technologies in the cloud (Dec 18, 2020)
- Latest Release of Lattice sensAI Solutions Stack Delivers up to 6X Performance Boost on Award-Winning CrossLink-NX FPGAs (Dec 18, 2020)
- What To Expect From the IC Industry in 2021 (Dec 18, 2020)
- SMIC Undergoes Management Team Shakeup – Again (Dec. 18, 2020)
- CEA-Leti Scientists Present In-Memory Computing Pathways for Edge-AI & Neural Networks with 3D Architectures & Resistive-RAM (Dec. 18, 2020)
- Global semiconductor shortage puts pressure on tech supply chain (Dec. 18, 2020)
- Samsung Foundry Certifies Cadence System Analysis and Advanced Packaging Design Tool Flow for 2.5/3D Chip Designs (Dec 17, 2020)
- Probing the Apple M1's Hidden Depths (Dec 17, 2020)
- SMIC Management Team Undergoes Shakeup - Yet Again (Dec 17, 2020)
- AccelerComm join the O-RAN ALLIANCE to improve interoperability and maximize spectral efficiency (Dec 17, 2020)
- Nimbix Announces First Multi-cloud HPC Platform With Support For Arm (Dec 17, 2020)
- Mentor Finally Becomes Siemens EDA From January 2021 (Dec 17, 2020)
- Andes Technology Passes DUNS Registered Certificate (Dec 17, 2020)
- Xiphera contributes to Linux kernel (Dec 17, 2020)
- AWS Deploys Synopsys VCS on Arm-based AWS Graviton2 to Accelerate SoC Development (Dec 17, 2020)
- IAR Systems enables Linux-based Continuous Integration and automated workflows for RISC-V (Dec 17, 2020)
- SK Hynix's Foundry in China Starts Volume Production (Dec. 17, 2020)
- France awards Soitec-led European consortium for semiconductor innovation (Dec. 17, 2020)
- 5 Companies Owned by Nvidia (Dec. 17, 2020)
- Sofics and Hardent join Mixel's MIPI ecosystem to provide designers a complete MIPI solution (Dec 16, 2020)
- UVM Reference Implementation Aligned with IEEE 1800.2-2020 Standard (Dec 16, 2020)
- Vulkan SDK, Tools and Drivers are Ray Tracing Ready (Dec 16, 2020)
- AIStorm Raises $16M in Oversubscribed Series B Funding to Commercialize AI-in-Sensor Chips (Dec 16, 2020)
- The Electric Vehicles Are Coming! (Dec. 16, 2020)
- China's No 1 chipmaker SMIC gives ex-TSMC veteran top role, highlighting need for pragmatism amid push for home-grown tech (Dec. 16, 2020)
- Eta Compute Closes $12.5 Million Series C Funding Led By Synaptics (Dec 15, 2020)
- Xenergic's SRAM For Next Generation Of Ultra-Low Power Products (Dec 15, 2020)
- CEA Combines 3D Integration Technologies & Manycore Architectures to Enable High-Performance Processors for Exascale (Dec. 15, 2020)
- Platform combines low-power SoC with energy-efficient AI software (Dec. 15, 2020)
- SensiML Introduces Free Community Edition of Analytics Toolkit (Dec. 15, 2020)
- Telechips selects the latest Arm IP for its next-generation automotive SoC (Dec 14, 2020)
- Blaize Delivers First Open and Code-free AI Software Platform Spanning the Entire Edge AI Application Lifecycle (Dec 14, 2020)
- Lattice Propel Accelerates Time-to-Market for Embedded Processor-based Designs on Latest Nexus Platform FPGAs (Dec 14, 2020)
- Nextera Video and Adeas Announce SDI Core, SMPTE ST 2022-8, and NMOS IS-09 as the Latest Additions to their Industry-Leading SMPTE ST 2110 Video over IP FPGA Core Set (Dec 14, 2020)
- Cartesiam Transforms Edge AI Development for Industrial IoT (Dec 14, 2020)
- Synthara targets breakthrough edge-AI chips with support from a global coalition of investors and R&D partners (Dec 14, 2020)
- CORE-v CVE4 RTL Freeze Milestone Achieved (Dec 14, 2020)
- Mass production of CoreHW RF Switch has started (Dec 14, 2020)
- Omni Design Augments Partnership to Accelerate Product Development (Dec 14, 2020)
- Time holds the key to 6G (Dec. 14, 2020)
- Mentor changes its name to Siemens EDA (Dec. 14, 2020)
- RISC-V And Marvell Technologies Advances Enable Storage Solutions (Dec. 14, 2020)
- Redtree Solutions offers Agile Analog IP across Europe (Dec. 14, 2020)
- CAST JPEG IP Cores Deliver Outstanding Results in the New High Resolution LXT Cameras by Baumer (Dec 11, 2020)
- Daiteq Selected as the First ESA NOEL-V User (Dec 11, 2020)
- The DDR5 Revolution: Promise & Challenges Ahead (Dec. 11, 2020)
- Can China Become Self-reliant in Semiconductors? (Dec. 11, 2020)
- Renesas Strengthens IP License Portfolio with IP Utilities to Facilitate Device Development (Dec 10, 2020)
- Green Hills Software Adds RTOS Support to Its Extensive Product Portfolio for RISC-V-based SoCs (Dec 10, 2020)
- eMemory & PUFsecurity Announce with UMC the World's First PUF-based Secure Embedded Flash Solution (Dec 10, 2020)
- Foundry Capex to Account for 34% of Total Semi Capex in 2020 (Dec 10, 2020)
- Imperas releases new RISC-V Processor Verification IP to drive RISC-V adoption forward with a flexible methodology for all SoC adopters (Dec 10, 2020)
- Achronix Announces Appointment of Mark Voll as New Chief Financial Officer (Dec 10, 2020)
- TSMC November 2020 Revenue Report (Dec 10, 2020)
- Cobham Advanced Electronic Solutions Introduces Support for Wind River VxWorks RTOS for NOEL-V Processor (Dec 10, 2020)
- JEDEC Advances Universal Flash Storage (UFS) Removable Card Standard 3.0 (Dec 09, 2020)
- BrainChip Ships Akida Evaluation Boards (Dec 09, 2020)
- CHIPS Alliance to Collaborate with RISC-V to Standardize an Open Unified Memory Leveraging OmniXtend (Dec 09, 2020)
- Silicon Labs selects Imperas RISC-V Reference Model for verification (Dec 09, 2020)
- Cobham Advanced Electronic Solutions Offers RISC-V Support for Microchip Technology's PolarFire FPGA Devices (Dec 09, 2020)
- Lattice Launches 2nd Generation Security Solution with New Mach-NX FPGA for Next Generation, Cyber-Resilient Systems (Dec 09, 2020)
- Seagate Designs RISC-V Cores to Power Data Mobility and Trustworthiness (Dec 09, 2020)
- Attopsemi Achieves ISO 9001 Certification for IP Quality Management System (Dec 09, 2020)
- Veriest and Kudelski IoT collaborate to accelerate the integration of highly robust silicon security features in IC designs (Dec 09, 2020)
- Silvaco and OPENEDGES Announce Availability of Integrated DDR Controller and PHY IP Solutions (Dec 09, 2020)
- Renesas Extends Arm Cortex-Based MCU Family with RA4M3 MCU Group for Industrial and IoT Applications (Dec 09, 2020)
- AImotive Deploys Synopsys VCS to Verify Next-Generation Automated Driving Technologies (Dec 09, 2020)
- Think Silicon Announces a New Scalable Multi-Core GPU Product Suite with Extended Graphics and Video Functionality (Dec 09, 2020)
- RISC-V International Reports Another Strong Year of Growth with New Technical Milestones, Educational Programs, RISC-V Adoption and More (Dec 09, 2020)
- TSMC wins 2021 IEEE Corporate Innovation Award (Dec. 09, 2020)
- SmartDV Announces New Line of Design IP Controllers for High-Speed Communications (Dec 09, 2020)
- Cobham Gaisler and fentISS Deepen Collaboration around RISC-V (Dec 09, 2020)
- Nvidia has one surprising new rival: the world's largest storage vendor (Dec. 09, 2020)
- Neoverse expands further into cloud with new network-optimized instances at AWS re:Invent (Dec 08, 2020)
- Menta eFPGA and Codasip Announce Technology Partnership (Dec 08, 2020)
- C-DAC Selects Valtrix STING For Design Verification Of RISC-V Based Microprocessors (Dec 08, 2020)
- 100G Lambda MSA Announces Release of New Specifications for Longer Reach 100 GbE over Single-Mode Fiber (Dec 08, 2020)
- OneSpin Contributes to the OpenHW Ecosystem to Achieve Processor Integrity for the CORE-V CVE4 Open-Source RISC-V Cores (Dec 08, 2020)
- Menta and Andes Announce Partnership Enabling Hardware Reconfiguring for ISA Extension (Dec 08, 2020)
- UMC Reports Sales for November 2020 (Dec 08, 2020)
- Codasip announces three new RISC-V Application Processor Cores providing Multi-core and SIMD capability (Dec 08, 2020)
- Vidatronic Appoints Carnyx Consulting as Its Representative for European Markets (Dec 08, 2020)
- Samsung Foundry Adopts Spectre X Simulator for 5nm Design (Dec. 08, 2020)
- UMC to become world's No. 3 foundry: researcher (Dec. 08, 2020)
- Top 10 Foundry Revenues Expected to Increase by 18% YoY in 4Q20 (Dec. 08, 2020)
- TSMC's market cap rises to 9th highest in world (Dec. 08, 2020)
- Announcement of SMIC (Dec 07, 2020)
- Porting PikeOS to NOEL-V and LEON: SYSGO and Cobham Gaisler Extend Cooperation around RISC-V (Dec 07, 2020)
- DRAM Leads in Revenue, NAND With Top Percentage Growth in 2020 (Dec 07, 2020)
- GUC Monthly Sales Report - Nov 2020 (Dec 07, 2020)
- Dolphin Design unveil a new and improved version of its Power Controller IP - MAESTRO - to speed-up energy-efficient SoC design (Dec 07, 2020)
- OpenFive Licenses Flex Logix's eFPGA to Develop a Low Power Communications SoC Requiring a Large eFPGA (Dec 07, 2020)
- China's Semiconductor Progress to Be Impacted Once Again as SMIC Becomes Sanctioned by U.S. Department of Defense, Says TrendForce (Dec 07, 2020)
- Total Revenue of Top 10 Foundries Expected to Increase by 18% YoY in 4Q20 While UMC Overtakes GlobalFoundries for Third Place, Says TrendForce (Dec 07, 2020)
- Imperas Extends free riscvOVPsimPlus Simulator for RISC-V (Dec 07, 2020)
- U.S. Blacklisting SMIC of China Expected to Reverberate around Korean Foundry Industry (Dec. 07, 2020)
- Codasip announces three new RISC?V Application Processor Cores providing Multi-core and SIMD capability (Dec 04, 2020)
- intoPIX delivers its new full stack of TICO-RAW solutions improving RAW image workflows and camera designs (Dec 04, 2020)
- CFX announces commercial availability of anti-fuse OTP technology on Silterra I11L process (Dec 04, 2020)
- Chip Startups are Succeeding with Silicon Catalyst and Partners Like Arm (Dec. 04, 2020)
- Alibaba-Backed Media AI Firm Finds Innovative Applications (Dec. 03, 2020)
- Synopsys Posts Financial Results for Fourth Quarter and Fiscal Year 2020 (Dec 03, 2020)
- BrainChip Confirms Completion of the Akida Production Design (Dec 03, 2020)
- Embeetle and GigaDevice collaborate to bring a new powerful and simple IDE to ARM and RISC-V based MCUs (Dec 03, 2020)
- Andes RISC-V Vector Processor NX27V Is Upgraded to RVV 1.0 (Dec 03, 2020)
- Imec Demonstrates Capacitor-less IGZO-Based DRAM Cell With >400s Retention Time (Dec 03, 2020)
- Rockley Photonics Collaborates with Cadence to Create a High-Performance System for Hyperscale Data Centers (Dec 03, 2020)
- Faster, Smaller and More Accurate Edge AI Using Deeplite and Andes Technology Software + Hardware (Dec 03, 2020)
- Imperas Simulator Supports Andes Custom Extension to Accelerate Software Development in Domain Specific Applications (Dec 03, 2020)
- Can IBM Ecosystem Advance AI Chip Performance 1000x? (Dec 03, 2020)
- Third-Quarter 2020 Global Semiconductor Equipment Billings Surge 30% Year-Over-Year, SEMI Reports (Dec 03, 2020)
- Esperanto Technologies to Reveal Chip with 1000+ Cores at RISC-V Summit (Dec 03, 2020)
- IAR Systems and GigaDevice extend partnership with powerful Arm solutions (Dec 03, 2020)
- Synopsys and Samsung Foundry Collaborate to Deliver Fastest Design Closure and Signoff for Process Nodes Down to 3nm (Dec 03, 2020)
- RISC-V for ultra-low power processing and AI on the edge (Dec. 03, 2020)
- PCIe Gen5 & PCIe Gen4 Phy IP available in TSMC 12FFC (Dec 02, 2020)
- Mobiveil Announces Compute Express Link (CXL) 2.0 Design IP, Successful Completion of CXL 1.1 Validation with Intel's CXL Host Platform (Dec 02, 2020)
- 64-bit RISC-V Core Claims to Outperform Apple M1 SoC (Dec. 02, 2020)
- Xilinx Acquires Assets of Falcon Computing Solutions to Advance Software Programmability and Expand Developer Community (Dec 01, 2020)
- Faraday Leads Industry to Adopt TCFD Framework for Corporate Sustainability (Dec 01, 2020)
- PLDA Announces the Successful CXL Interoperability with pre-production Intel Xeon CPU, Code Named Sapphire Rapids (Dec 01, 2020)
- Secure-IC Announces U.S. Subsidiary Opening (Dec 01, 2020)
- Bluetooth RF Transceiver Phy KGD for adding Bluetooth Connectivity to "any SoC" (Dec 01, 2020)
- Imagination hires Tim Whitfield as new Chief of Engineering (Dec 01, 2020)
- Infineon to set up global AI hub in Singapore (Dec. 01, 2020)
- China a step closer to microchip independence (Dec. 01, 2020)
- China's AI unicorns reveal fatal flaw in rush to go public (Dec. 01, 2020)
- Arteris IP Completes Acquisition of Magillem Design Services Assets, Creating World's Premier System-on-Chip Integration Company (Nov 30, 2020)
- BrainChip Appoints Geoffrey Carrick as Non-Executive Director (Nov 30, 2020)
- Xiphera announces FPGA-based TLS 1.3 IP core for mission-critical applications (Nov 30, 2020)
- Nordic Semiconductor expands into Wi-Fi by acquiring the entire Wi-Fi development team, core Wi-Fi expertise, and Wi-Fi IP tech assets of Imagination Technologies Group (Nov 30, 2020)
- Imagination sells Ensigma Wi-Fi technology to Nordic Semiconductor (Nov 30, 2020)
- Broadcom Debuts Industry's First 5nm ASIC for Data Center and Cloud Infrastructure (Nov 30, 2020)
- Andes Announces New RISC-V Processors: Superscalar 45-Series with Multi-core Support and 27-Series with Level-2 Cache Controller (Nov 30, 2020)
- TSMC To Fall Behind Both Intel, Samsung By 2024 (Nov. 30, 2020)
- RF-SOI Engineered Substrates at the Heart of Modern RF mmWave Front-ends (Nov. 30, 2020)
- Samsung Electronics Squaring Off with TSMC in Packaging Technology (Nov. 30, 2020)
- IO and multiprotocol processing in highly demanding embedded architectures (Nov. 30, 2020)
- TSMC confirms 3nm tech for 2022, could enable epic 80 billion transistor GPUs (Nov. 27, 2020)
- China moves closer to self-reliance in 7nm chip production (Nov. 27, 2020)
- The Growing Market for Specialized Artificial Intelligence IP in SoCs (Nov. 26, 2020)
- Innatera raises EUR 5M to bring neuromorphic intelligence to the sensor-edge (Nov 26, 2020)
- Faraday Supplies 28eHV Memory Compilers for Mobile OLED Display Driver IC (Nov 26, 2020)
- intoPIX demos newest compression technologies shaping the future of lossless quality wired/wireless transmission : 4K/8K JPEG XS, TICO-RAW and FlinQ - lowest latency & power, highest quality (Nov 26, 2020)
- IAR Systems delivers extended optimization and trace capabilities for RISC-V development (Nov 26, 2020)
- intoPIX demos newest compression technologies shaping the future of lossless quality wired/wireless transmission: 4K/8K JPEG XS, TICO-RAW and FlinQ - lowest latency & power, highest quality (Nov 26, 2020)
- SMIC gets massive orders- customer demand is strong (Nov. 26, 2020)
- Gyrfalcon Launches AI-X: Full-Stack Solution for Edge-AI Development (Nov 25, 2020)
- TSMC's 3 nm plant in southern Taiwan reaches construction milestone (Nov. 25, 2020)
- China to spend $165bn on 5G (Nov. 25, 2020)
- proteanTecs CEO to present Universal Chip Telemetry™ at the Taiwan Semiconductor Executive Summit (TSES) (Nov. 25, 2020)
- SK Telecom develops AI processor (Nov. 25, 2020)
- TSMC adopts 3D stacking tech for chips along with Google and AMD (Nov. 25, 2020)
- Intel to Keep Its Number One Semiconductor Supplier Ranking in 2020 (Nov 24, 2020)
- Taiwan Semiconductor Research Institute signs access deal with Arm (Nov. 24, 2020)
- 3 Basic Facts About Automotive Sensor Degradation (Nov. 24, 2020)
- 5G and eSIM technologies will help grow industrial IoT connections to 37b by 2025 (Nov. 24, 2020)
- IRIS Switzerland Adopts Silvaco TCAD Software for the Development of Photodiodes for Autonomous Driving Applications (Nov. 24, 2020)
- CEVA's Bluetooth Low Energy 5.2 Platform is First IP to Receive Bluetooth SIG Qualification (Nov 23, 2020)
- China TSMC Rival HSMC Runs Out of Cash, Ex-CEO Says (Nov 23, 2020)
- Audio Weaver + TalkTo reference design now available on Qualcomm QCS400 series of audio System-on-Chips (SoCs) (Nov 23, 2020)
- North American Semiconductor Equipment Industry Posts October 2020 Billings (Nov 23, 2020)
- Mythic launches industry-first AI analog matrix processor (Nov 23, 2020)
- Beyond 5G – Is it time to start thinking about 6G? (Nov. 23, 2020)
- AI Accelerator Targets Video Analytics at the Edge (Nov. 23, 2020)
- U.S.-Taiwan dialogue prioritizes cooperation in semiconductor sector (Nov. 22, 2020)
- Wi-Fi HaLow Reference Platform Available from Palma Ceia SemiDesign (Nov 20, 2020)
- Coventor and CMC Microsystems expand collaboration to further enable innovation in semiconductor and microsystem technology development (Nov. 20, 2020)
- Mentor joins Nano 2022 R&D program to foster innovation in semiconductor design and verification (Nov 19, 2020)
- Secure Thingz supports next-generation Secure Install technologies for IP Protection and malware prevention (Nov 19, 2020)
- Ferroelectric Memory GmbH (FMC) Raises $20 Million to Accelerate Next-Generation Memory for AI, IoT, Edge Computing, and Data Center Applications (Nov 19, 2020)
- AI Startup Deep Vision Powers AI Innovation at the Edge (Nov 19, 2020)
- Xilinx Collaborates With Texas Instruments to Develop Energy Efficient 5G Radio Solutions (Nov 19, 2020)
- Arm Expands microNPU IP for Application Processors (Nov. 19, 2020)
- Synopsys Acquires Precision Optical Measurements Provider LIGHT TEC (Nov. 19, 2020)
- BrainChip Appoints Todd Vierra Director of Technical Sales (Nov 18, 2020)
- Bouffalo Lab Standardizes on SiFive RISC-V Embedded CPU Core IP for New IoT Products (Nov 18, 2020)
- Wafer Capacity by Feature Size Shows Strongest Growth at <10nm (Nov 18, 2020)
- First Intel Structured ASIC for 5G, AI, Cloud and Edge Announced (Nov 18, 2020)
- Fugaku Tops Supercomputer Rankings Again as Arm HPC Ecosystem Expands (Nov 18, 2020)
- Foundry Revenue Expected to Increase by 23.8% YoY in 2020, with Advanced Nodes and 8-Inch Capacities Being Key to Industry Competitiveness in 2021, Says TrendForce (Nov 18, 2020)
- Dialog launches partner programme for its open industrial IoT edge server (Nov. 18, 2020)
- Introducing new Arm Roadmap Guarantee and other Arm IoT initiatives for accelerating Endpoint AI (Nov. 18, 2020)
- SiMa.ai Adopts Arm Technology to Deliver a Purpose-built Heterogeneous Machine Learning Compute Platform for the Embedded Edge (Nov. 18, 2020)
- 18 New AI Startups in France in 2020 vs. 120 in 2019 (Nov. 18, 2020)
- Marvell Announces Industry's First 112G 5nm SerDes Solution for Scaling Cloud Data Center Infrastructure (Nov 17, 2020)
- Ultra-low power GNSS Multi-Constellation Digital IP Core licensed to a European Semiconductor company for battery powered IOT & Wearable applications (Nov 17, 2020)
- GUC Die-to-Die (D2D) Total Solution Opening the New Era of Flagship SoC (Nov 17, 2020)
- Kandou Raises $92.3 Million in Series C Funding (Nov 17, 2020)
- Arteris IP Achieves Major Milestone: 150th Licensee (Nov 17, 2020)
- NXP, AWS create cloud platform for vehicle data services (Nov. 17, 2020)
- Kandou can do more with $92.3 million (Nov. 17, 2020)
- NTLab joined Samsung Foundry IP Ecosystem (Nov. 17, 2020)
- Dialog Semiconductor Introduces SmartServer™ IoT Partner Ecosystem for Edge Solutions in Smart Buildings and Factories (Nov. 17, 2020)
- Lattice Expands Radiant Software Tool Capabilities (Nov 16, 2020)
- BrainChip Demonstrates How Its Akida Technology Is Delivering the Next-Generation of AI at the Edge at First-Ever AI Field Day (Nov 16, 2020)
- SimpleMachines, Inc. Debuts First-of-its-Kind High Performance Chip (Nov 16, 2020)
- Apple M1 Processor, Passing on the Chiplets (Nov 16, 2020)
- Alibaba's Ultra High-Performance Superscalar Processor - XuanTie910 (Nov. 16, 2020)
- First steps to European multicore RISC-V chip for space (Nov. 16, 2020)
- CEA-Leti, Intel Expand Collaboration on 3D Packaging (Nov. 12, 2020)
- Hyundai Embraces Nvidia for Future Fleet AI, IVI Services (Nov. 12, 2020)
- Solving the problem of growing ASIC respins (Nov. 12, 2020)
- Time-Sensitive Networking Market is Projected to Reach USD 1 Billion by 2026 (Nov. 12, 2020)
- Imagination launches multi-core IMG Series4 NNA - the ultimate AI accelerator delivering industry-disruptive performance for ADAS and autonomous driving (Nov 12, 2020)
- Faraday's 22nm Fundamental IP Adopted for Intelligent IoT Devices (Nov 12, 2020)
- Vidatronic Achieves up to 10X Speedup Using the Cadence Spectre X Simulator (Nov 12, 2020)
- Synopsys Acquires In-chip Monitoring Solutions Leader Moortec (Nov 12, 2020)
- CEVA's High-Performance DSP Solution to Power Renesas' Next-Generation Automotive SoC (Nov 12, 2020)
- Efinix Announces Trion Titanium Tapeout at TSMC 16 nm Process Node (Nov 12, 2020)
- De-RISC first anniversary, a H2020 project which will create the first RISC-V, fully European platform for space (Nov 12, 2020)
- Lattice Accelerates Development of Low Power FPGA-Based Custom Solutions with Lattice Design Group (Nov 12, 2020)
- CXL Consortium Releases Compute Express Link 2.0 Specification (Nov 12, 2020)
- Xilinx and Samsung Deliver Industry's First Adaptable Computational Storage Drives (Nov 12, 2020)
- Silvaco Acquires Memory Compiler Technology of Dolphin Design SAS (Nov 12, 2020)
- Google Partners with SkyWater and Efabless to Enable Open Source Manufacturing of Custom ASICs (Nov 12, 2020)
- Nestwave Recognized for IoT Innovation in 2020 Mobile Breakthrough Awards Program (Nov. 12, 2020)
- Advanced Packaging: Interview with Intel's Ramune Nagisetty (Nov. 11, 2020)
- TSMC October 2020 Revenue Report (Nov 11, 2020)
- Sound United Adds MPEG-H 3D Audio format to Denon & Marantz Home Theater Components (Nov. 11, 2020)
- CAST Releases MIPI I3C Basic Slave Controller IP Core (Nov 10, 2020)
- Silex Insight delivers state-of-the-art security features to the award-winning Secure Vault technology from Silicon Labs (Nov 10, 2020)
- Pinnacle Imaging Systems Announces Denali 3.0 ISP (Nov 10, 2020)
- Synopsys Announces Industry's First CXL 2.0 VIP Solution for Breakthrough SoC Performance (Nov 10, 2020)
- Graphcore leverages multiple Mentor technologies for its massive, second-generation AI platform (Nov 10, 2020)
- PLDA Announces CXL 2.0 Support in their XpressLINK Family of CXL Controller IP (Nov 10, 2020)
- Avery Design Debuts QEMU Virtual Host to SystemVerilog PCIe VIP HW-SW Co-simulation Solution for Pre-silicon System-level Simulation of NVMe SSD and PCIe Designs (Nov 10, 2020)
- Kameleon Security and Xilinx Collaborate on New Cybersecurity Solution for Servers, Cloud Computing and Data Centers (Nov. 10, 2020)
- TSMC to spend US$3.5b on Arizona subsidiary (Nov. 10, 2020)
- Korea's Semiconductor Exports to China Increasing (Nov. 10, 2020)
- European Processor Initiative: Second year of activities (Nov 09, 2020)
- UMC Reports Sales for October 2020 (Nov 09, 2020)
- Cadence Achieves Industry-First ASIL B(D) Compliance Certification for Automotive Radar, Lidar and V2X DSP IP (Nov 09, 2020)
- MosChip Technologies appoints Semiconductor Business Veteran, Swamy Irrinki As "Vice President of Marketing and Business Development" to Oversee and Drive Continued Business Growth (Nov 09, 2020)
- Learn the Latest on RISC-V and Vector Processing at All Six Andes Technology Corporation's Presentations at the 2020 RISC-V Summit (Nov 06, 2020)
- Driven by Accelerating Demand for Leading 5G RF Solutions, GLOBALFOUNDRIES and Soitec Announce RF-SOI Wafer Supply Agreement (Nov 06, 2020)
- CEVA SenslinQ Platform Wins 2020 ASPENCORE World Electronics Achievement Award (Nov 06, 2020)
- Open-Source RISC-V ISA Offers More (Nov. 06, 2020)
- 5G and Interconnect Are Pushing Innovations in Wireless (Nov. 05, 2020)
- CEVA, Inc. Announces Third Quarter 2020 Financial Results (Nov 05, 2020)
- eMemory NeoFuse IP Qualified on GLOBALFOUNDRIES Advanced High Voltage Platform for OLED Applications (Nov 05, 2020)
- PLDA XpressSWITCH IP for PCIe technology first ever switch soft IP to pass PCI-SIG's PCIe 4.0 compliance tests (Nov 05, 2020)
- New Wave Design and Verification Appoints New President (Nov 05, 2020)
- GUC Monthly Sales Report - Oct 2020 (Nov 05, 2020)
- Advanced packaging to have 31% CAGR 2019-25 (Nov. 05, 2020)
- 55 BCDLite Solution Positions GLOBALFOUNDRIES for Continued Leadership in Audio Amplifiers for Mobile Devices (Nov 04, 2020)
- Imagination's new BXS GPU enables automotive graphics in Texas Instruments processor family (Nov 04, 2020)
- Arteris IP FlexNoC Interconnect Products Licensed by Bosch for Multiple Automotive Chips (Nov 04, 2020)
- 28FDSOI "SoC White Box" SERDES & Controller IPs' are available for immediate licensing (Nov 04, 2020)
- Samsung Elec to fully employ 5-nano process to make own phones and others (Nov. 04, 2020)
- CEA-Leti today announced a new collaboration with Intel on advanced 3D and packaging technologies for processors to advance chip design. (Nov. 04, 2020)
- Telink TLSR9 Wireless Audio & IoT RISC-V SoC integrates RISC-V DSP/SIMD P-extension (Nov. 04, 2020)
- Arm has launched a CPU monster that will get Intel and AMD very worried (Nov. 04, 2020)
- How AI Impacts Memory & Interconnect Technology (Nov. 04, 2020)
- Virtual electronica: Focus on Technical Trends and Innovations (Nov. 04, 2020)
- Taiwan's TSMC begins hiring drive for its US foundry (Nov. 04, 2020)
- China to Expand Its Semiconductor Industry (Nov. 04, 2020)
- 300mm Fab Spending to Boom Through 2023 With Two Record Highs, SEMI Reports (Nov 04, 2020)
- Aldec Introduces Hardware Assisted RTL Simulation Acceleration for Microchip FPGA Designs (Nov 03, 2020)
- Inaccel announces record-breaking speed on facial detection test using an FPGA cluster (Nov 03, 2020)
- NeuLinker Licenses Codasip Bk5 and Studio for Powering Innovative AI and Blockchain Solutions (Nov 03, 2020)
- Rambus Reports Third Quarter 2020 Financial Results (Nov 03, 2020)
- Movellus Joins GLOBALFOUNDRIES Ecosystem Program, as Partner Providing Application-Optimized PLLs, DLLs, & Comprehensive Clocking Solutions (Nov 03, 2020)
- Xylon Announces a New Version of logiVIEW Multiview 3D Video Transformation Engine IP Core (Nov 03, 2020)
- Cadence Wins Four 2020 TSMC OIP Partner of the Year Awards (Nov 03, 2020)
- Rambus Announces New Stock Repurchase Program (Nov 03, 2020)
- Sondrel announces tape-out of its largest chip design (Nov 02, 2020)
- Q3 Global Semiconductor Sales Increase 11 Percent Compared to Q2 (Nov 02, 2020)
- Silicon Wafer Shipments Slip in Third Quarter 2020 but Strong for Year (Nov 02, 2020)
- Telink and Andes Announce the TLSR9 SoC with RISC-V Processor (Nov 02, 2020)
- SDR RF IP, 100MHz-2.6GHz, for ultra-low power applications from IoT, M2M to 5G available from T2MIP (Oct 29, 2020)
- Realtek Semiconductor Selects Allegro DVT's H.266/VVC Compliance Streams (Oct 29, 2020)
- Cadence Custom/AMS Flow Certified for the Samsung Foundry 3nm Advanced Process Technology for Early Design Starts (Oct 29, 2020)
- intoPIX releases a new range of 8K TICO-XS IP-cores supporting the JPEG XS standard (Oct 29, 2020)
- Mentor's High Density Advanced Packaging solution certified for Samsung Foundry's most advanced packaging process (Oct 29, 2020)
- Marvell to Acquire Inphi - Accelerating Growth and Leadership in Cloud and 5G Infrastructure (Oct 29, 2020)
- QuickLogic Joins Samsung SAFE IP Partner Program (Oct 29, 2020)
- Xilinx Introduces Breakthrough Zynq RFSoC DFE for Mass 5G Radio Deployments (Oct 28, 2020)
- Synopsys and Samsung Foundry Collaboration Delivers Optimized Reference Methodology for High-Performance Compute Designs (Oct 28, 2020)
- Flex Logix Announces Availability and Roadmap of InferX X1 Boards and Software Tools (Oct 28, 2020)
- Synopsys and Samsung Release Certified 3nm Gate-All-Around AMS Design Reference Flow for Early Design Starts (Oct 28, 2020)
- DRAM Price Erosion Expected Through the End of 2020 (Oct 28, 2020)
- Truechip Adds New Customer Shipments of Verification IPs For RISC-V Family Including TileLink (Oct 28, 2020)
- QuickLogic Announces the ArcticPro 3 eFPGA IP for Samsung 28FDS Process (Oct 28, 2020)
- Analog Bits Announces Analog IP Availability on Samsung Technologies (Oct 28, 2020)
- Floadia Raises 1.2 Billion Yen to Develop New Memory Technology That Can Be Disruptor in AI Edge Computing (Oct 28, 2020)
- Rambus IPsec Packet Engine Secures 5G Networking at 10 Gbps (Oct 28, 2020)
- Samsung Foundry Adopts Real Intent Meridian CDC for Clock Domain Crossing Sign-off (Oct. 28, 2020)
- World's fastest 64bit RISC-V core claims 5GHz speed (Oct. 28, 2020)
- Samsung and VeriSilicon Enable Blaize to Meet Aggressive Time-to-Market Goals for New AI Edge Processor (Oct. 28, 2020)
- What Can Taiwan's Semiconductor Industry Learn From Japan? (Oct. 28, 2020)
- AMD to Acquire Xilinx, Creating the Industry's High Performance Computing Leader (Oct 27, 2020)
- Cortus Announces the Opening of another New Design Centre in Meyreuil (France) (Oct 27, 2020)
- Mixel MIPI D-PHY IP Integrated Into Hercules Microelectronics Award-Winning FPGA/Processor (Oct 27, 2020)
- Synopsys Expands Portfolio of Automotive VDKs with Support for Infineon's AURIX TC4xx 32-bit Microcontroller Family (Oct 27, 2020)
- TSMC top patent applicant in Taiwan for sixth straight quarter (Oct. 27, 2020)
- Micro Magic, Inc. Unleashes World's Fastest RISC-V Core (Oct 26, 2020)
- Mentor receives 2020 TSMC OIP Partner of the Year awards for EDA solutions (Oct 26, 2020)
- Visit Vidatronic at the Virtual Samsung SAFE Forum on October 28th (Oct 26, 2020)
- Aldec's TySOM Family of Embedded System Development Solutions Now Supports Xilinx PYNQ (Python Productivity for Zynq) (Oct 26, 2020)
- EvoNexus and GLOBALFOUNDRIES Team to Accelerate Growth of Wireless and IoT Startups (Oct 26, 2020)
- Orthogone Technologies Reveals New Brand Identity, Sets 25% Growth Target for 2021 (Oct 26, 2020)
- Synopsys and Samsung Foundry Collaboration Delivers Portfolio of Optimized iPDKs and Methodologies for Advanced Custom Design (Oct 26, 2020)
- North American Semiconductor Equipment Industry Posts September 2020 Billings (Oct 26, 2020)
- GlobalFoundries Details Ambitious Technology Roadmap (Oct. 26, 2020)
- China Forecast to Represent 22% of the Foundry Market in 2020 (Oct. 26, 2020)
- Nvidia-Arm Deal a Boon for RISC-V? (Oct. 26, 2020)
- EvoNexus and GLOBALFOUNDRIES Team to Accelerate Growth of Wireless and IoT Startups (Oct. 26, 2020)
- TSMC Bets on HPC for Future Growth (Oct. 22, 2020)
- Synopsys Helps Advance IBM's Vision of 1,000 Times Improvement in AI Compute Performance during the Coming Decade (Oct 22, 2020)
- eMemory Receives 2020 TSMC OIP Partner of the Year Award for Embedded Memory IP (Oct 22, 2020)
- SmartDV Appoints Karthik Gopal as Asia General Manager (Oct 22, 2020)
- SmartDV to Exhibit at Virtual Samsung SAFE Forum 2020 with Portfolio of Design and Verification IP (Oct 22, 2020)
- M31 Technology Receives 2020 TSMC OIP Partner of the Year Award for Specialty Process IP (Oct 22, 2020)
- Arm partners with Mentor to offer complete verification service (Oct 22, 2020)
- PLDA demonstrates successful PCIe 5.0 Link Training at 32 GT/s with its PCIe 5.0 controller and Broadcom PHY (Oct 22, 2020)
- TSMC Sees HPC As Next Inflection Point (Oct 22, 2020)
- GlobalFoundries Offers Ambitious Tech Plans, While Eying an IPO (Oct 22, 2020)
- Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications (Oct 22, 2020)
- 6 Considerations for Integrating Sensors in Vehicles (Oct. 22, 2020)
- Silicon Creations Named 2020 TSMC OIP Partner of the Year for Analog / Mixed-Signal IP (Oct 21, 2020)
- Microchip Acquires High-Level Synthesis Tool Provider LegUp to Simplify Development of PolarFire FPGA-based Edge Compute Solutions (Oct 21, 2020)
- Faraday Brings Advanced Audio ASIC Solutions to the Music Entertainment Industry (Oct 21, 2020)
- IAR Systems brings functional safety tools to RISC-V with certification for IEC 61508 and ISO 26262 (Oct 21, 2020)
- TSMC Recognizes Synopsys Collaboration with Four OIP Partner of the Year Awards for IP and EDA Solutions (Oct 21, 2020)
- Arm Awarded TSMC OIP Partner of the Year Award for Processor IP for Six Years in a Row (Oct 21, 2020)
- Alphawave IP Receives Prestigious 2020 TSMC OIP Partner of the Year Award for High-Speed SerDes IP (Oct 21, 2020)
- Tenstorrent achieves best-in-class PPA and First-Pass Silicon Success for Datacenter AI Processor SoC with INVECAS advanced ASIC engineering capabilities (Oct. 21, 2020)
- Soitec reports FY'21 second quarter revenues (Oct. 21, 2020)
- SK hynix to Acquire Intel NAND Memory Business (Oct 20, 2020)
- TSMC Announces 2020 OIP Partner of the Year Awards for Excellence in Accelerating Silicon Innovation (Oct 20, 2020)
- Breakthrough Synopsys IC Validator Technologies Deliver Faster Physical Signoff Convergence (Oct 20, 2020)
- Flex Logix Announces Working Silicon Of Fastest And Most Efficient AI Edge Inference Chip (Oct 20, 2020)
- TSMC 12FFC silicon proven SERDES Phy IPs' for HDMI 2.1, PCIe Gen5, DDR4, USB 4 & MIPI Interfaces available immediately for your next SoC (Oct 20, 2020)
- Cadence Reports Third Quarter 2020 Financial Results (Oct 20, 2020)
- Codasip Announces a New Design Center in France (Oct 20, 2020)
- Taiwan Semiconductor's Technology Dominance And Its Impact On Customers And Suppliers (Oct. 20, 2020)
- Veridify Security Welcomes Happiest Minds as Systems Integrator Partner (Oct. 20, 2020)
- Chips&Media showcase at Samsung Foundry SAFE FORUM 2020 as an IP partner (Oct. 20, 2020)
- Sequitur Labs Joins NVIDIA Partner Network to Protect Critical IP at the Edge (Oct. 20, 2020)
- Latest NPU adds to Arm's AI Platform performance, applicability, and efficiency (Oct 19, 2020)
- Wipro to acquire Eximius Design, strengthens leadership in VLSI and systems design services (Oct 19, 2020)
- Synopsys Accelerates Power Electronics System Design with Virtual Prototyping Solution (Oct 19, 2020)
- Dialog Semiconductor Licenses its Non-Volatile Resistive RAM Technology to GLOBALFOUNDRIES for 22FDX Platform, Targeting IoT and AI (Oct 19, 2020)
- Dolphin Design's SPEED platforms receive the "Solar Impulse Efficient Solution" Label, rewarding profitable solutions that protect the environment. (Oct 19, 2020)
- Perforce Software Accelerates SoC Development With Methodics IPLM 3.0 Launch (Oct 19, 2020)
- GreenWaves Technologies Announces Next Generation GAP9 Hearables Platform Using GLOBALFOUNDRIES 22FDX Solution (Oct 19, 2020)
- 'Samsung set to win over TSMC in the end' (Oct. 19, 2020)
- riscvOVPsim gets Risc-V vector instructions (Oct. 19, 2020)
- Hardware Is Back, Says CEA-Leti's CEO (Oct. 19, 2020)
- TSMC revenue for 2020 to rise by 30% despite losing Huawei (Oct. 19, 2020)
- China is catching up: SMIC foundry is now able to produce 7 nm chips (Oct. 16, 2020)
- Industry's first security microcontrollers for a complete IoT lifecycle management solution (Oct. 15, 2020)
- JEDEC Announces Publication of JEDEC Module Sideband Bus (Oct 15, 2020)
- CSEM joins forces with GLOBALFOUNDRIES to deliver best-in-class Bluetooth Dual-Mode silicon IP for next generation portable audio (Oct 15, 2020)
- Xilinx and Spline.AI Develop X-Ray Classification Deep-Learning Model and Reference Design on AWS (Oct 15, 2020)
- GreenWaves Technologies Announces Next Generation GAP9 Hearables Platform Using GLOBALFOUNDRIES 22FDX Solution (Oct 15, 2020)
- GLOBALFOUNDRIES Accelerating Innovation in IoT and Wearables with Adaptive Body Bias Feature on 22FDX Platform (Oct 15, 2020)
- TSMC Reports Third Quarter EPS of NT$5.30 (Oct 15, 2020)
- Global Silicon Wafer Shipments on Track for 2020 Recovery and 2022 Record High, SEMI Reports (Oct 15, 2020)
- TriEye Shortens Time to Market for Next-Generation CMOS-Based SWIR Image Sensors with the Cadence Spectre X Simulator (Oct 14, 2020)
- China Forecast to Represent 22% of the Foundry Market in 2020 (Oct 14, 2020)
- Chinese chipmaker SMIC makes breakthrough in '7nm-like process' (Oct. 14, 2020)
- Lattice Semiconductor Wins Two Medals at 2020 LEAP Awards (Oct. 14, 2020)
- How will artificial intelligence impact automotive IP protection strategies? (Oct. 14, 2020)
- Synopsys and SiMa.ai Collaborate to Bring Machine Learning Inference at Scale to the Embedded Edge (Oct 14, 2020)
- Synopsys and Samsung Foundry Announce Reference Flow for Predictable Execution of ASIL D-Compliant SoC Design for Automotive Applications (Oct 14, 2020)
- Synopsys Names Shankar Krishnamoorthy General Manager of the Digital Design Group (Oct 13, 2020)
- OPENEDGES AI Accelerator (NPU) & Memory Subsystem IP licensed for Eyenix AI-powered surveillance camera chipset (Oct 13, 2020)
- MIPI Alliance and IEEE Sign Agreement to Bring Automotive SerDes Standard to Broader Ecosystem (Oct 13, 2020)
- Synopsys to Enable New Levels of Insight into SoC Designs and Systems with Industry's First Silicon Lifecycle Management Platform (Oct 13, 2020)
- New Cadence Clarity 3D Transient Solver Delivers Up to 10X Faster System-Level EMI Simulation (Oct 13, 2020)
- Cadence Brings Verification IP to the Chip Level with New System VIP Solution (Oct 13, 2020)
- Imagination launches IMG B-Series: Doing more with multi-core (Oct 13, 2020)
- Innosilicon selects Imagination's new BXT Multi-Core GPU IP for cloud computing (Oct 13, 2020)
- Innosilicon Achieves World-First Tapeout Success on SMIC N+1 Process (Oct 13, 2020)
- Synopsys Demonstrates Industry's First PCI Express 5.0 IP Interoperability with Intel's Future Xeon Scalable Processor (Oct 13, 2020)
- Arteris IP FlexNoC Interconnect Again Licensed by KYOCERA for Enterprise Printing and Imaging Solutions (Oct 13, 2020)
- NVIDIA Reportedly Moving Ampere to 7 nm TSMC in 2021 (Oct. 13, 2020)
- Imagination extends mobile GPUs to automotive and data centres with 6Tflop B-Series (Oct. 13, 2020)
- South Korea pushes for AI semiconductors as global demand grows (Oct. 13, 2020)
- intoPIX Ships v2.0 of FastTICO-XS SDK for x86-64 CPU platforms to speed up JPEG-XS workflows (Oct 12, 2020)
- AMD Reported to Be Negotiating Purchase of Xilinx (Oct 12, 2020)
- Synopsys IC Compiler II Delivers First-Pass Silicon Success for Graphcore's Multi-Billion Gate AI Processor (Oct 12, 2020)
- AMD-Xilinx Deal: Bringing The Fight To The Data Center (Oct 12, 2020)
- Cadence Pegasus Verification System Certified for TSMC N16, N12 and N7 Process Technologies (Oct 12, 2020)
- Numem Selected by NASA for 'DNN Radiation Hardened Co-Processor Companion Chip to NASA's Upcoming High-Performance Spaceflight Computing Processor' (Oct 12, 2020)
- Visit Vidatronic at the Virtual GLOBALFOUNDRIES Technology Conference (GTC) - EMEA on October 16th (Oct 12, 2020)
- Attend Andes Technology's Presentation "A RISC-V Out-of-Order Processor" at the Linley Processor Conference (Oct 12, 2020)
- AMD and Xilinx: A Match Made in Silicon Valley? (Oct 12, 2020)
- Menta Appoints ETSI as United States East Coast Representative (Oct 12, 2020)
- Arm co-founder: Nvidia takeover would create another US tech monopoly (Oct. 12, 2020)
- Imec presents alternative metals in advanced interconnect and contact schemes as a path to 2nm technology nodes (Oct. 09, 2020)
- Cadence Announces Complete DDR5/LPDDR5 IP Solution for TSMC N5 Process Technology (Oct 08, 2020)
- Think Silicon to introduce a new Inference Micro GPU Architecture based on RISC-V at Linley Fall Virtual Processor Conference (Oct 08, 2020)
- Pushing the boundaries of performance and security to unleash the power of 64-bit computing (Oct 08, 2020)
- Intento Design Expands Analog Automation with IDX-PVT, Eliminating the Need for Design-by-Verification (Oct 08, 2020)
- UMC Reports Sales for September 2020 (Oct 08, 2020)
- TSMC September 2020 Revenue Report (Oct 08, 2020)
- Attopsemi's I-fuse Memory Solution Now Qualified and Available on X-FAB's 130nm RF-SOI Technology (Oct 08, 2020)
- Huang "Confident" Nvidia-Arm Deal Will Get Past Regulators (Oct 08, 2020)
- Instrumentation Technology Systems adds intoPIX TICO-XS to their upcoming NetVIDxs (Oct 08, 2020)
- Synopsys DesignWare CXL IP Supports AMBA CXS Protocol Targeting High-Performance Computing SoCs (Oct 08, 2020)
- proteanTecs Announces Market and Regional Expansions (Oct 08, 2020)
- Everactive Adopts Movellus Sub-Microwatt Clocking Solution for its Batteryless IIoT System (Oct 07, 2020)
- VSORA Introduces Small Footprint, Low-Power PetaFLOPS Platform Enabling L4/L5 Autonomous Driving (Oct 07, 2020)
- CAST Introduces Ultra-Low Latency TSN Ethernet Switch IP Core (Oct 07, 2020)
- SmartDV Unveils SmartConf Testbench Generator (Oct 07, 2020)
- Arm CEO Simon Segars discusses AI, data centers, getting acquired by Nvidia and more (Oct. 07, 2020)
- Renesas Launches Arm Cortex-M33-based RA6M4 MCU Group with Superior Performance and Advanced Security for IoT Applications (Oct 06, 2020)
- Eximius Design Joins TSMC Design Center Alliance Program (Oct 06, 2020)
- Efinix® Announces Availability of Reconfigurable Acceleration Platform (Oct. 06, 2020)
- 'Samsung AI Forum 2020' Explores the Future of Artificial Intelligence (Oct. 06, 2020)
- Top 10 Tech Industry Trends for 2021 (Oct. 06, 2020)
- European Semiconductor Sales Drop, Global Sales Rise (Oct. 06, 2020)
- AI Requires Tailored DRAM Solutions: Part 3 (Oct. 06, 2020)
- OpenFive and AnalogX to Provide Optimized Chip-to-Chip Interface IP Solutions (Oct 05, 2020)
- GUC Monthly Sales Report - September 2020 (Oct 05, 2020)
- Global Semiconductor Sales Increase 4.9 Percent Year-to-Year in August (Oct 05, 2020)
- China's Semiconductor Industry to Brace for Impact as SMIC Assesses Export Restrictions Placed by U.S., Says TrendForce (Oct 05, 2020)
- Toshiba Information Systems Adopts Blue Pearl Software Visual Verification Suite by to Improve Quality and Accelerate FPGA and ASIC Development (Oct 05, 2020)
- Arm Spins-out Cerfe Labs to Advance Development of CeRAM Memory Technology (Oct 05, 2020)
- Intel's Roadmap: A Closer Look at Process Technologies and Production Plans (Oct 05, 2020)
- Imagination Technologies Group Ltd. Announces new CEO Simon Beresford-Wylie (Oct 05, 2020)
- TurboConcepts successfully completes research project FlexDEC-5G for designing FEC decoders for 5G (Oct 05, 2020)
- ESD Alliance Reports Strong Electronic Design Automation Industry Revenue Growth for Q2 2020 (Oct 05, 2020)
- China's Chip Sector Faces Possible Impact as SMIC Assesses Export Restrictions Placed by U.S. (Oct. 05, 2020)
- Nvidia Presents the DPU, a New Type of Data Center Processor (Oct. 05, 2020)
- Renesas Selects Andes RISC-V 32-Bit CPU Cores for its First RISC-V Implementation of ASSPs (Oct 01, 2020)
- New MIPI Debug and Trace Solution Available for Mobile, IoT and Automotive (Oct 01, 2020)
- Efinix Announces Availability of Reconfigurable Acceleration Platform (Oct 01, 2020)
- Efabless Extends Partnerships for Rapid Development Solution of Custom ICs (Oct. 01, 2020)
- Arteris IP to Acquire Assets of Magillem Design Services, Creating World's Premier System-on-Chip Assembly Company (Oct 01, 2020)
- Arm Mali-C71AE: High performance Image Signal Processing with Advanced Safety (Oct. 01, 2020)
- Talking Sense with Moortec... 5G, Hyperscaling and the Resurgence of Consumer Silicon (Oct. 01, 2020)
- Wi-Fi CERTIFIED Vantage adds support for latest Wi-Fi advancements (Sep 30, 2020)
- Moortec's In-Chip Sensing Fabric Enables Deeply Embedded Monitoring of Dynamic Conditions for Picocom's Baseband SoC for 5G Small Cells (Sep 30, 2020)
- Tetrivis tapes out prototype Transmit and Receive Phased-Array Silicon Chipsets for Low-Cost Terminals for Emerging Low-Earth Orbit Satellite (LEOSAT) Market (Sep 30, 2020)
- Two Acquisitions Make 2020 Second-Highest Year for Semi M&As (Sep 30, 2020)
- Fraunhofer IPMS develops TSN Switch IP Core (Sep 30, 2020)
- Arteris IP FlexNoC Interconnect Products Again Licensed by Samsung Foundry for Worldwide Use (Sep 30, 2020)
- Nordic Semiconductor to ship its billionth Arm Cortex-M based wireless SoC in October (Sep 30, 2020)
- Synopsys Delivers Industry's First Processor IP Certified for Full ISO 26262 ASIL D Compliance (Sep 30, 2020)
- Is RISC-V Processor Hardware or Software? (Sept. 30, 2020)
- 2020 is second highest year for semi M&A (Sept. 30, 2020)
- Megh Computing Selected by 5G Open Innovation Lab to Help Drive Early Adoption and Innovation of 5G Technology (Sep 29, 2020)
- New Arm technologies enable safety-capable computing solutions for an autonomous future (Sep 29, 2020)
- Globalfoundries Global Technology Conference 2020 Sets The Stage For Growth (Sept. 29, 2020)
- US trade restrictions on SMIC may set back China's efforts to develop a domestic alternative to Samsung and TSMC (Sept. 29, 2020)
- New Neoverse Platforms Take on the Cloud, HPC, and the Edge (Sept. 29, 2020)
- New Arm technologies enable safety-capable computing solutions for an autonomous future (Sept. 29, 2020)
- GLOBALFOUNDRIES Announces Industry-Leading GF SHIELD Program to Further Safeguard Customer Data and IP (Sep 28, 2020)
- 28HV Solution Accelerates GLOBALFOUNDRIES Leadership in OLED Display Drivers for Mobile Devices (Sep 28, 2020)
- Bluetooth Dual Mode v5.2 Protocol Stack SW, Profiles & LC3 codec licensed to leading Tier 1 Company for ultra-low power TWS Hearable Audio SoC (Sep 28, 2020)
- Cadence Announces Broad IP Collaboration with GLOBALFOUNDRIES on 12LP/12LP+ Solutions (Sep 28, 2020)
- NUVIA Raises $240M Series B Funding as it Accelerates Plans to Deliver Industry Leading CPU Performance to the Data Center (Sep 28, 2020)
- GLOBALFOUNDRIES Collaborates with Cadence on Availability of Mixed-Signal OpenAccess PDK for 22FDX Platform to Enable Advanced Mixed-Signal and mmWave Design (Sep 28, 2020)
- GLOBALFOUNDRIES and Mentor Collaborate to Launch New Semiconductor Verification Solution Embedded with Advanced Machine Learning Capabilities (Sep 28, 2020)
- GLOBALFOUNDRIES and Movano Inc. Partner to Advance Needle-Free Continuous Glucose Monitoring Technology (Sep 28, 2020)
- GLOBALFOUNDRIES Announces New 22FDX+ Platform, Extending FDX Leadership with Specialty Solutions for IoT and 5G Mobility (Sep 28, 2020)
- Efabless Expands support for Cloud-based Design Platform (Sep 28, 2020)
- Newly Released Versions of DMTF Redfish and SNIA Swordfish Specifications Include NVMe and NVMe-oF Specification Enhancements (Sep 28, 2020)
- Washington clamps down on SMIC (Sep 28, 2020)
- Globalfoundries extends 22nm FDSOI, holds 12nm (Sept. 28, 2020)
- Creating Domain Specific Processors Using Custom RISC-V ISA Instructions (Sept. 28, 2020)
- SMIC: Clarification Announcement (Sept. 28, 2020)
- Semiconductor/equipment: Structural Growth of Foundries (Sept. 28, 2020)
- China's Geely to Feature Mobileye SuperVision for Scalable ADAS (Sept. 28, 2020)
- Chipus Annouces new power management IP for hearables and wearables (Sep 24, 2020)
- Analog Bits Announces Foundation Analog IP Availability on GLOBALFOUNDRIES 12LP FinFET Platform (Sep 24, 2020)
- Xilinx and Continental Collaborate to Create Auto Industry's First Production-Ready 4D Imaging Radar for Autonomous Driving (Sep 24, 2020)
- BrainChip Confirms Validation of the Akida Neural Processor (Sep 24, 2020)
- Vidatronic Launches New 22 nm Analog IP For Ultra-Low-Power, System-On-Chip Physical Attack Mitigation In Internet Of Things (IoT) Applications (Sep 24, 2020)
- Allegro DVT Extends Leadership in 8K Video Decoding IP (Sep 24, 2020)
- Everything to Know about Dedicated Foundries (Sept. 24, 2020)
- NSITEXE selects Imperas RISC-V and Vectors Reference Model (Sep 24, 2020)
- Opinion: Nvidia's bad deal is not yet done (Sep 24, 2020)
- Synopsys and GLOBALFOUNDRIES Collaborate to Develop Broad Portfolio of DesignWare IP for 12LP+ FinFET Solution (Sep 24, 2020)
- Synopsys and GLOBALFOUNDRIES Collaborate to Expand Fusion Compiler Benefits for Latest Platforms (Sep 24, 2020)
- PLDA announce the 2nd topic of their Webinar Series: "Building Smart Scalable Storage SoC With Embedded PCIe Switching" (Sep 24, 2020)
- Why you should care about Bluetooth Low Energy Audio (Sept. 24, 2020)
- CEVA and VisiSonics Bring 3D Spatial Audio to True Wireless Earbuds and Headphones for the Ultimate Hearing Experience (Sep 23, 2020)
- Silex Insight's Public Key Cryptography Selected for Fungible's Groundbreaking DPU (Sep 23, 2020)
- Spectral Design & Test Inc. Announces 3rd Generation 45RFSOI Low Power SRAM Targeted at the 5G Mobile Device SoC Market (Sep 23, 2020)
- TSMC plans to establish foundries all over Taiwan (Sept. 23, 2020)
- Gyrfalcon White Paper Examines New AI Chipsets for Edge-Vision Computing (Sept. 23, 2020)
- Foundries to grow 19% this year (Sept. 23, 2020)
- PUFsecurity Opens North American Office to Tap Chip Security Market (Sep 22, 2020)
- Imagination launches Ray Tracing Levels System (Sep 22, 2020)
- Toshiba Information Systems (Japan) Integrates Verimatrix's Whitebox Cryptographic Key Technology Into Customer's Main Control Function to Safeguard Consumer Printers (Sep 22, 2020)
- Pure-Play Foundry Market On Pace For Strongest Growth Since 2014 (Sep 22, 2020)
- ARC: from 3D Game Chips to Licensable RISC Processor (Sep 22, 2020)
- CEVA Enhances the User Experience and Extends the Use Cases for TWS Earbuds and Hearables with New MotionEngine Hear Sensor Fusion Software (Sep 22, 2020)
- Accelerating the next generation cloud-to-edge infrastructure (Sep 22, 2020)
- SmartDV Delivers First-to-Market MIPI A-PHY v1.0 Verification IP (Sep 22, 2020)
- Rianta Releases 400G/800G Optimized Single Channel PCS/FEC IP Core for Ethernet ASICs and SoCs (Sep 22, 2020)
- Arteris IP FlexNoC & Resilience Package Support SemiDrive ISO 26262-Compliant Chip Production (Sep 22, 2020)
- Potential US ban on SMIC could choke China's semiconductor supply chain (Sept. 22, 2020)
- Accelerating the next generation cloud-to-edge infrastructure (Sept. 22, 2020)
- New Moortec Webinar - Addressing the Challenges of Hyper-scaling within Data Centers with Advanced Node Embedded Sensing Fabrics (Sep 21, 2020)
- RISC-V embedded variant RV32E now fully supported by SEGGER's Floating-Point library (Sep 21, 2020)
- Visit Vidatronic at the Virtual GLOBALFOUNDRIES Technology Conference (GTC) - North America on September 24th (Sep 21, 2020)
- North American Semiconductor Equipment Industry Posts August 2020 Billings (Sep 21, 2020)
- Gowin Semiconductor Launches GOAI 2.0 For Embedded Machine Learning Inference (Sep 21, 2020)
- AccelerComm secures $7.5m Series A funding from IQ Capital, Bloc Ventures and IP Group (Sep 21, 2020)
- Arm A-Profile Architecture Developments 2020 (Sept. 21, 2020)
- Understanding Color Space Conversions in Display (Sept. 21, 2020)
- Analog Bits Provides Enabling IP for Graphcore IPU-Machine M2000 (Sep 18, 2020)
- Interview with Nestwave CEO: low power geolocation without positioning chipset (Sept. 18, 2020)
- Cobham Gaisler Awarded ESA Contract for Development and Validation of New LEON3FT Microcontroller for Space Applications (Sep 17, 2020)
- NSITEXE Successfully Develops Multiple Custom Processors for Automotive Applications in Half the Time with Synopsys ASIP Designer Tool (Sep 17, 2020)
- SOT-MRAM Pioneer Antaios Secures 11 Million Dollars in Funding (Sep 17, 2020)
- Lattice Extends Industry-leading Security and System Control to Automotive Applications (Sep 17, 2020)
- Imagination and Packetcraft announce partnership for low energy audio (Sep 17, 2020)
- SiFive Appoints Patrick Little as President and Chief Executive Officer (Sep 17, 2020)
- Nvidia's $40 Billion ARM Purchase Will Test Current M&A "Ceiling" (Sep 17, 2020)
- Why Was Samsung Not Interested in Taking over ARM? (Sept. 17, 2020)
- videantis appoints Stephan Janouch as marketing director (Sep 17, 2020)
- Xylon Announces Rebranding in Celebration of Its 25-Year Anniversary (Sep 17, 2020)
- Cool AI chips are green (Sept. 17, 2020)
- The Incredible Opportunity For SiFive (Sept. 17, 2020)
- proteanTecs Granted US Patent for High Bandwidth Memory (HBM) Signal Quality and Reliability Monitoring (Sep 16, 2020)
- CEVA Partners with Fluent.ai to Offer Multilingual Speech Understanding Solutions for Intelligent Edge Devices (Sep 16, 2020)
- MIPI Alliance Releases A-PHY SerDes Interface for Automotive (Sep 16, 2020)
- Xilinx Ships Multi-Function Telco Accelerator Card for Growing 5G O-RAN Virtual Baseband Unit Markets (Sep 16, 2020)
- Gyrfalcon Showcases New Tech at 2020 Embedded Vision Summit (Sep 16, 2020)
- The Industry's First SoC FPGA Development Kit Based on the RISC-V Instruction Set Architecture is Now Available (Sep 16, 2020)
- SensiML Integrates Google's TensorFlow Lite for Microcontrollers (Sept. 16, 2020)
- Australia Introduces Code of Practice for IoT Devices (Sept. 16, 2020)
- Taiwan shares rise on TSMC rally (Sept. 16, 2020)
- Secure-IC is ready for ASIL B or ASIL D levels projects with its Securyzr integrated Secure Element (Sept. 16, 2020)
- HDMI 2.1 Rx PHY (TSMC 12FFC) & Controller Semiconductor IP licensed to a Tier1 Chinese Semiconductor company for integration into a TV SOC by T2MIP (Sep 15, 2020)
- New IP for wearables and hearables at IP SoC Shanghai 2020 (Sep 15, 2020)
- Nvidia Begins Campaign to Close Arm Acquisition (Sep 15, 2020)
- Mixel Announces Availability of the World's First MIPI C-PHY/D-PHY Combo IP Supporting 30 Gbps (Sep 15, 2020)
- Arteris IP FlexNoC Interconnect Licensed by VITEC for High Resolution Video Encoder and Decoder Chips (Sep 15, 2020)
- Taiwan Semiconductor And Samsung Electronics Foundry Business Post-SMIC Blockade (Sept. 15, 2020)
- SMIC asks for US permission to continue supplying Huawei (Sept. 15, 2020)
- SiFive To Introduce New RISC-V Processor Architecture and RISC-V PC at Linley Fall Virtual Processor Conference (Sep 14, 2020)
- Technology Analyzer transforms analog IP reuse (Sep 14, 2020)
- NVIDIA to Acquire Arm for $40 Billion, Creating World's Premier Computing Company for the Age of AI (Sep 14, 2020)
- Qeexo AutoML Enables Machine Learning on Arm Cortex-M0 and Cortex-M0+ (Sep 14, 2020)
- Total Microprocessor Sales to Edge Slightly Higher in 2020 (Sep 14, 2020)
- Imagination appoints Sir Peter Bonfield to board as non-executive director (Sep 14, 2020)
- SIMCom claims NB-IoT Will Accelerate the Expansion of IoT (Sept. 14, 2020)
- Nvidia Must Now Convince Multiple Stakeholders to Close Arm Purchase (Sept. 14, 2020)
- TSMC and Intel, 5nm node will be built in Foundry after Xe-HPG (Sept. 11, 2020)
- Lattice Shrinks Design Footprint and Cost, Boosts Reliability in Embedded Systems with Single Wire Aggregation IP Solution (Sep 10, 2020)
- Kushagra Vaid Joins Flex Logix's Board of Directors (Sep 10, 2020)
- BrainChip Demonstrates Company's Event-Based AI Neural Processor at Embedded Vision Summit (Sep 10, 2020)
- Rambus Advances HBM2E Performance to 4.0 Gbps for AI/ML Training Applications (Sep 10, 2020)
- TSMC August 2020 Revenue Report (Sep 10, 2020)
- SkyWater Begins Domestic Fab Expansion Tool Installation to Support DOD Investment of up to $170M (Sep 10, 2020)
- DSP Group Selects Synopsys' ARC EM Processor IP for Adaptive Processing Smart Codecs (Sep 10, 2020)
- Silex Insight and Faraday Extend Strategic Partnership to Deliver Secure IoT and AI Solutions (Sep 10, 2020)
- Germany Taking the Autobahn to Autonomy (Sept. 10, 2020)
- Silvaco Acquires the Assets of Coupling Wave Solutions S.A. (Sep 09, 2020)
- UMC Reports Sales for August 2020 (Sep 09, 2020)
- Analog Bits at TSMC OIP – A Complete On-Die Clock Subsystem for PCIe Gen 5 (Sept. 09, 2020)
- Highlights of the TSMC Technology Symposium – Part 3 (Sept. 09, 2020)
- Synopsys Introduces the Industry's First Unified Electronic and Photonic Design Platform (Sept. 09, 2020)
- Blue Cheetah Technology Catalyzes Chiplet Ecosystem (Sept. 09, 2020)
- Aspinity Raises $5.3M to Deploy Neuromorphic Analog Processing IC (Sept. 09, 2020)
- Pandemic Accelerates MIT Machine Learning Initiative (Sept. 09, 2020)
- Renesas Introduces DDR5 Data Buffer for High-Performance Server and Cloud Service Applications (Sept. 09, 2020)
- Global Semiconductor Sales Up 4.9% YoY in July (Sept. 09, 2020)
- IAR Systems supports ultra-low-power Renesas RE MCU Family in industry-leading Arm tools (Sep 08, 2020)
- Chips&Media to Exhibit at the 2020 Embedded Vision Summit (Sep 08, 2020)
- CAST and Fraunhofer IPMS Introduce CAN XL Bus Controller IP Core (Sep 08, 2020)
- Socionext starts providing high-speed, high-quality H.264 video encoder available on Amazon Web Services (Sep 08, 2020)
- Second Quarter 2020 Global Semiconductor Equipment Billings Up 26% Year-Over-Year, SEMI Reports (Sep 08, 2020)
- Fraunhofer IIS presents 8k video over IP transmission with JPEG XS at the virtual IBC 2020 (Sep 08, 2020)
- Credo Introduces Seagull 50 PAM4 DSP to Drive Front- and Mid-Haul 5G Wireless Networks (Sep 08, 2020)
- UMC soars as US eyes SMIC ban (Sept. 08, 2020)
- Arm Targets Computational Storage with 64-bit Processor Running Linux (Sept. 08, 2020)
- 2H20 Growth Expectations Vary Among Leading IC Suppliers (Sep 07, 2020)
- Global Semiconductor Sales Increase 4.9 Percent Year-to-Year in July (Sep 07, 2020)
- Thalia and Dolphin Design announce partnership to transform analog IP re-use economics and to accelerate time to market (Sep 07, 2020)
- GUC Monthly Sales Report - Aug 2020 (Sep 07, 2020)
- Semiconductor Manufacturing International Corporation Responses to Media on the U.S. Government's Consideration to Add the Company to a Trade Blacklist (Sep 07, 2020)
- Arasan Announces MIPI I3C IP Cores compliant to the MIPI I3C Specifications v1.1 (Sep 07, 2020)
- S2C Announces 300 Million Gate Prototyping System with Intel Stratix 10 GX 10M FPGAs (Sep 07, 2020)
- Semiconductor Industry: US Government Considering Sanctions against SMIC (Sept. 07, 2020)
- Automotive Software: Where Are We Going? (Sept. 07, 2020)
- New PicoRio SBC To Feature RISC-V Open-Source Processor (Sept. 06, 2020)
- electronica 2020 goes completely digital (Sept. 05, 2020)
- BrainChip and VORAGO Technologies Agree to Collaborate through the Akida Early Access Program (Sep 03, 2020)
- Arm announces Cortex-R82: powering the future of computational storage (Sep 03, 2020)
- Chips&Media Announces Making the First License Deal of Upscaling HW IP, c.WAVE120 (Sep 03, 2020)
- Lattice Expands CrossLink-NX FPGA Family of Best-in-Class Low Power FPGAs for Smart and Embedded Vision Systems (Sep 03, 2020)
- Blockchain Hardware Accelerator from Silex Insight is now available on AWS Marketplace (Sep 03, 2020)
- Aspinity Raises $5.3 Million Series A Funding to Stop Battery Drain in Always-on Smart Sensing Products (Sep 03, 2020)
- Kneron Boosts On-Device Edge AI Computing Performance with Cadence Tensilica IP (Sep 03, 2020)
- SiOx ReRAMs Promise to Accelerate AI Self-Learning (Sept. 03, 2020)
- Rambus and Micron Extend Patent License Agreement (Sep 03, 2020)
- SiFive and Barcelona Supercomputing Center Advance Industry Adoption of RISC-V Vector Extension (Sep 03, 2020)
- Mentor achieves certifications for TSMC's leading-edge 3nm process technology (Sep 03, 2020)
- Synopsys and Nestwave Collaborate to Develop a Low-Power Geolocation IP Solution for IoT Modems (Sep 03, 2020)
- Imagination announces the first RISC-V computer architecture course (Sep 02, 2020)
- Secure-IC and NSITEXE form a global partnership to jointly provide cutting-edge security solutions for Cyber-Physical Systems (CPS) (Sep 02, 2020)
- How AI Propels Medicine Development (Sept. 02, 2020)
- Nokia launching professional 5G training and certification (Sept. 02, 2020)
- Synopsys Appoints Jeannine Sargent to Board of Directors (Sep 02, 2020)
- SensiML Joins Arm AI Partner Program (Sep 02, 2020)
- PUFsecurity Unveils PUFiot, PUF-based Secure Crypto Coprocessor (Sep 01, 2020)
- Synopsys and Elektrobit Announce Availability of EB tresos Classic AUTOSAR Software for ARC Functional Safety Processor IP (Sep 01, 2020)
- The biggest IoT mistakes businesses make (Sept. 01, 2020)
- The Latest Iteration of 5G Standards Nailed Down (Sept. 01, 2020)
- Flex Logix Announces nnMAX AI Inference IP In Development On GLOBALFOUNDRIES 12LP Platform (Aug 31, 2020)
- Broadcom Overtakes Qualcomm for First Place While Nvidia Scores Highest YoY Growth in 2Q20 Revenue Ranking of Global Top Ten IC Design Companies, Says TrendForce (Aug 31, 2020)
- Mobiveil's 25xN RapidIO 4.1 compliant controller IP achives production status (Aug 31, 2020)
- Kneron's Next-Gen AI SoC Processes Video and Audio at the Edge (Aug 31, 2020)
- The future of leading-edge chips according to TSMC: 5nm, 4nm, 3nm and beyond (Aug. 31, 2020)
- ProteanTecs, which provides an AI platform to monitor chip reliability, raises $45 million (Aug. 30, 2020)
- TSMC's Super-gap Approach Puts Samsung Electronics on Alert (Aug. 28, 2020)
- Alibaba's new 16-core CPU will challenge Intel Xeon in datacenters (Aug. 28, 2020)
- Bluespec, Inc. Releases RISC-V Explorer: A Fast, Free, Accurate Way to Evaluate RISC-V (Aug 27, 2020)
- SiliconArts Joins the Khronos Group to Support Standardization of Vulkan Ray Tracing (Aug 27, 2020)
- Mentor's Questa and Veloce platforms help SimpleMachines dramatically speed development of its first AI processor (Aug 27, 2020)
- Chips&Media Publicize the Collaboration on SiFive's OpenFive, a Custom Silicon Business Unit. (Aug. 27, 2020)
- China chip imports still at $300bn (Aug 27, 2020)
- Chelsio Adopts Synopsys DesignWare 56G Ethernet PHY IP to Accelerate Development of High-Performance Computing SoC (Aug 27, 2020)
- proteanTecs Closes $45M Growth Equity Round Led by Koch Disruptive Technologies (KDT) (Aug 27, 2020)
- MIPS lands up in China (Aug 27, 2020)
- Chips&Media Publicizes the Collaboration on SiFive's OpenFive, a Custom Silicon Business Unit (Aug 27, 2020)
- Cadence IC Packaging Reference Flow Certified for the Latest TSMC Advanced Packaging Solutions (Aug 26, 2020)
- Nvidia Data Center Growth: Could Buying Arm Be an Ideal Match? (Aug 26, 2020)
- Samsung Display Demonstrates Most Advanced Display Hole for Smartphone Cameras (Aug. 26, 2020)
- WISeKey to Establish WISeAI, a Joint Venture with German Artificial Intelligence Leader arago, Blending AI, IoT and Cybersecurity into a Trusted European Platform (Aug. 26, 2020)
- Optical Processor Targets to Accelerate Compute for Next-Gen AI (Aug. 26, 2020)
- White House announces $1B investment for AI and quantum computing hubs (Aug. 26, 2020)
- Synopsys and TSMC Accelerate 2.5D/3DIC Designs with Chip-on-Wafer-on-Substrate and Integrated Fan-Out Certified Design Flows (Aug 25, 2020)
- TSMC Showcases Leading Technologies at Online Technology Symposium and OIP Ecosystem Forum (Aug 25, 2020)
- TSMC Plots the Process Course to Its Next "Generational Node" (Aug 25, 2020)
- Analog Bits to Present Papers on Wafer-Scale Sensors and PCIe Clock Systems at TSMC 2020 Open Innovation Platform Ecosystem Forums (Aug 25, 2020)
- Synopsys Collaborates with TSMC to Accelerate 3nm Innovation, Enabling Next-Generation SoC Design (Aug 25, 2020)
- Marvell and TSMC Collaborate to Deliver Industry's Most Advanced Data Infrastructure Portfolio on 5nm Technology (Aug 25, 2020)
- Cadence Announces Availability of UltraLink D2D PHY IP on TSMC N7, N6 and N5 Processes (Aug 25, 2020)
- GigaDevice launches the New GD32E5 Series of MCU's, marking a new milestone for high-performance computing based on the Arm Cortex-M33 core. (Aug 25, 2020)
- Huawei is hurrying to build a wafer fab (Aug 25, 2020)
- Automotive Software Platforms: Current Status (Aug. 25, 2020)
- Foundry Revenue Projected to Grow by 14% YoY in 3Q20 as Downstream Clients Exhibit Strong Demand, Says TrendForce (Aug 24, 2020)
- Dolphin Design Releases its First Development Platform on TSMC 22ULL Process for Smart Home Applications (Aug 24, 2020)
- Sofics releases Analog I/O's and ESD clamps for TSMC N5 process (Aug 24, 2020)
- North American Semiconductor Equipment Industry Posts July 2020 Billings (Aug 24, 2020)
- Silicon Creations' Achieves ISO 9001 Certification for World-Class Silicon IP Development Process (Aug 24, 2020)
- Socionext and Osaka University Develop New Deep Learning Method for Object Detection in Low-Light Conditions (Aug 24, 2020)
- TrendForce Analyzes Impacts of Expanded U.S. Sanctions Against Huawei on Five Major Tech Industries (Aug 24, 2020)
- Visit Moortec at the Virtual TSMC Technology Symposium & Open Innovation Platform Ecosystem Forum (Aug 24, 2020)
- Foundry Revenue Projected to Grow by 14% YoY in 3Q20 (Aug. 24, 2020)
- Arm Flexible Access one year later: Accelerating innovation for more than 60 partners and counting (Aug. 24, 2020)
- prpl Foundation Releases prplWRT Open-Source CPE Software (Aug 20, 2020)
- Synopsys Appoints Sassine Ghazi as Chief Operating Officer (Aug 20, 2020)
- DRAM Capex Spending Expected to Decline 20% in 2020 (Aug 20, 2020)
- Clue Technologies adopts OneSpin's verification solution for avionic computing systems (Aug 20, 2020)
- Electronics Supply Chains Splitting Between China and U.S. (Aug 20, 2020)
- Synopsys Posts Financial Results for Third Quarter Fiscal Year 2020 (Aug 20, 2020)
- Subaru Selects Xilinx to Power New-Generation EyeSight System (Aug 20, 2020)
- OpenFive Enhances Differentiated IP Portfolio with Die-to-Die Interface Controllers for HPC and Chiplet Markets (Aug 20, 2020)
- Synopsys IC Validator, Running on AMD EPYC Processor Powered Azure Virtual Machines, Verifies AMD Radeon Pro VII GPU Design in Under Nine Hours (Aug 20, 2020)
- Arm and DARPA Sign Partnership Agreement to Accelerate Technological Innovation (Aug 20, 2020)
- Intel Looks to Regain Innovation Lead (Aug 19, 2020)
- CEVA's Wi-Fi 6 Solution Becomes World's First IP to Achieve Wi-Fi CERTIFIED 6 Status from the Wi-Fi Alliance (Aug 19, 2020)
- US Tightens Chip Export Screws on Huawei (Aug 19, 2020)
- RIOS Laboratory and Imagination announce partnership to grow the RISC-V ecosystem (Aug 19, 2020)
- Moortec Provides In-Chip Sensing Fabrics on TSMC N6 Process Technology (Aug 19, 2020)
- NSITEXE Adopts Synopsys HAPS Prototyping to Validate Data Flow Processor IP (Aug. 19, 2020)
- Alibaba XT910 RISC-V Core Faster Than Kirin 970 SoC; Threat To ARM? (Aug. 19, 2020)
- Proof of concept security platform protects IoT and 5G private networks (Aug. 19, 2020)
- Nuvoton Accelerates the Development of its MCU Designs with the Cadence Palladium Z1 Enterprise Emulation Platform (Aug 18, 2020)
- The Landmark IPO of VeriSilicon (688521.SH) on Shanghai STAR Market (Aug 18, 2020)
- S2C and Mirabilis Design Teamup to Deliver a Heterogeneous Solution for SoC Architecture Exploration and Verification (Aug 18, 2020)
- Semiconductor Industry Luminary Fred Weber Joins Movellus as Corporate Advisor (Aug 18, 2020)
- Rianta Releases 800G MACsec ASIC/SoC IP Core for Next-Gen Data Center and 5G Backhaul Applications (Aug 18, 2020)
- SiFive and Innovium Announce Collaboration to Accelerate Innovation in Data Center Networking (Aug 18, 2020)
- Mixel's Patented D-PHY RX+ IP Extends Market Share with Automotive Microcontrollers (Aug 18, 2020)
- Samsung ramps up foundry business as manufacturer of IBM's 7nm CPU (Aug. 18, 2020)
- Movellus Named to EETimes' Silicon 100 Emerging Startups to Watch List (Aug 17, 2020)
- BrainChip Inc and Magik Eye Inc. Partner to Combine Best of AI with 3D Sensing for Total 3D Vision Solution (Aug 17, 2020)
- SiFive Announces OpenFive, an Industry-Leading Custom Silicon Business Unit (Aug 17, 2020)
- Silicon Creations' SerDes Technology Designed into Novatek 8K TV SoC on TSMC 12nm Process (Aug 17, 2020)
- eInfochips provides SOC engineering services to Astera Labs in developing industry's first PCIe 4.0 & 5.0 Smart Retimer SoC. (Aug 17, 2020)
- IBM Reveals Next-Generation IBM POWER10 Processor (Aug 17, 2020)
- SiFive founds business unit to mix Risc-V and Arm cores on silicon (Aug. 17, 2020)
- Arm co-founder: Nvidia sale is because Softbank over-invested in firm (Aug. 17, 2020)
- Blaize Delivers Breakthrough for AI Edge Computing (Aug 14, 2020)
- Cadence Delivers Machine Learning-Optimized Xcelium Logic Simulation with up to 5X Faster Regressions (Aug 13, 2020)
- Startup Claims Low-power IoT Geolocation Without a Positioning Chipset (Aug 13, 2020)
- BrainChip Inc Appoints Vice President of Worldwide Sales (Aug 13, 2020)
- Cobham Advanced Electronic Solutions' RadHard Microelectronics Assist in Study of Sun and Earth Connection (Aug 13, 2020)
- Synopsys Introduces Integrated Electric Vehicle Virtual Prototyping Solution (Aug 13, 2020)
- Samsung Announces Availability of its Silicon-Proven 3D IC Technology for High-Performance Applications (Aug. 13, 2020)
- CHIPS Act Targets Post-Globalized Industry (Aug 13, 2020)
- Alchip Technologies Opens 5nm ASIC Design Capabilities (Aug 13, 2020)
- Spin Memory Unveils New Method of Designing Memory to Shake Up $100B Chip Market (Aug 13, 2020)
- SMIC says it has improved the yield rate of its 14nm manufacturing node (Aug. 13, 2020)
- Tachyum Demo Shows Prodigy will be Faster than NVIDIA and Intel Chips (Aug 12, 2020)
- CEVA NB-IoT IP Achieves Monumental Milestone; Awarded Full Certification from Deutsche Telekom (Aug 12, 2020)
- Qualcomm's licensing model declared legal (Aug 12, 2020)
- China-Based HiSilicon's Time in the Top-10 Ranking May be Short Lived (Aug 12, 2020)
- Gowin Semiconductor Adds Korea Certification For Their Bluetooth Low Energy Enabled MSoC FPGA Modules (Aug 12, 2020)
- Brain simulator AI platform processes 3 billion synapses/s (Aug. 12, 2020)
- Demand for Edge AI Chips to Surpass Cloud AI by 2025 (Aug. 12, 2020)
- Dialog Semiconductor's FusionHD™ NOR Flash Memory Compatible and Qualified with its SmartBond™ Bluetooth Low Energy Wireless MCUs (Aug. 12, 2020)
- SiFive Secures $61 Million in Series E Funding (Aug 11, 2020)
- QuickLogic Joins CHIPS Alliance to Expand Open Source FPGA Efforts (Aug 11, 2020)
- Lack of ADAS Benchmarks Is Haunting Car Industry (Aug. 11, 2020)
- Covid-19 Expected to Limit Growth Rates For Many IC Products in 2020 (Aug 10, 2020)
- Truechip Announces Customer Shipment Of USB4 And eUSB Verification IPs (Aug 10, 2020)
- Mentor extends industry-leading EDA software support for Samsung Foundry's 5/4nm process technologies (Aug 10, 2020)
- TSMC July 2020 Revenue Report (Aug 10, 2020)
- UMC Reports Sales for July 2020 (Aug 10, 2020)
- One on One with RISC-V CTO Mark Himelstein (Aug 10, 2020)
- Imec presents low-power 60 GHz radar chip for contactless health tracking in battery-powered devices (Aug 10, 2020)
- Huawei to end production of leading edge mobile chipsets (Aug 10, 2020)
- CEVA, Inc. Announces Second Quarter 2020 Financial Results (Aug 10, 2020)
- CAST HDLC/SDLC IP Core Now Ready for DO-254 Compliance in Airborne Systems (Aug 06, 2020)
- MediaTek and Intel Advance Partnership to Bring 5G to Next Generation of PCs (Aug 06, 2020)
- Lattice FPGA Brings High-Performance MIPI Bridging to Ambarella's CVflow Architecture for Automotive and Machine Vision Applications (Aug 06, 2020)
- Aldec's TySOM Embedded Development Kits are Now Qualified for AWS IoT Greengrass (Aug 06, 2020)
- SMIC Reports 2020 Second Quarter Results. (Aug 06, 2020)
- GUC Monthly Sales Report - July 2020 (Aug 05, 2020)
- Rambus Reports Second Quarter 2020 Financial Results (Aug 05, 2020)
- Global Semiconductor Sales Increase 5.1 Percent Year-to-Year in June; Q2 Sales Down Slightly Compared to Q1 (Aug 05, 2020)
- Pliops Storage Processor Proven to Boost Flash Performance (Aug 05, 2020)
- HiWire Consortium Publishes first Active Electrical Cable (AEC) Specification (Aug 05, 2020)
- Samsung said to have lost Qualcomm's 5nm chip orders to TSMC (Aug. 05, 2020)
- SMIC Founder: Next-gen semiconductors don't need big investment, talent is key. (Aug. 05, 2020)
- x86, ARM, and RISC-V software running on Tachyum Prodigy (Aug. 05, 2020)
- GlobalWafers' net profit drops on logistics costs (Aug. 05, 2020)
- Arm, Vodafone Demo Virtual Telco Platform (Aug. 05, 2020)
- Lattice FPGA Brings High-Performance MIPI Bridging to Ambarella's CVflow Architecture for Automotive and Machine Vision Applications (Aug. 05, 2020)
- Codasip and Metrics Design Automation Announce the Integration of the Metrics Cloud Simulation Platform in Codasip's RISC-V SweRV CORE Support Package Pro (Aug 05, 2020)
- Syntiant Surpasses 1 Million Units Shipped; Raises $35M in Series C Led by M12 and Applied Ventures (Aug 05, 2020)
- PUFsecurity Launches Unique Quantum-Tunneling PUF-based Root-of-Trust (Aug 04, 2020)
- Picocom Embeds 32 Andes N25F RISC-V Cores into Its 5G NR Small Cell Baseband SoC (Aug 04, 2020)
- Infineon looking for €8.5bn revenues this year (Aug. 04, 2020)
- Nvidia Is Likely To Make A Strategic Investment In ARM Instead Of Buying It Outright (Aug. 04, 2020)
- Nvidia Buying Arm Would be Reckless (Aug 03, 2020)
- Nvidia in pole position to buy Arm (Aug 03, 2020)
- Nvidia-Arm Deal Would Be a Technology "Disaster" (Aug 03, 2020)
- Greg Lang Joins Rambus Board of Directors (Aug 03, 2020)
- NAND Flash, DRAM Forecast to Remain Largest IC Markets in 2020 (Aug 03, 2020)
- Goodix Closes Acquisition of Dream Chip Technologies (Aug 03, 2020)
- Intento Design announces the launch of ID-Calibre, an ID-Substrate extension for behavioural TCAD simulation on a complete AMS chip (Jul 30, 2020)
- Gen-Z Seeks to Share Memory, Lower Latencies (Jul 30, 2020)
- Analog Devices Acquires HDMI Business From INVECAS, Expanding High Performance Audiovisual Capabilities (Jul 30, 2020)
- Intel Outside ... Just Like all the Others (Jul 30, 2020)
- Will Intel lose its position as a semiconductor market leader? (Jul. 29, 2020)
- DB HiTek: Opportunity for Rapid Growth of Foundry Market (Jul. 29, 2020)
- Avanci Launches 5G Licensing Platform for the Internet of Things (Jul. 29, 2020)
- Media Links moves to intoPIX TICO-XS for its MDP3020 IP Media Gateway (Jul 29, 2020)
- Arm China asks Beijing government to intervene in row with Arm UK (Jul 29, 2020)
- Intel is a Potentially Great Foundry (Jul 29, 2020)
- Fraunhofer IIS licenses MPEG-H Audio patents to Samsung (Jul 29, 2020)
- IoT Growth Demands Rethink of Long-Term Storage Strategies (Jul. 29, 2020)
- CES 2021 to be virtual (Jul. 29, 2020)
- ON Semiconductor Provides BLE Solution with Veridify (Jul. 29, 2020)
- Dolby MS12 Multistream Decoder Now Supported and Approved on CEVA's Audio DSP (Jul 28, 2020)
- Marvell Unveils the Industry's Most Comprehensive Custom ASIC Offering (Jul 28, 2020)
- Peninsular Capital Acquires NovaSparks (Jul 28, 2020)
- TSMC remains top applicant for invention patents in Taiwan (Jul. 28, 2020)
- Automotive Design Needs Efficient Verification to Survive (Jul. 28, 2020)
- How to get started with AI inferencing on the edge (Jul. 28, 2020)
- Verimatrix WhiteBox Offers Unmatched Control and Protection Against Cyberattacks for Mobile Apps, IoT Devices and OEM Partner Integrations (Jul. 28, 2020)
- Second Quarter 2020 Silicon Wafer Shipments Up Over First-Quarter and Year-Ago Volumes (Jul 27, 2020)
- Exostiv Labs achieves 50 Gbps interoperability tests with Avnet ONIX board. (Jul 27, 2020)
- Innovium Secures $170M in New Funding to Accelerate Product and Customer Momentum Worldwide (Jul 27, 2020)
- Fraunhofer IIS announces licensing program for the new MPEG-H 3D Audio Baseline Profile (Jul 27, 2020)
- North American Semiconductor Equipment Industry Posts June 2020 Billings (Jul 24, 2020)
- Faraday Reports Second Quarter 2020 Revenues at NT$1,306 Million with an EPS of NT$0.58 (Jul 24, 2020)
- M31 Completes the Comprehensive Physical IP Platform on TSMC 22nm Process (Jul 24, 2020)
- Speculation Arises over Samsung's Possible Acquisition of ARM (Jul. 23, 2020)
- SiFive Elevates Custom SoC Design With Enhanced Processor IP Portfolio (Jul 23, 2020)
- European Space Agency, Blue Pearl Software and ADIUVO Engineering Partner Contract to Improve the usability of ESA Soft-Cores (Jul 23, 2020)
- Carlos Mazure, EVP of Soitec and Chairman of the SOI Industry Consortium, Joins Silvaco Board of Directors (Jul 23, 2020)
- Aldec Provides Static Verification for RISC-V Designs with the latest release of ALINT-PRO (Jul 23, 2020)
- Brite Semiconductor Provides Total Solution for NVDIMM OEM (Jul 23, 2020)
- Cadence and UMC Certify mmWave Reference Flow on 28HPC+ Process for Advanced RF Designs (Jul 23, 2020)
- Mobile Semiconductor's Enhanced Memory Compilers Dramatically Improve Power On Edge AI Devices (Jul 23, 2020)
- AI Edge Inference is Totally Different to Data Center (Jul. 23, 2020)
- Softbank talks to Apple and Nvidia about Arm sale (Jul 23, 2020)
- Village Island creates a new breakthrough in the Broadcast market by offering JPEG-XS technology on its VICO series (Jul 23, 2020)
- GLOBALFOUNDRIES Partners with Synopsys, Mentor, and Keysight on Interoperable Process Design Kit (iPDK) Support for 22FDX (Jul 22, 2020)
- Samsung Electronics and TSMC Planning on More Investments (Jul. 22, 2020)
- OpenHW Ecosystem Implements Imperas RISC-V reference models for Coverage Driven Verification of Open Source CORE-V processor IP cores (Jul 22, 2020)
- Alchip Technologies 7nm ASIC Capabilities Set Advanced Technology Pace (Jul 22, 2020)
- Flex Logix Announces EFLX eFPGA And nnMAX AI Inference IP Model Support For The Veloce Strato Emulation Platform From Mentor (Jul 21, 2020)
- Cadence Reports Second Quarter 2020 Financial Results (Jul 21, 2020)
- New Analog FastSPICE eXTreme technology boosts verification performance by up to 10X (Jul 21, 2020)
- Synaptics to Acquire DisplayLink, Extending Video Interface Market Leadership (Jul 21, 2020)
- Codasip Releases the First Linux-Capable RISC-V Core Bk7 Optimized for Domain-Specific Applications (Jul 21, 2020)
- Moore's Law Isn't Slowing down - Just Ask System Companies (Jul 21, 2020)
- CFI funding fuels new services for researchers from CMC and CNDN (Jul. 21, 2020)
- Hua Hong Semiconductor Continues to Build a Superior eNVM Process Platform (Jul 20, 2020)
- SMIC: Advanced Process Technologies and Gov't Funding (Part 2) (Jul 20, 2020)
- PLDA Announces Robust Verification Toolset, Increasing Design Accuracy and Reducing Time-to-Production for Next Generation SoCs with CXL, PCIe 6.0 or Gen-Z Interconnect (Jul 20, 2020)
- Perforce Software Acquires Methodics, Expanding DevOps Portfolio (Jul 20, 2020)
- Synopsys VCS Used by Graphcore to Verify Next-Generation Colossus GC200 IPU (Jul 20, 2020)
- SmartDV, Aldec Partner to Link SmartDV's Verification IP with Aldec's Riviera-PRO Simulator (Jul 20, 2020)
- Mentor introduces Calibre nmLVS-Recon technology to dramatically streamline overall IC circuit verification (Jul 20, 2020)
- STMicroelectronics makes acquisitions to further strengthen the wireless connectivity capabilities of STM32 microcontrollers (Jul 20, 2020)
- True Circuits Participates in First Virtual DAC! Showcases Silicon Proven PLLs, DLLs and DDR 4/3 PHYs (Jul 20, 2020)
- CFX announces commercial availability of anti-fuse OTP technology on SMIC 40HV process (Jul 20, 2020)
- TSMC open to possibility of building plants in Japan (Jul. 20, 2020)
- How SMIC Can Keep Up With Advanced Process Technologies (Jul. 20, 2020)
- Long-Range Wireless Power Transfer for Industrial IoT (Jul. 20, 2020)
- Antitrust: the European Commission launches sector inquiry into the consumer Internet of Things (IoT) (Jul. 20, 2020)
- Long-Range Wireless Power Transfer for Industrial IoT (Jul. 20, 2020)
- Spin Memory Announces Extension of Series B Funding (Jul 17, 2020)
- TSMC Raises Capital Expenditure Plan on Improved Outlook (Jul 17, 2020)
- CHIPS Alliance Announces AIB 2.0 Draft Specification to Accelerate Design of Open Source Chiplets (Jul 17, 2020)
- USB-IF Publishes USB Device Class Specification for MIDI Devices v2.0 (Jul 17, 2020)
- Innovative Advantage upgrades streams from HD to 4K in business jets with the intoPIX TICO RDD35 Technology (Jul 17, 2020)
- Nestwave wins Must Award in the category Most Innovative Startup (Jul. 17, 2020)
- TSMC Reports Second Quarter EPS of NT$4.66 (Jul 16, 2020)
- Axiomise Announces the Release of the Next-Generation RISC-V App (Jul 16, 2020)
- Customisable wireless medical sensor chip with machine learning accelerator enables mass market advanced medical and vital-sign monitors (Jul 16, 2020)
- Faraday Launches Ariel SoC Platform with Infineon's SONOS eFlash to Drive IoT Development (Jul 16, 2020)
- 1Q/4Q "Direction Indicator" Signals Rebound in the 2020 IC Market (Jul 16, 2020)
- Siemens acquires Avatar, expands EDA footprint with innovative Place and Route technology (Jul 16, 2020)
- EasyIC Design celebrates its 10th anniversary (Jul. 16, 2020)
- Buying Avatar, Siemens Revives Legendary Place & Route Tool (Jul 16, 2020)
- Menta Announces New Software Version and New Adaptive DSP at DAC 2020 (Jul 16, 2020)
- Kandou Appoints Jeff Winzeler CFO (Jul 16, 2020)
- Synopsys Announces Industry's First JEDEC DDR5 Verification IP for Next-Generation DRAM/DIMM Designs (Jul 15, 2020)
- Dr. Walden Rhines Joins Cornami as President and CEO (Jul 15, 2020)
- JEDEC Publishes New DDR5 Standard for Advancing Next-Generation High Performance Computing Systems (Jul 15, 2020)
- SMIC: Advanced Process Technologies and Gov't Funding (Jul 15, 2020)
- Efinix Announces Trion Titanium Family (Jul 15, 2020)
- Softbank Said to Have a Buyout Offer for Arm (Jul 15, 2020)
- How SMIC Can Keep Up With Advanced Process Technologies (Jul. 15, 2020)
- SATA-IO Increases Interoperability Features with Revision 3.5 Specification (Jul. 15, 2020)
- British chip designer Graphcore unveils new AI processor more complex than Nvidia's (Jul. 15, 2020)
- Tenstorrent Achieves First-Pass Silicon Success for High-Performance AI Processor SoC Using Synopsys' Broad DesignWare IP Portfolio (Jul 15, 2020)
- Maxim Integrated Deal Cements Analog Devices at No 2 in Analog (Jul 15, 2020)
- VITEC Licenses Codasip Bk5 Core for Multi-Purpose Use in Video Products (Jul 14, 2020)
- Mixel MIPI D-PHY IP Integrated into the Perceive Ergo Edge Inference Processor (Jul 14, 2020)
- TSMC pushing to produce advanced chips using experimental design by 2023, 2024 (Jul. 14, 2020)
- Axiomise Announces the Release of the Next-Generation RISC-V® App (Jul. 14, 2020)
- ESD Alliance Reports Electronic Design Automation Industry Revenue Growth for Q1 2020 (Jul 13, 2020)
- Mentor collaborates with Samsung Foundry to boost product yield and streamline in-fab memory testing (Jul 13, 2020)
- Flex Logix Announces EFLX eFPGA Emulation Models For The Cadence Palladium Z1 Platform (Jul 13, 2020)
- DMP releases IP Core "ZIA ISP" (Jul 13, 2020)
- Analog Devices Announces Combination with Maxim Integrated, Strengthening Analog Semiconductor Leadership (Jul 13, 2020)
- DMP releases AI Processor IP Core "ZIA DV740" (Jul 13, 2020)
- TSMC June 2020 Revenue Report (Jul 13, 2020)
- Arm Research Selected for DARPA Secure Silicon Program (Jul. 13, 2020)
- TSMC's market cap continues record upswing after June sales report (Jul. 13, 2020)
- UMC Reports Sales for June 2020 (Jul 09, 2020)
- Mirabilis Design announces the first Application-Specific University Program (Jul. 09, 2020)
- Synaptics to Acquire Rights to Broadcom's Wireless IoT Connectivity Business (Jul 08, 2020)
- High Performance Channel Coding Solutions on Xilinx Zynq UltraScale+ RFSoC Devices (Jul 08, 2020)
- Soitec announces POI substrates business agreement with Qualcomm Technologies for 5G RF filters (Jul 08, 2020)
- SmartDV Broadens Support for Arm AMBA Protocol with Verification IP Solutions for AMBA CHI, CXS, LPI (Jul 08, 2020)
- Imagination announces XS, the automotive industry's most advanced GPU IP (Jul 08, 2020)
- SiFive looks to foster worldwide network of RISC-V startups (Jul. 08, 2020)
- Imec and GLOBALFOUNDRIES Announce Breakthrough in AI Chip, Bringing Deep Neural Network Calculations to IoT Edge Devices (Jul. 08, 2020)
- Wi-Fi 6 is Set to Change the Future of IoT–Here's Why (Jul. 08, 2020)
- Low-Power FD-SOI FPGA Melds AI and Bridging (Jul. 08, 2020)
- Imagination announces latest licensing deal with NXP (Jul 07, 2020)
- Apple to Start Mass Producing Self-Designed Mac SoC, Projected to Cost under US$100, in 1H21, Says TrendForce (Jul 07, 2020)
- videantis processor platform adopted for TEMPO neuromorphic edge AI chip (Jul 07, 2020)
- JLQ Technology Selects Synopsys DesignWare IP to Accelerate Development of Next-Generation SoCs (Jul 07, 2020)
- Arm intends to strengthen focus on core semiconductor IP business growth (Jul 07, 2020)
- Arm intends to strengthen focus on core semiconductor IP business growth (Jul 07, 2020)
- The Value of Intellectual Capital (Jul. 07, 2020)
- Global Semiconductor Sales Increase 5.8 Percent Year-to-Year in May; Annual Sales Projected to Increase 3.3 Percent in 2020, 6.2 Percent in 2021 (Jul 06, 2020)
- Phison appoints T2M-IP for global marketing, representation, and business development (Jul 06, 2020)
- Ingenic Semiconductor integrates Allegro DVT Encoding IP into Next-Generation Smart-Video System-On-Chip Solutions (Jul 06, 2020)
- Dolphin Design unveils the final piece of their platform offer with BAT, an audio solution for high quality AIoT applications (Jul 06, 2020)
- Creonic joins partnership with the University of Bremen to expand the development of Artificial Intelligence (Jul 06, 2020)
- GUC Monthly Sales Report - June 2020 (Jul 06, 2020)
- TSMC rebuffs Samsung challenge to chip foundry dominance (Jul. 05, 2020)
- China chipmaker SMIC to raise $6.55 billion in Shanghai share sale (Jul. 05, 2020)
- New GAA Nanosheet Architecture to Drive Silicon Performance (Jul. 03, 2020)
- Innosilicon IP helps Ingenic T20 win "China Chip" Excellent Market Performance Product Award (Jul 02, 2020)
- Innosilicon multiple high-speed interface IPs, based on the SMIC 14nm process, R&D and mass production proven (Jul 02, 2020)
- Appear TV introduces Zero-latency intoPIX JPEG XS technology in the X Platform (Jul 02, 2020)
- Aldec Adds Customizable Tool Qualification Data Package to ALINT-PRO for DO-254 Projects (Jul 02, 2020)
- TSMC secures US govt subsidies and picks site for US$12b Arizona plant (Jul. 02, 2020)
- Green Hills Software Extends Multicore Interference Mitigation to Arm Cortex-A72 for DO-178C Level A Applications (Jul 02, 2020)
- MediaTek Introduces Helio G35 & G25 Gaming Series Chipsets (Jul 02, 2020)
- Sigasi Introduces Software Development Kit for Electronic Design Automation Tools (Jul 02, 2020)
- OPENEDGES Network-on-Chip Interconnect IP and DDR Controller Licensed for GCT Semiconductor LTE Category 19 Chip (Jul 01, 2020)
- Basemark and DMP Partner to Develop Smart Mirrors for commercial vehicles (Jul 01, 2020)
- Hardent and PLC2 Announce New IP Partnership to Support German Semiconductor Companies (Jul 01, 2020)
- HiSilicon & Nowi Introduce Energy Autonomous NB-IoT Platform: a Power-free Solution in the Smallest Size Possible (Jul 01, 2020)
- GloFo qualifies 12LP+ finfet process (Jul. 01, 2020)
- How your automotive display can meet ASIL-B, cold-crank specifications (Jul. 01, 2020)
- Optimized for AI Accelerator Applications, GLOBALFOUNDRIES 12LP+ FinFET Solution Ready for Production (Jun 30, 2020)
- FPGAs to Replace GPUs in AI Accelerators (Jun. 30, 2020)
- Dialog Semiconductor Announces Completion of its Acquisition of Adesto Technologies (Jun 29, 2020)
- Palma Ceia SemiDesign Announces Sampling for PCS11ax28, New 802.11ax Transceiver (Jun 29, 2020)
- Synopsys and Arm Extend Strategic Partnership to Deliver Superior Full-Flow Quality-of-Results and Time-to-Results (Jun 29, 2020)
- Dolphin unveils two break-through DSP and AI digital platforms dedicated to edge computing applications (Jun 29, 2020)
- Huawei makes new chip supply deals with SMIC and Shanghai Microelectronics (Jun. 29, 2020)
- US approved 99% of TSMC's patents (Jun. 29, 2020)
- Synopsys Broadens Collaboration with EPFL (Jun 26, 2020)
- Intilop Delivers a Ready to Deploy, Four Thousand TCP/UDP Session 2U-Hardware Accelerator Box with Linux Kernel Bypass Drivers for Extreme-Performance Networking (Jun 26, 2020)
- Rockchip selects Ensigma iEW200 low-power Wi-Fi (Jun 26, 2020)
- Solving a Problem like Reuse - an FD-SOI Analog IP Perspective from Thalia (Jun. 26, 2020)
- Elephant in Automated Vehicle Room (Jun. 26, 2020)
- SMIC to come out stronger after pandemic–Sy-Coson (Jun. 25, 2020)
- Lattice Reinvents the Low Power, General-Purpose FPGA with New Certus-NX (Jun 25, 2020)
- Taiwan Edges South Korea as Largest Base for IC Wafer Capacity (Jun 25, 2020)
- Apple Moving Macs from Intel to Arm (Jun 25, 2020)
- Percepio Closes Series A Funding Round with Fairpoint Capital (Jun 25, 2020)
- Synopsys Awarded DARPA Contract for Automatic Implementation of Secure Silicon Program (Jun 25, 2020)
- Bamboo Systems Launches Next Generation Server (Jun 25, 2020)
- Macnica adopts intoPIX TICO-XS for its 4K ProAV OEM solutions (Jun 25, 2020)
- VeriSilicon: FD-SOI & Design-Lite - A Beautiful Combination (CEO Interview) (Jun. 25, 2020)
- Analysts believe that SMIC will not develop a process below 7/5nm (Jun. 25, 2020)
- T2M announces Industry's first Ultra Low-Power Bluetooth Dual Mode RF IP on TSMC 22nm. (Jun 24, 2020)
- TSMC has reportedly begun production of the Snapdragon 875 SoC using the 5nm process (Jun. 24, 2020)
- UMC Recognized for Excellence by Texas Instruments (Jun. 24, 2020)
- TSMC invested 300 R&D teams to assist Apple in developing Mac chips (Jun. 24, 2020)
- AI-based cybersecurity: Hype or reality? (Jun. 24, 2020)
- Xilinx Selects Mipsology Zebra Software to Accelerate Alveo U50 FPGA (Jun 24, 2020)
- IAR Systems delivers advanced trace for RISC-V based applications (Jun 24, 2020)
- Rianta Releases 200G/400G Single Channel MAC IP Core (Jun 23, 2020)
- Siemens acquires UltraSoC to drive design for silicon lifecycle management (Jun 23, 2020)
- Arm Technology Powers the World's Fastest Supercomputer (Jun 23, 2020)
- Adesto Announces Completion of CFIUS Review for Proposed Acquisition of Adesto by Dialog Semiconductor (Jun 23, 2020)
- AIoT Chip Slashes Power Consumption for Person Detection (Jun. 23, 2020)
- intoPIX releases the FastTICO-XS SDK v1.2.4 for Nvidia GPU (Jun 22, 2020)
- QuickLogic Announces Pricing of $8.75 Million Public Offering of Common Stock (Jun 22, 2020)
- Synopsys Replenishes Repurchase Authorization to $500 Million (Jun 22, 2020)
- Silicon Catalyst Announces Four Newly Admitted Companies to Semiconductor Incubator (Jun 22, 2020)
- GLOBALFOUNDRIES to Acquire Land in Malta, NY, Positioning its Advanced Manufacturing Facility for Future Growth (Jun 22, 2020)
- North American Semiconductor Equipment Industry Posts May 2020 Billings (Jun 19, 2020)
- GLOBALFOUNDRIES and SkyWater Technology Sign MOU for Technology Development to Strengthen Domestic Supply Assurance for U.S. Government (Jun 19, 2020)
- Time to Think About the How and Where of Cryptography (Jun. 19, 2020)
- Where Innovation Is Happening in Geolocation: Signal Processing (Jun. 18, 2020)
- NXP Teams with TSMC on 5nm for Next-Gen Auto Platform (Jun. 18, 2020)
- Rambus Delivers 112G XSR/USR PHY on TSMC 7nm Process for Chiplets and Co-Packaged Optics in Networking and Data Center (Jun 18, 2020)
- Synopsys Collaboration with Samsung Foundry Enables Rollout of Samsung SAFE Cloud Design Platform (Jun 18, 2020)
- Distributed In-Chip Thermal Sensors Improve Multicore CPU Monitoring (Jun 18, 2020)
- Awaiting a Deal, TSMC Chairman Reiterates Support for Arizona Fab (Jun 18, 2020)
- Samsung Provides One-Stop Foundry Design Environment with the Launch of "SAFE Cloud Design Platform" (Jun 18, 2020)
- Intel's 10nm Node: Past, Present, and Future - Part 2 (Jun 18, 2020)
- Silex Insight Extends Their Crypto Coprocessor Offering by Introducing 2 New Variants (Compact & Premium) (Jun 18, 2020)
- U.S. Chip Revival Gains Traction (Jun 18, 2020)
- Automotive IC Market Forecast With Strongest CAGR Through 2024 (Jun 18, 2020)
- Intel's 10nm Node: Past, Present, and Future (Jun 18, 2020)
- Powering next-generation in-vehicle experiences with Arm Mali GPU virtualization (Jun 18, 2020)
- Picocom selects UltraSoC in-system analytics and monitoring IP for 5G New Radio small cell SoC (Jun 17, 2020)
- CREDO Announces Close of $100 Million Series D Preferred Financing as it Continues to Lead in High Performance Networking Connectivity Solutions (Jun 17, 2020)
- Autonomous Vehicles in Covid Economy (Jun. 17, 2020)
- Siemens extends Xcelerator portfolio to help transform electrical/electronic systems development (Jun. 17, 2020)
- Samsung Provides One-Stop Foundry Design Environment with the Launch of 'SAFE™ Cloud Design Platform' (Jun. 17, 2020)
- Agile Analog and EnSilica Collaborate to Improve Quality and Reliability of Microchips (Jun 16, 2020)
- Cadence Collaborates with TSMC and Microsoft to Reduce Semiconductor Design Timing Signoff Schedules with the Cloud (Jun 16, 2020)
- QuickLogic Announces Open Reconfigurable Computing Initiative (Jun 16, 2020)
- Xilinx Announces Real-Time Server Appliances for High-Quality, Low-Cost Live Video Streaming (Jun 16, 2020)
- IAR Systems enables secure code with updated MISRA C compliance in leading development tools (Jun 15, 2020)
- Embedded Hardware Security Heads to the Edge (Jun 15, 2020)
- BrainChip Successfully Launches the Akida Early Access Program (Jun 15, 2020)
- Dolphin Design unveils CHAMELEON, a revolutionary event-based MCU subsystem (Jun 15, 2020)
- Synopsys, TSMC and Microsoft Azure Deliver Highly Scalable Timing Signoff Flow in the Cloud (Jun 15, 2020)
- Intel's 10nm Node: Past, Present, and Future (Jun. 15, 2020)
- NXP Selects TSMC 5nm Process for Next Generation High Performance Automotive Platform (Jun 12, 2020)
- A guide to accelerating applications with just-right RISC-V custom instructions (Jun. 12, 2020)
- DSP Group Strengthens its Position in Rapidly Growing Headset Market with Acquisition of SoundChip SA (Jun 11, 2020)
- Truechip Announces Shipping of Performance Analyzer Tool Kit to Aaroh Labs (Jun 11, 2020)
- Arm falls out with Arm China (Jun 11, 2020)
- Silex Insight Announces Record-breaking 1.5Tb MACsec Solution To Boost Data Center and 5G Infrastructure (Jun 11, 2020)
- Total Foundry Revenue Increases by 20% YoY in 2Q20, While Market Uncertainties Remain in 2H20, Says TrendForce (Jun 11, 2020)
- Real Intent Announces Verix Multimode DFT Static Sign-Off Tool (Jun 11, 2020)
- Semiconductor Fabs to Log Record Spending of Nearly $68 Billion in 2021 After 2020 Lull, SEMI Reports (Jun 11, 2020)
- Qualcomm Retakes Market Leadership in 1Q20 Revenue Ranking of Global Top 10 IC Design Companies, Says TrendForce (Jun 11, 2020)
- SkyWater Licenses Key FDSOI Technology from MIT Lincoln Laboratory, Moves Up Availability of its 90 nm Strategic Rad-Hard by Process Offering (Jun 11, 2020)
- Efinix Completes Trion FPGA Family for Edge Computing, AI/ML and Vision Processing Applications Using Cadence Digital Full Flow Solution (Jun 11, 2020)
- Synopsys Delivers the Industry's Only Complete Workflow for Automotive Lighting Design and Visualization in CATIA (Jun 10, 2020)
- TSMC May 2020 Revenue Report (Jun 10, 2020)
- Synopsys Acquires Semiconductor Analytics Innovator Qualtera (Jun 11, 2020)
- Moortec Launches New In-Chip Technology for Highly Distributed, Real-Time Thermal Analysis on TSMC N5 Process (Jun 10, 2020)
- Arm China CEO: Good or Gone? (Jun 10, 2020)
- TSMC to Face Inventory Glut Caused by US-China Trade War (Jun. 10, 2020)
- RISC-V crypto core is qualified to ASIL-D for automotive designs (Jun. 10, 2020)
- Soitec reports full year'20 results (Jun. 10, 2020)
- Semiconductor fab spending to roar back in 2021 (Jun. 10, 2020)
- RISC-V crypto core is qualified to ASIL-D for automotive designs (Jun. 10, 2020)
- TSMC Discloses "Secret" 4nm Node (Jun 09, 2020)
- Arteris IP Advances onto List of Top 15 Semiconductor IP Vendors (Jun 09, 2020)
- SmartDV's Design and Verification Solutions Portfolio Surpasses 600 Offerings (Jun 09, 2020)
- IAR Systems and GigaDevice collaborate to bring powerful RISC-V solutions to the market (Jun 09, 2020)
- Smart and Secure Embedded Solutions for IoT Design (Jun. 09, 2020)
- Mentor joins the O-RAN ALLIANCE to help drive interoperability requirements for 5G network silicon (Jun 08, 2020)
- Andes Technology Steps Up to Premier Membership in RISC-V International; Greatly Expanding its U.S. R&D and Field Application Engineering Staffing (Jun 08, 2020)
- UMC Reports Sales for May 2020 (Jun 08, 2020)
- Sampling of 2Q Semiconductor Sales Guidance Now At -5% (Jun 08, 2020)
- GUC Monthly Sales Report - May 2020 (Jun 08, 2020)
- Configuring Processors In The Field (Jun. 08, 2020)
- The aspects of 6G that will matter to wireless design engineers (Jun. 08, 2020)
- Auto Sector Stuck in Neutral as a Few IC Makers Recover (Jun. 06, 2020)
- Huawei's proposal to replace TCP/IP is going nowhere fast (Jun. 05, 2020)
- Synopsys Accelerates FIPS 140-3 Certification with NIST-Validated True Random Number Generator IP (Jun 04, 2020)
- SmartDV Delivers New Design IP for Video, Imaging, Entertainment System Protocols (Jun 04, 2020)
- IAR Systems launches support for the RISC-V P extension for Packed-SIMD instructions (Jun 04, 2020)
- Nolam Embedded Systems discloses the MIL-STD1553 solution integrated on REFLEX CES Arria 10 SoC Module (Jun 04, 2020)
- SMIC plans to raise $2.8 billion as the US tries to hamper China's Semiconductor growth (Jun. 03, 2020)
- MediaTek Will Not Illegally Supply TSMC Chips To Huawei (Jun. 03, 2020)
- Securing the Internet of Things in a Quantum World (Jun. 03, 2020)
- Enyx launches an ultra-low latency development framework for building standardized, FPGA-based trading systems (Jun 03, 2020)
- MIPI Alliance Completes Development of A-PHY v1.0, an Industry-Standard Long-Reach SerDes Physical Layer Interface for Automotive Applications (Jun 03, 2020)
- Synopsys Introduces Industry's First Complete USB4 IP Solution (Jun 03, 2020)
- Efinix Announces Availability of Three RISC-V SoCs (Jun 03, 2020)
- Cadence Achieves Digital and Custom/Analog EDA Flow Certification for TSMC N6 and N5 Process Technologies (Jun 03, 2020)
- Green Hills Software Adds Industry-Leading Advanced Software Development Tools Support for RISC-V (Jun 03, 2020)
- GPU Market Provides a Ray (Tracing) of Hope (Jun. 03, 2020)
- The Increasingly Ordinary Task Of Verifying RISC-V (Jun. 03, 2020)
- Lattice Accelerates FPGA-Based Processor Design With New IP Ecosystem and Design Environment (Jun. 03, 2020)
- Former General Manager of GlobalFoundries China joins SMIC (Jun. 03, 2020)
- Imagination announces next-generation IEEE 802.11ax/Wi-Fi 6 IP for low-power applications (Jun 02, 2020)
- GigaDevice GD32 MCU and Amazon AWS Launch New Embedded Cloud Platform (Jun 02, 2020)
- Codasip Extends SweRV Support Package to Include Western Digital SweRV EH2 & EL2 RISC-V Cores (Jun 02, 2020)
- UltraSoC enables ultra-high-speed closed-chassis analytics and debug over Synopsys USB3 (Jun 02, 2020)
- First-Quarter 2020 Global Semiconductor Equipment Billings Up 13 Percent Year-Over-Year (Jun 02, 2020)
- NEUCHIPS Announces World's First Deep Learning Recommendation Model (DLRM) Accelerator: RecAccel (Jun 02, 2020)
- PUFsecurity IP Open Source Program: Bridging the Gap in Chip Security (Jun 02, 2020)
- Collaboration focuses on development tools for RISC-V-based MCUs (Jun. 02, 2020)
- Samsung Foundry Certifies Synopsys Design Compiler NXT for 5/4nm FinFET Process Technologies (Jun 01, 2020)
- Seamless Microsystems announces a major design-win (Jun 01, 2020)
- Cloud Computing Is Changing Everything About Electronic Design (Jun 01, 2020)
- Ambarella Adopts Cadence Clarity 3D Solver for AI Vision Processor Development (Jun 01, 2020)
- Synopsys Fusion Design Platform and DesignWare IP Selected by Baikal Electronics to Deliver Latest High-Performance Computing SoC (Jun 01, 2020)
- Global Semiconductor Sales Decrease 1.2 Percent Month-to-Month in April (Jun 01, 2020)
- Dolphin Design unveils SPIDER, a turnkey platform to accelerate the design of energy efficient power management systems (Jun 01, 2020)
- DARPA Marries IC Security with System-Level Synthesis (Jun. 01, 2020)
- Don't Let Baggage Hinder Innovation: RISC-V Lets Us Start with a Clean Slate (Jun. 01, 2020)
- Texas Instruments Maintains Firm Grip As World's Top Analog IC Supplier (May 29, 2020)
- Imagination's GPU selected by SemiDrive for automotive chip (May 29, 2020)
- eInfochips collaborates with EchoNous Inc. to develop the recently FDA-cleared KOSMOS platform (May. 29, 2020)
- TSMC to move 5nm Plus process to volume production in 4Q20 (May. 28, 2020)
- TSMC Delivers World-first 7nm Automotive Design Enablement Platform (May 28, 2020)
- Chip Equipment Becomes Trade War's Latest Battlefield (May 28, 2020)
- Khronos Group Releases OpenVG 1.1 Lite to Bring High-Quality Vector Graphics to OpenGL ES 2.0-Compatible GPUs (May 28, 2020)
- Synopsys' Silicon-Proven DesignWare DDR IP for High-Performance Cloud Computing Networking Chips Selected by NVIDIA (May 28, 2020)
- DARPA Looks to Automate Security for IC Design (May 28, 2020)
- How On-Premises Enhances your Chances of IoT Success (May. 28, 2020)
- Domain-Specific Processors Enable More Than Moore (May. 28, 2020)
- What's So Important About Processor Extensibility? (May. 28, 2020)
- Cadence to Optimize Digital Full Flow and Verification Suite for Arm Cortex-A78 and Cortex-X1 CPU Mobile Device Development (May 27, 2020)
- GOWIN Semiconductor Integrates their latest HDMI/DVI RX and TX IP into GOWIN EDA IP Generator (May 27, 2020)
- Synopsys Announces Support of TensorFlow Lite for Microcontrollers on Energy-Efficient ARC EM and ARC HS Processor IP (May 27, 2020)
- Menta joins PROMISE Consortium under the Horizon 2020 Initiative of the European Commission (May 27, 2020)
- UltraSoC and Canis Labs partner to secure the CAN bus (May 27, 2020)
- Domain Specific Accelerators Will Drive Vector Processing on RISC-V (May 27, 2020)
- Lattice and Etron Deliver Small, Low Power Reference Design for Edge AI and Video Processing Applications (May. 27, 2020)
- 5G? Wait 'Til Next Year (May. 27, 2020)
- SI semi forecast is -6% in 2020; +10-15% in 2021 (May. 27, 2020)
- CEVA to Host Online Seminar Series for Wireless Connectivity and Smart Sensing Technologies (May 26, 2020)
- GlobalFoundries Abandons Chengdu Wafer Fab (May 26, 2020)
- Synopsys Enables Tapeout Success for Early Adopters of Arm's Next Generation of Mobile IP (May 26, 2020)
- New Arm IP delivers true digital immersion for the 5G era (May 26, 2020)
- CEO Interview: Dolphin Design - FD-SOI IP Platform for Energy Efficient SoC Design for IoT, Automotive and More (May. 26, 2020)
- SMIC makes major move to complete its 7nm & 8nm processes (May. 26, 2020)
- Arm replaces CPU and GPU flagships, and more (May. 26, 2020)
- Can AI Turn Your Data Center Green? (May. 26, 2020)
- Verizon Teams Up with Movandi, NXP, Qualcomm for 5G (May. 26, 2020)
- The TSMC and Huawei Announcements Are Not as Linked as You May Think (May 25, 2020)
- Lattice sensAI 3.0 Solutions Stack Doubles Performance, Cuts Power Consumption in Half for Edge AI Applications (May 25, 2020)
- Senators Seek Suspension of TSMC US Fab Project (May 25, 2020)
- China to Fall Far Short of its "Made-in-China 2025" Goal for IC Devices (May 25, 2020)
- Do more with less energy! What's behind Dolphin Design's Energy Efficient Platforms? (May 25, 2020)
- North American Semiconductor Equipment Industry Posts April 2020 Billings (May 22, 2020)
- Panasonic Adopts Synopsys Custom Design Platform to Accelerate Next-Generation Automotive and Industrial Products (May 22, 2020)
- Gyrfalcon is Named as a Top 10 Processor for AI Acceleration at the Endpoint in 2020 by EE Times (May 22, 2020)
- China chipmaker SMIC receives $2bn state help amid Huawei ban (May. 22, 2020)
- Cobham Advanced Electronic Solutions Radiation Hardened Microelectronics Support New Xilinx XQRKU060 FPGA (May 21, 2020)
- S2C Announces New Prodigy Cloud System for Next Generation SoC Prototyping (May 21, 2020)
- Imec combines advanced machine learning algorithms and innovations in chip design to achieve cm accuracy and low-power ultra wideband localization (May 21, 2020)
- CEO interview: The importance of being agile (May 21, 2020)
- eMemory Provides Intellectual Property for Secure NB-IoT Products (May 21, 2020)
- SimpleMachines selects UltraSoC embedded analytics to support next-generation compute platform (May 21, 2020)
- Fuji Xerox Adopts Synopsys ZeBu Server for Multi-Function Printer SoC (May 21, 2020)
- Faraday Succeeds in Next-Gen Display ASIC with Display IP Solutions (May 21, 2020)
- Mirabilis Design creates the first RISC-V system-level architecture exploration solution (May. 20, 2020)
- Mirabilis Design creates the first RISC-V system-level architecture exploration solution (May 20, 2020)
- Politics Haunts TSMC's US Fab Plan (May 20, 2020)
- Imagination receives ISO 26262 statement of process conformance from HORIBA MIRA (May 20, 2020)
- GLOBALFOUNDRIES to Implement ITAR and Strict Security Assurances at its Advanced U.S. Semiconductor Manufacturing Facility (May. 20, 2020)
- TSMC US plant raises national security and competition questions, say senators (May. 20, 2020)
- SMIC Caught Between Huawei And A Hard Place (May. 20, 2020)
- Arrow Electronics, Panasonic Industry, and STMicroelectronics Join Forces to Deliver IoT Modules for Smart Applications (May. 20, 2020)
- Global IoT market to grow to $1.5trn annual revenue by 2030 (May. 20, 2020)
- Design For Narrowband IoT (May. 20, 2020)
- CEA-Leti Demos D-band RF Architecture for 6G Roadmap (May. 20, 2020)
- Synopsys Posts Financial Results for Second Quarter Fiscal Year 2020 (May. 20, 2020)
- Xilinx "Lifts Off" with Launch of Industry's First 20nm Space-Grade FPGA for Satellite and Space Applications (May 19, 2020)
- Microchip Reveals Software Development Kit and Neural Network IP for Easily Creating Low-Power FPGA Smart Embedded Vision Solutions (May 19, 2020)
- Arteris IP FlexNoC Interconnect and AI Package Licensed by Blue Ocean Smart System for AI Chips (May 19, 2020)
- CXL Protocol Adds Capabilities over PCIe (May 19, 2020)
- SiFive Partners With Coherent Logix for Mission-Critical Processor Solutions (May 19, 2020)
- Cadence Delivers 10 New Verification IP Targeting Automotive, Hyperscale Data Center and Mobile Applications (May 19, 2020)
- Microsoft announces definitive agreement to acquire Metaswitch Networks, expanding approach to empower operators and partner with network equipment providers to deliver on promise of 5G (May. 19, 2020)
- Huawei responds (May. 19, 2020)
- Mentor's Calibre and Analog FastSPICE platforms achieve certification for TSMC's newest processes (May 18, 2020)
- Synopsys and TSMC Collaborate to Enable Designs of HPC, Mobile, 5G, and AI SoCs with Certified Solutions on TSMC N5 and N6 Processes (May 18, 2020)
- Cadence Expands Design IP Portfolio with 56G Long-Reach PAM4 SerDes on TSMC N7 and N6 Processes (May 18, 2020)
- LeapMind Unveils "Efficiera", the New Ultra Low Power AI Inference Accelerator IP (May 18, 2020)
- UltraSoC appoints Jonathan Lucas as VP of Software (May 18, 2020)
- TSMC Ariz Fab a Tangled Web (May 18, 2020)
- Who Needs Autonomous Vehicles? (May. 18, 2020)
- Aspinity and Infineon partner to accelerate development of intelligent sensing products with longer lasting batteries (May 15, 2020)
- EVS Media Infrastructure adopts intoPIX JPEG-XS solution for Neuron (May 15, 2020)
- TSMC Announces Intention to Build and Operate an Advanced Semiconductor Fab in the United States (May 15, 2020)
- Louis Tannyeres, Former Senior Fellow at Texas Instruments, Appointed Executive Vice-President of Engineering at Kalray (May 14, 2020)
- CHIP Alliance's Newly Enhanced SweRV Cores Available to All for Free (May 14, 2020)
- Prophesee, DMP partner to accelerate development of embedded machine vision and artificial intelligence (AI) applications using Event-Based Vision approach (May 14, 2020)
- CAST Releases 100Gbps UDP/IP Core (May 14, 2020)
- Veriest supports the development of Arbe's innovative automotive Radar device (May 14, 2020)
- Eta Compute Partners with Edge Impulse to Accelerate the Development and Deployment of Machine Learning at the Edge (May 13, 2020)
- OpenFabrics Alliance (OFA) and Gen-Z Consortium Announce MoU Agreement (May 13, 2020)
- GigaDevice Announces a Patent Licensing Agreement with Rambus (May 13, 2020)
- Arm hardware and software ecosystems will converge at virtual Arm DevSummit, formerly known as Arm TechCon (May 13, 2020)
- Foxconn Partners with Socionext and Hailo to Launch Next-Generation AI Processing Solution for Video Analytics at the "Edge" (May 13, 2020)
- TSMC Says it Still Won't Build a Fab in the US (May. 13, 2020)
- Design Of An Ultra-Low-Power Current Steering DAC In A Modern SOI technology (May. 13, 2020)
- Associations collaborate on open standards in IoT security (May. 13, 2020)
- SMIC Reports 2020 First Quarter Results. (May 13, 2020)
- VeriSilicon VIP9000 and ZSP are Adopted by iCatch Next Generation AI-powered Automotive Image Processing SoC (May 12, 2020)
- Coherent Logix Selects Kandou's SerDes IP for its Low-Power, High-Performance C-Programmable Processors (May 12, 2020)
- Arteris IP FlexNoC Interconnect Licensed by Picocom for 5G New Radio Infrastructure Baseband SoCs (May 12, 2020)
- Perceptia Devices Offers Research License (May 12, 2020)
- SMIC Aims to Raise More Than $3B for Expansion (May 12, 2020)
- Configurable Analog Semiconductor IP Enables Faster IoT Chip Design (May 12, 2020)
- SmartDV Ships First Design and Verification IP for MIPI RFFE v3.0 Specification (May 12, 2020)
- Riedel adopts intoPIX TICO-XS FPGA IP-cores to empower broadcasts & events. (May 12, 2020)
- Exploring the 5 W’s of Full AV Stacks (May. 12, 2020)
- RISC-V International and GlobalPlatform Partner to Enhance Security Design of IoT Devices (May 11, 2020)
- Arasan Announces the Availability of MIPI D-PHY IP for TSMC 22nm Process Technology (May 11, 2020)
- CEVA, Inc. Announces First Quarter 2020 Financial Results (May 11, 2020)
- TSMC April 2020 Revenue Report (May 11, 2020)
- TSMC Expected to Rebound in 2021 on AMD Gains (May 11, 2020)
- UMC Reports Sales for April 2020 (May 11, 2020)
- Synopsys Accelerates High-Performance Computing SoC Designs with Industry's Broadest IP Portfolio for TSMC's 5nm Process Technology (May 11, 2020)
- Xylon's MPSoC Multi-Camera Vision Kit Updated (May 11, 2020)
- Dolphin Design Enables Next Generation Energy-Efficient Battery-Operated IoT Devices with New IP Platforms on TSMC 22ULL Process (May 11, 2020)
- TSMC Expects Strong Rebound in 2021 (May. 11, 2020)
- AI Drives Data Centers to the Edge (May. 11, 2020)
- RISC-V International and GlobalPlatform Partner to Enhance Security Design of IoT Devices (May. 11, 2020)
- Imagination Inquiry Exposes Wider Risk of IP Sales to China (May 07, 2020)
- Silex Insight launches Public Key Engine supporting Chinese OSCCA SM9 (May 07, 2020)
- Imagination Technologies and BAIC Capital announce automotive joint venture (May 07, 2020)
- Veridify Security's DOME Client Library Achieves PSA Certified Level 1 Accreditation (May 07, 2020)
- MIPI RFFE v3.0 Delivers Tighter Timing Precision and Reduced Latencies Needed for Successful 5G Rollouts (May 07, 2020)
- Omni Design Appoints Satris Group as Sales Representative in Israel (May 06, 2020)
- HiSilicon First China-Based Semi Supplier to be Ranked in Top-10 (May 06, 2020)
- SmartDV's LPDDR5 IP Clocks 612 MHz in FPGA Functional Test, 1.6GHz at 28nm (May 06, 2020)
- SynSense (formerly aiCTX) closes Series A Round and announces the opening of offices in China (May 06, 2020)
- SMIC Seeks to Raise More Capital, This Time on STAR Market (May. 06, 2020)
- Synopsys Announces Earnings Release Date for Second Quarter Fiscal Year 2020 (May. 06, 2020)
- Alphawave IP Announces Record FY2019, Record 1Q2020 and Dramatic Hiring Plans for Remainder of 2020 and beyond (May 05, 2020)
- Faraday's SoCreative!V Platform Accelerates SoC Development in Edge Applications (May 05, 2020)
- Imagination Previews Shifting Views Prior to UK Hearing (May 05, 2020)
- Xilinx Teams with Leading Universities Around the World to Establish Adaptive Compute Research Clusters (May 05, 2020)
- Global Semiconductor Sales Decrease 3.6 Percent in First Quarter of 2020 (May 05, 2020)
- Rambus Reports First Quarter 2020 Financial Results (May 05, 2020)
- GUC Monthly Sales Report - Apr 2020 (May 05, 2020)
- TSMC Reportedly Gets Major Orders for NVIDIA's Next-Generation 7 Nm Ampere and 5 Nm Hopper GPUs (May. 05, 2020)
- OmniVision Launches Automotive SoC for Entry-Level Rearview Cameras With Industry's Best Low-Light Performance, Lowest Power and Smallest Size (May. 05, 2020)
- New Wave Design and Verification Acquires FlightWire (May 04, 2020)
- Palma Ceia SemiDesign Tapes Out 802.11ax Transceiver for Wi-Fi 6 (May 04, 2020)
- Aldec's New HES FPGA Accelerator Board Targets HPC, HFT and Prototyping Applications plus Hits the "Price/Performance" Sweet Spot (May 04, 2020)
- Is IPO in China Imagination's Only Possible Exit Path? (May 04, 2020)
- Arbe Launches Automotive Grade Imaging Radar Processor Chip (May 04, 2020)
- NVE Introduces Noncontact ABZ TMR Magnetic Encoder Sensor (May 04, 2020)
- Dolphin Design unveils its innovative Energy Efficient Platforms, complete turnkey solutions for competitive SoC designs (May 04, 2020)
- PLDA Announce Complete Support for CXL and Gen-Z protocols (May 04, 2020)
- Global Silicon Wafer Area Shipments Edge Up in First Quarter 2020 Despite COVID-19 Headwinds (May 04, 2020)
- Covid-19 and America's Vulnerabilities - A Way Forward (May 04, 2020)
- Wave Computing Files for Chapter 11 Protection (May 04, 2020)
- Imagination Technologies: Evidence to the Foreign Affairs Committee (May 04, 2020)
- CMC Designates Leti’s L-UTSOI Standard Model as Chip Industry FD-SOI Standard (May. 04, 2020)
- VESA Releases Updated DisplayPort Alt Mode Spec to Bring DisplayPort 2.0 Performance to USB4 and New USB Type-C Devices (Apr 30, 2020)
- Rambus Announces Complete 800G MACsec Solution for Enhanced Data Center and 5G Infrastructure Security (Apr 30, 2020)
- Imagination supports Google Android GPU Inspector (Apr 30, 2020)
- SmartDV Expands Line of Memory Controller Design IP, strengthening its Already Broad Portfolio of IP Products (Apr 30, 2020)
- Picocom License CEVA DSP for 5G New Radio Infrastructure SoC (Apr 30, 2020)
- SiFive Joins Open COVID Pledge to Fight Global Pandemic (Apr 30, 2020)
- Imagination showcases groundbreaking new safety-critical driver (Apr 29, 2020)
- Total Foundry Revenue to Undergo Single-Digit Growth in 2020, Owing to Deferred Seasonality from COVID-19 (Apr 29, 2020)
- Memory Market Not Forecast to Exceed 2018 High of $163.3B until 2022 (Apr 29, 2020)
- NXP Announces General Availability of the Arm Cortex-M33-based LPC551x/S1x MCU Family (Apr 29, 2020)
- Multi-Constellation GNSS IP licensed to a US Semi-Conductor company for integration into a ultra-low power cellular IOT chip by T2M (Apr 29, 2020)
- Silicon Catalyst Collaborates with Arm to Accelerate Semiconductor Startups (Apr 29, 2020)
- Arm offers silicon startups zero-cost access to the world's most widely used chip designs (Apr 29, 2020)
- PathPartner Joins the Bureau of Indian Standards’ Artificial Intelligence Sectional Committee (Apr. 29, 2020)
- Why Software Matters in the Age of AI? (Apr. 29, 2020)
- Rianta Releases 400G MACsec IP Core for Ethernet Security Acceleration ASICs and SoCs (Apr 28, 2020)
- OmniVision Unveils World's First 0.7 Micron, 64 Megapixel Image Sensor for Ultra Thin, High End Smartphones (Apr 28, 2020)
- Imec Builds World's First Spiking Neural Network-Based Chip for Radar Signal Processing (Apr 28, 2020)
- Synopsys Introduces 3DIC Compiler, Industry's First Unified Platform to Accelerate Multi-die System Design and Integration (Apr 28, 2020)
- MediaTek to Enable Cutting-edge AV1 Video Codec Technology on Android Smartphones (Apr 28, 2020)
- Khronos Group Releases OpenCL 3.0 (Apr 28, 2020)
- Mixel's MIPI D-PHY IP Integrated into the Lattice CrossLink-NX FPGA (Apr 28, 2020)
- Wave Computing Set to File Chapter 11, With MIPS the Likely Winner (Apr 27, 2020)
- CFX announces commercial availability of anti-fuse OTP technology on CanSemi 0.18um Logic process (Apr 27, 2020)
- North American Semiconductor Equipment Industry Posts March 2020 Billings (Apr 27, 2020)
- GLOBALFOUNDRIES Dresden Certified to Manufacture Secure Products (Apr 27, 2020)
- CFX announces commercial availability of anti-fuse OTP technology on CanSemi 0.18um Logic process (Apr. 27, 2020)
- Renesas Releases Major Update of Flexible Software Package Supporting RA Family of 32-Bit Arm Cortex-M Microcontrollers (Apr 23, 2020)
- Chips&Media Now Reveals c.WAVE120 - New Generation of Super-Resolution HW IP (Apr 23, 2020)
- Codasip Releases Support Package for Western Digital's First RISC-V SweRV Core (Apr 23, 2020)
- Faraday Reports First Quarter 2020 Revenues at NT$1,265 Million (Apr 23, 2020)
- Why Apple needs to ditch Intel for ARM or RISC (Apr. 23, 2020)
- Korean Ministry of SMEs and Startups selects Arm Flexible Access to support local startup companies (Apr 22, 2020)
- IC Unit Shipments Forecast to Display First-Ever Back-to-Back Decline (Apr 22, 2020)
- Debunking the Myth of China's AI Superiority (Apr. 22, 2020)
- Imagination Commits to Keeping U.K. HQ - For Now (Apr 21, 2020)
- Silex Insight takes another key step to strengthen its presence in Israel by partnering with Beyond Electronics (Apr 21, 2020)
- Faraday Releases Licensable Gigabit Ethernet PHY on UMC 40LP Platform (Apr 21, 2020)
- New York Institute of Technology - Vancouver Develops Secure Boot Application for Gowin SecureFPGA (Apr 21, 2020)
- Imperas Leading RISC-V CPU Reference Model for Hardware Design Verification Selected by Mellanox (Apr 21, 2020)
- Cadence Reports First Quarter 2020 Financial Results (Apr 21, 2020)
- SiPearl signs a major licensing agreement with Arm for the development of its first-generation of microprocessors (Apr 21, 2020)
- CEVA Wins 2019 CEM Editor's Choice Award for its Bluetooth 5 IP (Apr 21, 2020)
- Unlocking AI on Arm Microcontrollers with Deep Learning Model Optimization (Apr. 21, 2020)
- Global Semiconductor Sales in February Down 2.4 Percent Month-to-Month: SIA (Apr. 21, 2020)
- 5G and HPC Drive 45% Q1 Revenue Growth at TSMC (Apr 20, 2020)
- Silvaco Leverages Deep SOI Roots (Apr. 17, 2020)
- Arm receives first high assurance Common Criteria security certification for soft processor IP (Apr. 17, 2020)
- TSMC Reports First Quarter EPS of NT$4.51 (Apr 16, 2020)
- Samsung and Xilinx Team Up for Worldwide 5G Commercial Deployments (Apr 16, 2020)
- Virtual Conference Delivers Real Chips (Apr. 16, 2020)
- GLOBALFOUNDRIES Qualifies Synopsys' IC Validator for Signoff Verification on 22FDX Platform (Apr 16, 2020)
- Arm enables global IoT proliferation through Pelion IoT platform ecosystem expansion (Apr 15, 2020)
- UltraSoC and Agile Analog collaborate to detect physical cyber attacks (Apr 15, 2020)
- Gartner Says Worldwide Semiconductor Revenue Declined 12% in 2019 (Apr 15, 2020)
- Kandou Named One of Europe's Most-Promising Growth Companies (Apr 15, 2020)
- Huawei Moves 14 nm Silicon Orders from TSMC to SMIC (Apr. 15, 2020)
- Hardware and Software Puzzle Pieces Fall Into Place for Binarized AI (Apr. 15, 2020)
- Neuromorphic Computing vs AI Chips: Compete or Complement? (Apr. 15, 2020)
- Xylon Expands Its Offer of FMC Expansion Boards Featuring High-Speed Serial Links for FPGA Based Multi-Camera Automotive Application Development (Apr 14, 2020)
- Gradual Rebound or Slight Dip - Two Scenarios for COVID-19 Impact to 2020 Global Silicon Wafer Market Sales (Apr 14, 2020)
- CEVA Wins 2019 CEM Editor's Choice Award for its Bluetooth 5 IP April 14, 2020 RivieraWaves Bluetooth 5 IP recognized as "the most competitive IoT solution in China" MOUNTAIN VIEW, Calif., April 14, 2020 /PRNewswire/ -- CEVA, Inc. (NASDAQ: CEVA), the le (Apr 14, 2020)
- Softbank Vision Fund loses $16.7bn of its value (Apr 14, 2020)
- Does China Have Imagination? (Apr 14, 2020)
- Imagination Drops CEO, What Next? (Apr 14, 2020)
- 2019 Global Semiconductor Equipment Sales Slip 7 Percent to $59.8 Billion, SEMI Reports (Apr 14, 2020)
- BrainChip and Socionext expect Akida silicon in Q3 (Apr. 14, 2020)
- Port GmbH extends its CANopen driver portfolio and supports the "STMicroelectronics STM32G4xx family" (Apr. 14, 2020)
- Samsung Display closes part of Vietnamese plant to curb coronavirus spread (Apr. 14, 2020)
- Samsung Demonstrates the Full Potential of 5G mmWave with Speeds of 8.5Gbps Across Multiple Devices (Apr. 14, 2020)
- Groq Adopts Synopsys ZeBu Server 4 to Develop Breakthrough AI Chip (Apr 13, 2020)
- Taiwan IC design houses cautious about 3Q20 (Apr. 10, 2020)
- TSMC March 2020 Revenue Report (Apr 10, 2020)
- UMC Reports Sales for March 2020 (Apr 10, 2020)
- Global IC Market Forecast Lowered From 3% to -4% (Apr 10, 2020)
- Flex Logix Discloses Real-World Edge AI Inference Benchmarks Showing Superior Price/Performance For All Models (Apr 10, 2020)
- Imagination Technologies commits to the UK as it looks to accelerate growth in new areas of technological innovation (Apr 10, 2020)
- Covid 19 impact on the Semi-Conductor world : D&R Review (Apr. 09, 2020)
- Gartner Forecasts Worldwide Semiconductor Revenue to Decline 0.9% in 2020 Due to Coronavirus Impact (Apr 09, 2020)
- COVID-19: Economic and Microelectronics Industry Impacts - Insights from McKinsey & Company (Apr 09, 2020)
- Two Months in Hubei, Quarantined Away from Home (Apr 09, 2020)
- Xilinx Appoints Brice Hill as Chief Financial Officer (Apr 09, 2020)
- Vuzix Joins Qualcomm Smart Cities Accelerator Program (Apr. 09, 2020)
- Flex Logix Announces nnMAX IP Delivers Higher-Throughput/$ and Higher Throughput/Watt for Key DSP Functions (Apr 08, 2020)
- BrainChip Announces Wafer Fabrication of the Akida System-on-Chip (Apr 08, 2020)
- Welcome to the Third Era of 32/64-bit Embedded CPUs (Apr 08, 2020)
- x86 Lacks Innovation, Arm is Catching up. Enough to Replace the Giant? (Apr. 08, 2020)
- Startup Finds Ways to Bring AI to the Edge (Apr. 08, 2020)
- Securing IoT in the Quantum Age (Apr. 08, 2020)
- SK Hynix Releases PE8000 NVMe PCIe Gen4 SSD - PCIe 4.0 up to 6,500 MB/sec (Apr. 08, 2020)
- China tops 2019 patent filings (Apr. 08, 2020)
- Seeing AI to AI: NVIDIA Deepens Ties with Top Research Center (Apr. 08, 2020)
- Mirabilis Design is making the standard training class on Model-based System Simulation and Electronic System-Level Design for free (Apr 07, 2020)
- Synopsys Introduces New 64-bit ARC Processor IP Delivering Up to 3x Performance Increase for High-End Embedded Applications (Apr 07, 2020)
- CEVA Announces Industry's First High Performance Sensor Hub DSP Architecture (Apr 07, 2020)
- MaxLinear to acquire Intel's Home Gateway Platform Division (Apr 07, 2020)
- Imagination Tech's Fate Hangs as Chinese Investors Assert Rights (Apr 07, 2020)
- Taiwan Semiconductor: Visibility May Be Limited In The Near-Term, But Long-Term Growth Outlook Is Favorable (Apr. 07, 2020)
- Tenstorrent Takes AI by Storm (Apr. 07, 2020)
- Infineon receives final green light for its acquisition of Cypress (Apr. 07, 2020)
- Global Semiconductor Sales in February Down 2.4 Percent Month-to-Month (Apr 06, 2020)
- HEVC Advance Passes 10,000 Patent Milestone - announces Toshiba Corp. Joins as a Licensor (Apr 06, 2020)
- 25 Gigabit Ethernet Consortium Rebrands to Ethernet Technology Consortium; Announces 800 Gigabit Ethernet (GbE) Specification (Apr 06, 2020)
- GUC Monthly Sales Report - March 2020 (Apr 06, 2020)
- Perceive Corporation Launches to Deliver Data Center-Class Accuracy and Performance at Ultra-Low Power for Consumer Devices (Apr 06, 2020)
- Faraday Adopts Synopsys' Platform Architect and Hybrid Prototyping Solutions to Expand Design Services (Apr 06, 2020)
- eInfochips to Exhibit and Present at Design & Reuse IP-SoC Silicon Valley 2020 (Apr 03, 2020)
- Strategic Investment of NXP in Kalray (Apr 03, 2020)
- CXL Consortium and Gen-Z Consortium Announce MOU Agreement (Apr 03, 2020)
- Silex Insight launches Chinese OSCCA high performance (400 Gbps) SM4 Crypto Core (Apr 02, 2020)
- Sensors: Heart of the Robotic Mobility Disruption (Apr. 02, 2020)
- Compact Model Developed at CEA-Leti for FD-SOI Technologies Designated as a Chip-Industry Standard (Apr 02, 2020)
- Synopsys Expands Collaboration with Broadcom for 7nm and 5nm Designs (Apr 02, 2020)
- BrainChip Introduces Company's Event-Based Neural-Network IP and NSoC Device at Linley Processor Virtual Conference (Apr 02, 2020)
- Allegro DVT AV1 Encoder and Decoder Hardware IPs Embedded in Products by End of 2020 (Apr 02, 2020)
- Leading Industry Veteran Joins SiFive as Chief Financial Officer (Apr 02, 2020)
- GF eMRAM on 22FDX for IoT, Automotive Now in Production (Apr. 02, 2020)
- MagnaChip Semiconductor Announces Definitive Agreement To Sell Foundry Business and Fab 4 (Apr 01, 2020)
- Hardent Joins Forces with Maojet & Fujisoft To Expand Presence in Asia (Apr 01, 2020)
- SEGGER announces comprehensive support for SiFive Insight debug/trace platform (Apr 01, 2020)
- Intel shines amidst the carnage of the 2019 semiconductor market (Apr 01, 2020)
- XMOS and Plumerai partner to accelerate commercialisation of binarized neural networks (Apr. 01, 2020)
- COVID-19 to significantly impact semiconductor market in 2020 (Apr. 01, 2020)
- Imagination announces new mobile graphics teaching course for 2020 (Mar 31, 2020)
- Andes Technology Announces over 5 Billion Cumulative Shipments of SoCs Embedded with Its CPU IP since Company Inception (Mar 31, 2020)
- Synopsys Expands DesignWare MIPI IP Portfolio with Silicon-Proven, Integrated C-PHY/D-PHY IP Solution in FinFET Processes (Mar 31, 2020)
- Veriest International On-line Verification Meetup (Mar. 31, 2020)
- Global Semiconductor Materials Market Revenues Slip 1.1 Percent in 2019, SEMI Reports (Mar 31, 2020)
- SMIC Announces 2019 Annual Results (Mar. 31, 2020)
- TSMC postpones 3nm process plans by 4 months, at least (Mar. 31, 2020)
- New Case Study from Cobham Advanced Electronic Solutions Touts Everspin's Toggle MRAM as a Highly Reliable Memory Technology for Space Applications (Mar. 31, 2020)
- Silvaco Delivers New Generation of MIPI I3C Sensor Connectivity IP (Mar 30, 2020)
- TrendForce Presents Latest Analysis (Updated March 2020) of COVID-19 Pandemic's Impact on Global High-Tech Industries (Mar 30, 2020)
- Dolphin Design attacks the Taiwanese and Japanese markets with an exclusive sales representative (Mar 30, 2020)
- 5G Rollout Will Slow as Standards Work is Suspended (Mar 30, 2020)
- Arm Researcher wins IEEE ComSoc Award in Parliament | STEM for Britain 2020 (Mar. 30, 2020)
- Vervesemi Data converters for 5G applications Now Available on 8nm Process (Mar 27, 2020)
- 100 IC Wafer Fabs Closed or Repurposed Since 2009 (Mar 27, 2020)
- TSN Switch IP for GbE (10GbE) (Mar 27, 2020)
- Rambus Licenses DPA Countermeasures to Utimaco (Mar 26, 2020)
- New Microchip MCU Enables Secure Boot Protection from SPI Flash (Mar. 26, 2020)
- Achronix Selects Synopsys' Leading DesignWare IP Solutions to Accelerate Development of High-Performance Data Acceleration FPGA (Mar 26, 2020)
- Software-Based Encryption at Hardware Level for IoT Security delivered by IKV, based on Intrinsic ID's BroadKey (Mar 26, 2020)
- Vidatronic and Everest Sales and Solutions Join Forces to Expand Sales Coverage Through Mexico and Central America (Mar 26, 2020)
- Stop, Cut or Maintain European Chip Production Amid Covid-19 (Mar 25, 2020)
- Synopsys above ARM in IP licensing revenue in 2019 (Mar 25, 2020)
- SiFive Selects Synopsys Fusion Design Platform and Verification Continuum Platform to Enable Rapid SoC Design (Mar 25, 2020)
- ESD Alliance Reports EDA Industry Revenue Increase for Q4 2019 (Mar 25, 2020)
- TSMC may revise 2020 outlook (Mar. 25, 2020)
- Next-Generation of AI Processors Featured at Linley Spring Processor Conference (Mar. 25, 2020)
- Artificial Intelligence, 5G: How Beijing is preparing for its post-coronavirus economic recovery (Mar. 25, 2020)
- How 5G+AI+AR Will Create Next-Gen Protection Against Pandemics (Mar. 25, 2020)
- Apple reportedly accelerating production relocation (Mar. 25, 2020)
- Efficient computing for AI and autonomous cars (Mar. 25, 2020)
- Arteris IP FlexNoC Interconnect Again Licensed by NETINT Technologies for Codensity Enterprise SSD Controllers (Mar 24, 2020)
- InterMotion Technology boosts IP verification productivity for Lattice Semiconductor's CrossLink FPGA family using Aldec's Active-HDL (Mar 24, 2020)
- CEVA Announces DSP and Voice Neural Networks Integration with TensorFlow Lite for Microcontrollers (Mar 24, 2020)
- Enea and Ampere Partner on Arm-based uCPE Solution for Telco Edge (Mar 24, 2020)
- Neural net accelerates IC design placement (Mar. 24, 2020)
- Synopsys Delivers Industry's First Ethernet 800G Verification IP for Next-Generation Networking and Communications Systems (Mar 23, 2020)
- BrainChip and Socionext Provide a New Low-Power Artificial Intelligence Platform for AI Edge Applications (Mar 23, 2020)
- India Doesn't Need Its Own Fab (Mar 23, 2020)
- Global Top 10 IC Designers' 2019 Revenues Drop by 4.1% YoY, as Industry Growth to Face Challenges from COVID-19 Pandemic in 2020, Says TrendForce (Mar 23, 2020)
- Foundry Revenue Estimated to Grow by 30% YoY in 1Q20, while COVID-19 Pandemic May Hinder Future Market Demand, Says TrendForce (Mar 23, 2020)
- Faraday's 28Gbps SerDes IP Now Available on UMC's 28HPC Process (Mar 23, 2020)
- Intel Scales Neuromorphic Computer to 100 Million Neurons (Mar 23, 2020)
- 'Electronic Nose' Inspired by Neuromorphic Technology (Mar. 23, 2020)
- COVID-19 To Have Significant Effect on Worldwide Semiconductor Market in 2020, According to IDC (Mar 19, 2020)
- Inomize Selects Synopsys' Silicon-Proven 56G Ethernet PHY IP for High-Performance Computing and Communications SoC Design (Mar 19, 2020)
- Data Demands Drive Co-Packaged Silicon and Optics for Switch Fabrics (Mar 19, 2020)
- RISC-V is Here to Stay (Mar. 19, 2020)
- Codasip Awarded European Union Horizon 2020 Funding for Developing New RISC-V Processors (Mar 18, 2020)
- Blu Wireless announces the availability of its 60GHz mmWave evaluation kit (Mar 18, 2020)
- TOSHIBA announced a Microcontroller employing Floadia's SONOS type Flash Memory IP "G1" (Mar 18, 2020)
- New Highly Optimised LDPC Decoder in Software for Intel's FlexRAN Reference Software Will Increase Throughput by up to 3X (Mar 18, 2020)
- Blu Wireless announces the availability of its 60GHz mmWave evaluation kit (Mar 18, 2020)
- Trace and debug claim for RISC-V IP challenged by UltraSoC (Mar. 18, 2020)
- Open source of trouble: China's efforts to decouple from foreign IT technologies (Mar. 18, 2020)
- Intel Scales Neuromorphic Research System to 100 Million Neurons (Mar. 18, 2020)
- Covid-19: The Power of Big Data and AI (Mar. 18, 2020)
- Cadence Elects Ita Brennan and Lewis Chew to Board of Directors (Mar 17, 2020)
- Socionext Prototypes Low-Power AI Chip with Quantized Deep Neural Network Engine (Mar 17, 2020)
- SMIC Graduating from 14nm to Something Sort of Akin to 7nm (Mar 17, 2020)
- Bragi and CEVA Collaborate to Redefine Hearable Devices (Mar 17, 2020)
- SiFive Launches Advanced Trace and Debug Portfolio, SiFive Insight (Mar 17, 2020)
- Cadence Digital Full Flow Optimized to Deliver Improved Quality of Results with Up to 3X Faster Throughput (Mar 17, 2020)
- Faraday Delivers System-Level ESD Protection Service to Reduce ASIC Time-to-Market (Mar 17, 2020)
- Apple partner TSMC considers building powerful new chipsets in the U.S. (Mar. 17, 2020)
- Chip making goes on at GlobalFoundries amid coronavirus (Mar. 17, 2020)
- CEA-Leti Leading: Interview with CEO Emmanuel Sabonnadiere (Mar. 17, 2020)
- Smart and Secure Embedded Solutions for IoT Design (Mar. 17, 2020)
- eMemory Launches Reprogrammable NVM Solution on TSMC Platform (Mar 16, 2020)
- Synopsys Unveils RTL Architect To Accelerate Design Closure (Mar 16, 2020)
- DAeRT: eInfochips' DFT Framework that Increases Productivity and Reduces Silicon Development Cycle (Mar 16, 2020)
- Covid-19 and The Success Story of Taiwan (Mar 16, 2020)
- Silicon Labs to Expand Leading IoT Wireless Platform with Acquisition of Redpine Signals' Connectivity Business (Mar 13, 2020)
- Wireless SoCs Get Hardware Security (Mar. 12, 2020)
- QuickLogic's eFPGA Qualified on GLOBALFOUNDRIES 22FDX Platform for IoT and Edge AI Applications (Mar 12, 2020)
- Cadence Tensilica HiFi IP Accelerates AI Deployment with Support for TensorFlow Lite for Microcontrollers (Mar 12, 2020)
- Everspin Technologies and GLOBALFOUNDRIES Extend MRAM Joint Development Agreement to 12nm (Mar 12, 2020)
- OPENEDGES announces a strategic partnership with The Six Semiconductor Inc to provide a complete GDDR6 memory interface solution (Mar 11, 2020)
- "Black Swan" Event Triggers Revision to 2020 IC Market Forecast (Mar 11, 2020)
- Xilinx Announces World's Highest Bandwidth, Highest Compute Density Adaptable Platform for Network and Cloud Acceleration (Mar 11, 2020)
- TSMC expected to start mass production of 5nm chips in April (Mar. 11, 2020)
- Andes to Presents Andes Custom Extensions to the RISC-V V5 CPU Core for Creating Highly Competitive True Wireless Stereo SoC Designs (Mar. 11, 2020)
- RISC-V Foundation Announces Ratification of the Processor Trace Specification (Mar. 11, 2020)
- Synopsys Advances State-of-the-Art in Electronic Design with Revolutionary Artificial Intelligence Technology (Mar 11, 2020)
- Ambiq Micro's Next-Generation Subthreshold Power-Optimized Technology (SPOT) Platform Features CEVA's Bluetooth Low Energy IP (Mar 10, 2020)
- TSMC February 2020 Revenue Report (Mar 10, 2020)
- Synopsys Custom Design Platform Secures Full-flow Displacement of Legacy Design Tools at Alphawave (Mar 10, 2020)
- AI Sound Recognition on a Cortex-M0: Data is King (Mar. 10, 2020)
- Infineon gets go ahead for Cypress acquisition (Mar. 10, 2020)
- Dover Microsystems and Cadence Partner to Deliver Secure Processing with Silicon-Layer Security for Mission-Critical Applications (Mar 09, 2020)
- Global Fab Equipment Spending Poised for 2021 Record High (Mar 09, 2020)
- Cadence Collaborates with STMicroelectronics on Networking, Cloud and Data Center Electronics (Mar 09, 2020)
- U.S. Considers Blocking Infineon's Purchase of Cypress (Mar 09, 2020)
- Transistor Count Trends Continue to Track with Moore's Law (Mar 09, 2020)
- UMC Reports Sales for February 2020 (Mar 09, 2020)
- AI Chipmaker Hailo Raises $60 Million in Series B Funding (Mar 09, 2020)
- RISC-V Foundation Announces Ratification of the Processor Trace Specification (Mar 09, 2020)
- Samsung Adopts Synopsys' Machine Learning-Driven IC Compiler II for its Next-Generation 5nm Mobile SoC Design (Mar 05, 2020)
- UMC certifies Mentor product lines for its new 22nm ultra-low-power process technology (Mar 05, 2020)
- Faraday Announces Low-DPPM Solution for a Wide Range of ASIC Applications (Mar 05, 2020)
- GUC Monthly Sales Report - Feb 2020 (Mar 05, 2020)
- Tessolve strengthens its VLSI Design services with the acquisition of T&VS (Mar 05, 2020)
- MediaTek and Samsung Introduce World's First Wi-Fi 6 8K TV (Mar 05, 2020)
- HBM Flourishes, But HMC Lives (Mar 05, 2020)
- Veriest contributes to the verification of Nuvoton's Computing MCU devices (Mar 04, 2020)
- Defacto Announces STAR 8.0 and Provides a Unified "All-in-One" SoC Design Solution to Help Conciliating Between RTL, IP-XACT, UPF, SDC, and Physical Design Information (Mar 04, 2020)
- Mellanox to Acquire World Leading Network Intelligence Technology Developer Titan IC to Strengthen Leadership in Security and Data Analytics (Mar 04, 2020)
- CEVA Unveils World's Most Powerful DSP Architecture (Mar 04, 2020)
- Intel is accelerating its shift to 7nm/5nm to compete with TSMC and AMD (Mar. 04, 2020)
- Soitec's engineered substrates for 5G (Mar. 04, 2020)
- How Secure Is Your LoRaWAN IoT Device? (Mar. 04, 2020)
- GlobalFoundries promises embedded MRAM on state-of-the-art FD-SOI node (Mar. 04, 2020)
- Ampere Altra - Industry's First 80-Core Server Processor Unveiled (Mar 03, 2020)
- Xilinx Launches Industry's First SmartNIC Platform Bringing Turnkey Network, Storage and Compute Acceleration to Cloud Data Centers (Mar 03, 2020)
- TSMC and Broadcom Enhance the CoWoS Platform with World's First 2X Reticle Size Interposer (Mar 03, 2020)
- Changing the game for cloud computing with Neoverse (Mar. 03, 2020)
- Blu Wireless appoints Alan Jones as new Chief Executive Officer (Mar 02, 2020)
- Fraunhofer IIS brings comprehensive MPEG audio codec suite to NXP Semiconductors (Mar 02, 2020)
- VeriSilicon Hantro Video and ZSP IP are Adopted by ASPEED Cupola360 Image Processor SoC (Mar 02, 2020)
- Marvell Announces OCTEON TX2 Family of Multi-Core Infrastructure Processors (Mar 02, 2020)
- Espressif's 240MHz ESP32-S2 SoCs, Modules, and Boards Enter Mass Production with RISC-V Coprocessor (Mar. 02, 2020)
- VeriSilicon and MicroEJ Join Forces to Accelerate Hardware IP Innovation, Thanks to Software Virtualization Leveraging 10 Million Software Engineers Worldwide (Feb 27, 2020)
- ESD Alliance Welcomes Avery Design Systems to Member Community (Feb 27, 2020)
- Zhuhai Chuangfeixin eNOR embedded Flash Memory IP Solution and 128M bits SPI NOR Flash Qualified in 55nm Floating-Gate Flash Process (Feb 27, 2020)
- Semiconductor Units To Rebound, Exceed 1 Trillion Devices Again in 2020 (Feb 27, 2020)
- Graphcore secures additional $150 million in new capital Reports Fiscal 2019 business highlights (Feb 27, 2020)
- PRO DESIGN Launches New proFPGA XCVU37P FPGA Module for Prototyping and Verification of High Bandwidth Memory Designs (Feb 27, 2020)
- Synopsys Announces Next-Generation VC SpyGlass RTL Static Signoff Platform (Feb 27, 2020)
- GLOBALFOUNDRIES Delivers Industry's First Production-ready eMRAM on 22FDX Platform for IoT and Automotive Applications (Feb 27, 2020)
- Samsung Begins Mass Production of Industry's First 16GB LPDDR5 DRAM for Next-Generation Premium Smartphones (Feb 27, 2020)
- Winbond Electronics and Secure-IC in Partnership for Embedded Cybersecurity (Feb 26, 2020)
- Menta and Secure-IC partner to optimize embedded cybersecurity (Feb 26, 2020)
- UltraSoC wins Security Award for Bus Sentinel hardware cybersecurity IP (Feb 26, 2020)
- Cadence Announces Industry's First Verification IP for PHY Covering Multiple Protocols (Feb 26, 2020)
- SensiML Delivers AI-Based Sensor Algorithms for IoT Endpoints Using NXP's i.MX RT Crossover MCUs (Feb. 26, 2020)
- All Processing Bends Toward AI (Feb. 26, 2020)
- Artificial Intelligence Innovation in Taiwan (Feb. 26, 2020)
- OpenHW Group Celebrates Rapid Growth to 40+ Members and New Open-Source Processor Implementations Less Than a Year After Launch (Feb 25, 2020)
- SambNova Systems Announces $250 Million Series C as it Continues to Set a New Course for the Future of Enterprise Computing (Feb 25, 2020)
- Titan IC and Decooda Announce Strategic Partnership to Accelerate Cloud-based Data Analytics for Intelligent Customer Experience Solution (Feb 25, 2020)
- Synopsys Delivers Silicon-Proven HBM2E PHY IP Operating at 3.2 Gbps (Feb 25, 2020)
- BrainChip Featured in ActualTech Media's Emerging AI/ML and Data Science EcoCast (Feb. 25, 2020)
- RISC-V gaining ground (Feb. 25, 2020)
- RISC-V reference models support processor verification (Feb. 25, 2020)
- Optimizing Automotive Augmented Reality Applications (Feb. 25, 2020)
- Safety in cars: Infineon's AURIX™ is the first embedded safety controller worldwide to be ASIL-D certified according to ISO 26262:2018 (Feb. 25, 2020)
- Record shipments of Arm-based chips in previous quarter (Feb. 25, 2020)
- UltraSoC launches CAN Sentinel to boost automotive cybersecurity (Feb 24, 2020)
- Arasan Announces immediate availability of its SUREBOOT xSPI Host IP (Feb 24, 2020)
- Intel Announces Unmatched Portfolio for 5G Network Infrastructure (Feb 24, 2020)
- Titan IC Unveils Enhancements to RXP Hardware Search Acceleration Engine at RSA Conference (Feb 24, 2020)
- Hex Five Announces MultiZone Security for Arm Cortex?M Series Processors (Feb 24, 2020)
- Goodix License and Deploy CEVA Bluetooth Low Energy IP in SoCs Targeting Wearables, Mobile Devices, the Internet of Things (Feb 24, 2020)
- Xilinx Recommends Rejection of TRC Capital's "Mini-Tender" Offer (Feb 24, 2020)
- North American Semiconductor Equipment Industry Posts January 2020 Billings (Feb 24, 2020)
- NXP Announces Lead Partnership for Arm Ethos-U55 Neural Processing Unit for Machine Learning (Feb 24, 2020)
- Imperas Collaborates with Mentor on RISC-V Core RTL Coverage Driven Design Verification Analysis (Feb 24, 2020)
- Mobiveil Announces Availability of Compute Express Link (CXL) IP (COMPEX) for High-Performance Applications (Feb 24, 2020)
- Imperas announce first reference model with UVM encapsulation for RISC-V verification (Feb 24, 2020)
- GLOBALFOUNDRIES and GlobalWafers Sign MOU to Increase Capacity, Supply of 300mm SOI Wafers (Feb 24, 2020)
- Hex Five Announces MultiZone Security for Arm Cortex-M Series Processors (Feb 24, 2020)
- Why you should care about Bluetooth LE Audio (Feb. 24, 2020)
- Movellus Names Semiconductor Industry Veteran Ken Wagner to Lead Engineering Team (Feb 20, 2020)
- Weebit Nano and Silvaco Develop New Simulation Capabilities to Increase ReRAM Adoption (Feb 20, 2020)
- Gowin Semiconductor Adds Ubuntu Support to their Gowin EDA FPGA Software for Improved Artificial Intelligence and IoT Development Toolchain Integration (Feb 20, 2020)
- STMicroelectronics and TSMC Collaborate to Accelerate Market Adoption of Gallium Nitride-Based Products (Feb 20, 2020)
- Synopsys Posts Financial Results for First Quarter Fiscal Year 2020 (Feb 20, 2020)
- Bluespec's RISC-V Factory Proves Its Dependable Productization, Helping Calligo Technologies Harness RISC-V for Posit-enabled Computing (Feb 20, 2020)
- Revenue per Wafer Rising As Demand Grows for sub-7nm IC Processes (Feb 20, 2020)
- Dialog Semiconductor to Acquire Adesto Technologies, Broadening Presence in the Industrial Internet of Things Market (IIoT) (Feb 20, 2020)
- Titan IC Secure Licensing Deal for 100Gbps Search Acceleration with FPGA SmartNIC Developer, Silicom (Feb 20, 2020)
- Imagination's RF IP included in Autotalks' PLUTON2 Chipset (Feb 19, 2020)
- CEVA NB-IoT IP Completes Release 14 GCF Certification with Rohde & Schwarz (Feb 19, 2020)
- Imagination announces new iEB110 Bluetooth Low Energy (BLE) v5.2 IP (Feb 19, 2020)
- Synopsys' Fusion Compiler Adopted by AMD (Feb 19, 2020)
- Mixel MIPI C-PHY/D-PHY Combo IP Integrated into Compound Photonics CP1080p26 Microdisplay (Feb 19, 2020)
- Renesas Electronics and Hitachi Develop High-Speed, High-Precision Automotive A/D Converter Circuit With Stable Operation Under Harsh Conditions (Feb. 19, 2020)
- Car to Cloud: Vehicles Are Getting Connected (Feb. 19, 2020)
- Accelerating Innovation for Safety Systems with Arm Flexible Access (Feb. 19, 2020)
- Adesto's EcoXiP™ Octal xSPI Memory Delivers Exceptional System Operation with STMicroelectronics' New STM32H7A3/7B3 and STM32H7B0 MCUs (Feb. 19, 2020)
- Aldec and Codasip at Embedded World: Showcasing an Integrated UVM Simulation Environment for Verifying Custom Instructions with RISC-V Cores (Feb. 19, 2020)
- Adapting the Microcontroller for AI in the Endpoint (Feb. 19, 2020)
- Covid-19 Is Crimping the Electronics Industry (Feb 18, 2020)
- SiPearl launches its development with 6.2m euros of European funds (Feb 18, 2020)
- SmartDV Offers New Design IP for DDR5 and LPDDR5 (Feb 18, 2020)
- SMIC Reports 2019 Fourth Quarter Result (Feb 18, 2020)
- Vintage Investment Partners, Verizon Ventures, Maersk Growth, PepsiCo and NTT DOCOMO Ventures Join Top Tier Investors Backing Wiliot's Postage Stamp Sized Computer (Feb 18, 2020)
- CEA-Leti Presents High-Performance Processor Breakthrough With Active Interposer and 3D Stacked Chiplets at ISSCC 2020 (Feb 18, 2020)
- CEVA, Inc. Announces Fourth Quarter and Year End 2019 Financial Results (Feb 18, 2020)
- OmniVision Announces Its First 64 Megapixel, 0.8 Micron Image Sensor (Feb 18, 2020)
- Accellera Forms Functional Safety Working Group to Standardize Data for Interoperability & Traceability in the Functional Safety Lifecycle (Feb 18, 2020)
- Adesto and MikroElektronika Introduce mikroBUS- compatible FT Click to Speed Industrial IoT Development (Feb 18, 2020)
- The US wants TSMC to stop manufacturing chips for Huawei (Feb. 18, 2020)
- Securing Low-Cost Embedded IoT Devices (Feb. 18, 2020)
- Launch of SiPearl, designing the microprocessor for the European exascale supercomputer (Feb 17, 2020)
- Gen-Z Core Specification 1.1 now available for public download (Feb 17, 2020)
- The FD-SOI Chip Design Book: Yes, It's Finally Here! (Feb. 17, 2020)
- RVSoC Offers a Lightweight Linux-Capable RISC-V Core in Just 5,000 Lines of Verilog (Feb. 17, 2020)
- Medical AI: Automate the Important Stuff (Feb. 17, 2020)
- Cadence Furthers Expansion in 5G RF Communications with Acquisition of Integrand (Feb 14, 2020)
- Synopsys Completes Acquisition of Certain IP Assets from INVECAS (Feb 14, 2020)
- Five Semiconductor Companies Hold 53% of Global Wafer Capacity (Feb 13, 2020)
- Cadence Reports Fourth Quarter 2019 Financial Results (Feb 13, 2020)
- Eta Compute Announces Production Silicon of the World's Most Energy-efficient Edge AI Processor (Feb 13, 2020)
- Faraday's AIoT Platform ASIC Solution Escalates System Accomplishment (Feb 13, 2020)
- Socionext Introduces Time-Sensitive Network (TSN) IP to Realize Smart Factories (Feb 13, 2020)
- XMOS announces world's lowest cost, most flexible AI processor (Feb 13, 2020)
- UltraSoC collaborates with PDF Solutions to prevent in-life product failures using end-to-end analytics and advanced machine learning techniques (Feb 13, 2020)
- Synopsys Launches New ARC Communications IP Subsystem for Wireless Narrowband IoT Designs (Feb 13, 2020)
- UMC Reports Sales for January 2020 (Feb 12, 2020)
- SmartDV Adds Support for MIPI I3C 1.1 Across Entire IP Portfolio (Feb 12, 2020)
- New Mathematically Lossless Video Compression IP Cores Announced by Hardent (Feb 12, 2020)
- Mythic adopts Mentor's Analog FastSPICE and Symphony platforms for AI processor design (Feb 12, 2020)
- BrainChip's Akida Development Environment Now Freely Available for Use (Feb 12, 2020)
- Synopsys Announces First Application Security Testing Solution to Analyze Both Open Source and Proprietary Code on the Developer's Desktop (Feb 12, 2020)
- Full steam ahead for TSMC despite coronavirus (Feb. 12, 2020)
- Edge Intelligence Ticks Many Boxes For AI (Feb. 12, 2020)
- GSMA Statement on MWC Barcelona 2020 from John Hoffman, CEO GSMA Limited (Feb. 12, 2020)
- Mobile World Congress Cancelled (Feb. 12, 2020)
- Low-Latency Ethernet MAC IP Core from CAST now ASIL-D Certified (Feb 11, 2020)
- TSMC Board of Directors Meeting Resolutions (Feb. 11, 2020)
- Nokia and SoftBank team up to complete world's first 5G connected car test (Feb. 11, 2020)
- Powering the future: Smallest all-digital circuit opens doors to 5 nm next-gen semiconductor (Feb 10, 2020)
- BrainChip Showcases Vision and Learning Capabilities of its Akida Neural Processing IP and Device at tinyML Summit 2020 (Feb 10, 2020)
- TSMC January 2020 Revenue Report (Feb 10, 2020)
- EnSilica to Develop Next-Generation Ka Band Satellite Transceivers for the European Space Agency (Feb 10, 2020)
- SEGGER releases Floating-Point Library for RISC-V (Feb 10, 2020)
- Xilinx Adds Advanced Machine Learning Capabilities for Pro AV and Broadcast Platforms (Feb 10, 2020)
- New AI technology from Arm delivers unprecedented on-device intelligence for IoT (Feb 10, 2020)
- Arm Cortex-M55 and Ethos-U55 Processors: Extending the Performance of Arm's ML Portfolio for Endpoint Devices (Feb. 10, 2020)
- Silex Insight launches True 4K Multiview using AV over IP (Feb 07, 2020)
- SMIC : Donation of RMB 10 million to support the frontline to fight the novel coronavirus epidemic (Feb. 07, 2020)
- RISC-V Foundation Showcases Unprecedented Momentum and Growth at Embedded World 2020 (Feb. 07, 2020)
- Presto Engineering Acquires DELTA Microelectronics Business from FORCE Technology (Feb 06, 2020)
- Acquisition Rebound Lifts 2019 to Third-Largest M&A Year (Feb 06, 2020)
- UMC Announces 14nm certification on Mentor's Calibre Eco Fill Flow (Feb 06, 2020)
- Embedded controller Floating-Point Library supports RISC-V (Feb. 06, 2020)
- 2019 Global Silicon Shipments Dip From 2018 Record High But Revenue Remained Stable Above $11 Billion, SEMI Reports (Feb 05, 2020)
- Gartner Says Worldwide Semiconductor Spending Declined in 2019 Due to Slowing Macroeconomy and Falling Memory Prices (Feb 05, 2020)
- GUC Monthly Sales Report - Jan 2020 (Feb 05, 2020)
- GigaDevice Launches the New GD32E232 Series of MCU's Featuring the Arm Cortex-M23 core for Embedded Systems (Feb 05, 2020)
- GreenWaves GAP9 AI/IoT ULP app processor on GF's 22FDX to sample H1 2020; mass production 2021 (Feb. 05, 2020)
- When ADAS Goes People-Blind (Feb. 05, 2020)
- SmartDV Achieves Record Revenue in 2019 (Feb 04, 2020)
- China Maintains Chip Output in Wake of Virus Outbreak (Feb 04, 2020)
- Arteris IP FlexNoC Interconnect and Resilience Package Licensed by SiEngine for ISO 26262-Compliant Automotive Systems (Feb 04, 2020)
- Worldwide Semiconductor Sales Decrease 12 Percent to $412 Billion in 2019 (Feb 04, 2020)
- Synapse Design's Continued Fast Growth Drives Opening of Two Offshore Semiconductor Design Centers (Feb 04, 2020)
- The First RISC-V Hackathon in Israel (Feb. 04, 2020)
- TI's First Automotive SoC with an AI Accelerator Launches (Feb. 04, 2020)
- Making Kynisys: how we're building the future of AI (Feb. 04, 2020)
- Chips&Media Pioneering With The World's First Real-time Multi-Standard Decoder, including AV1, HW IP, WAVE517 (Feb 03, 2020)
- JEDEC Publishes Update to Universal Flash Storage (UFS) Standard (Feb 03, 2020)
- Semiconductor R&D To Nudge Higher Through 2024 (Feb 03, 2020)
- UltraSoC extends its commitment to Japanese market with appointment of Ryoden (Feb 03, 2020)
- Qorvo Acquires UWB Chip Provider Decawave for $400m (Feb 03, 2020)
- Supply Chain Poised for Coronavirus Disruption (Feb 03, 2020)
- UMC Announces 14nm certification on Mentor's Calibre Eco Fill Flow (Feb. 03, 2020)
- University of Pittsburgh researchers explore enabling lag-free connections in massive IoT devices (Feb. 03, 2020)
- Digital Blocks AMBA Multi-Channel DMA Controller IP Core Family Extends Leadership with targeted applications in DMA Streaming of Video and Data over PCIe or UDP/IP Network Interface. (Jan 30, 2020)
- Xilinx Reports Fiscal Third Quarter 2020 Results (Jan 30, 2020)
- Creonic Joins German Center for Satellite Communications (DESK) (Jan 30, 2020)
- High-Bandwidth Accelerator Access to Memory: Enabling Optimized Data Transfers with RISC-V (Jan. 30, 2020)
- SoM is built around multi-core RISC-V SoC FPGA (Jan. 29, 2020)
- Thales unveils Cybels Analytics AI-based platform to detect complex cyberattacks (Jan. 29, 2020)
- Lattice Semiconductor Showcases Low Power FPGA-based AI/ML Solutions at tinyML Summit (Jan. 29, 2020)
- UK Approves Huawei 5G Equipment with Restrictions (Jan. 29, 2020)
- EU announces strict 5G guidelines amid security risks (Jan. 29, 2020)
- Cobham Gaisler successfully verifies its first RISC-V processor, NOEL-V, using Aldec's Riviera-PRO for HDL Simulation (Jan 28, 2020)
- Rambus Reports Fourth Quarter and Fiscal Year 2019 Financial Results (Jan 28, 2020)
- Arteris IP Adds 17 New Licensees, Revenue Exceeds $31M in 2019 (Jan 28, 2020)
- QuickLogic Announces Restructuring Plan to Reduce Operating Expenses in Order to Achieve Profitability Goals for Fiscal Year 2020 (Jan 28, 2020)
- Intel Moving Select CPU Manufacturing to GlobalFoundries (Jan. 28, 2020)
- Ethernet Enables Higher Data Rates for Space Applications (Jan. 28, 2020)
- WiLAN Awarded $85.23M in Apple Re-Trial (Jan 27, 2020)
- Kneron raises $40m for next-gen Edge AI chip (Jan 27, 2020)
- Flex Logix EFLX 1K eFPGA Core Design Kits Available Now For TSMC 40nm ULP And 40nm LP Process Technologies (Jan 27, 2020)
- proteanTecs Announces Live Webinar on In-Field Failure Prediction Based on IC Deep Data Monitoring (Jan 27, 2020)
- Former Google and Tesla Engineer Chris Lattner to Lead SiFive Platform (Jan 27, 2020)
- Why Imagination Technologies has joined the FIDO Alliance (Jan. 27, 2020)
- ESP Open Source Research Platform Enables the Design of RISC-V & Sparc SoC's with Accelerators (Jan. 26, 2020)
- North American Semiconductor Equipment Industry Posts December 2019 Billings (Jan 24, 2020)
- Lattice Diamond FPGA Development Tool Receives Key Industrial and Automotive Functional Safety Certifications (Jan 24, 2020)
- Groq Hardware Now Available on Nimbix Cloud (Jan 23, 2020)
- Ciaran Kennedy and Himesh Soneji join Enyx (Jan 23, 2020)
- Apple, Huawei Use TSMC, But Their 7nm SoCs Are Different (Jan 23, 2020)
- Intel joins CHIPS Alliance to promote Advanced Interface Bus (AIB) as an open standard (Jan 23, 2020)
- 26 of 33 IC Products Forecast to Demonstrate Positive Growth in 2020 (Jan 23, 2020)
- Synopsys Announces New ARC HS4x/4xD Development Kit to Speed Software Development (Jan 23, 2020)
- Ada and RISC-V Secure Nvidia's Future (Jan. 23, 2020)
- Top 4 ways the food industry can implement IoT (Jan. 23, 2020)
- Silex Insight and Argo collaborate on ensuring the complete security for smart meters in South-Korea (Jan 22, 2020)
- Synopsys and Finastra Partner to Secure Financial Services App Ecosystem (Jan 22, 2020)
- Himax Launches HM0360 1/6" VGA Ultra Low Power CMOS Image Sensor for AIoT and Computer Vision Applications (Jan. 22, 2020)
- Allegro DVT Unveils the Industry's First VVC Compliance Test Bitstreams (Jan 21, 2020)
- Arteris IP FlexNoC Interconnect and AI Package Licensed by Vastai Technologies for Artificial Intelligence Chips (Jan 21, 2020)
- sureCore Opens Low Power Memory Compiler Access (Jan 21, 2020)
- Xilinx Files Patent Infringement Lawsuit Against Analog Devices (Jan 21, 2020)
- New RISC-V Solution: SAFERTOS for IAR Embedded Workbench for RISC-V (Jan. 21, 2020)
- eMemory and UMC Qualify NeoFuse IP on the Foundry's 28nm High Voltage Process (Jan 20, 2020)
- Arm Mali-G77 GPU named Best Processor IP in The Linley Group's Analysts' Choice Awards (Jan 20, 2020)
- TSMC Announces Winners of First IC Layout Contest (Jan 20, 2020)
- Palma Ceia SemiDesign Signs Agreement with BLRLABS for Expansion to India (Jan 20, 2020)
- Global GDP Growth An Increasingly Important Driver of IC Market Growth (Jan 20, 2020)
- TSMC Announces Winners of First IC Layout Contest (Jan. 20, 2020)
- 5G to Drive Doubling of SOI Market by 2024, says Digitimes Research (Jan. 20, 2020)
- eMemory and UMC Qualify NeoFuse IP on the Foundry's 28nm High Voltage Process (Jan. 20, 2020)
- Imagination Technologies charts its future with new Apple deal and post-MIPS strategy (Jan. 18, 2020)
- JEDEC Publishes Update to LPDDR5 Standard for Low Power Memory Devices (Jan 17, 2020)
- Erwan Menard, Director of Infrastructure and Applications Modernization Solutions at Google Cloud, Joins Kalray Board of Directors (Jan 17, 2020)
- Apple Reportedly Acquires Xnor (Jan 17, 2020)
- Synopsys Joins New Autonomous Vehicle Computing Consortium (Jan 17, 2020)
- CAST Adds Switched TSN Endpoint Controller to Time-Sensitive Networking Ethernet IP Cores Family (Jan 17, 2020)
- 4 factors to consider before investing in AI (Jan. 17, 2020)
- TSMC Reports Fourth Quarter EPS of NT$4.47 (Jan 16, 2020)
- Cadence Completes Acquisition of AWR Corporation from National Instruments (Jan 16, 2020)
- Imagination Technologies expands with new design centre in Romania (Jan 16, 2020)
- Mercury Systems Selects Tortuga Logic's Radix for DARPA Program (Jan 16, 2020)
- AI Chips: What Will 2020 Bring? (Jan 16, 2020)
- Is ReRAM Ready to Leave the R&D Phase? (Jan 16, 2020)
- MIPI I3C v1.1 Utility and Control Bus Strengthens Upgrade Path for I2C Implementers (Jan 15, 2020)
- Microchip certifies compiler for functional safety (Jan. 15, 2020)
- Mobile Sales Force Automation Market to Reach $3.68 Billion by 2023 in North America with AI and Machine Learning (Jan. 15, 2020)
- M31 Technology Wins Customers' Choice Award for Automotive IP Paper at TSMC Open Innovation Platform (OIP) Ecosystem Forum (Jan 14, 2020)
- Gartner Says Worldwide Semiconductor Revenue Declined 11.9% in 2019 (Jan 14, 2020)
- Inphi Completes Acquisition of eSilicon (Jan 14, 2020)
- Cadence Expands Collaboration with Broadcom for 5nm and 7nm Designs (Jan 14, 2020)
- What Makes Secure Processors Different? (Jan. 14, 2020)
- PLDA Announces Successful PCIe 4.0 Technology Compliance for its XpressRICH-AXI Controller IP (Jan 13, 2020)
- TSMC December 2019 Revenue Report (Jan 13, 2020)
- Synopsys Acquires Tinfoil Security to Expand DAST and Add API Security Testing (Jan 13, 2020)
- Synopsys Completes Acquisition of Certain IP Assets from eSilicon (Jan 13, 2020)
- The BSC coordinates the manufacture of the first open source chip developed in Spain (Jan 13, 2020)
- SOI in IoT & Automotive (Jan. 13, 2020)
- CSEM Bluetooth 5.1 IP icyTRX is ready for LE Audio on multiple processes (Jan 10, 2020)
- Practical applications for AI and ML in embedded systems (Jan. 10, 2020)
- UMC Reports Sales for December 2019 (Jan 09, 2020)
- Andes Technology Takes the Lead in Launching RISC-V Total Solutions and Driving Industry-Academia Collaboration with over 120 Projects (Jan 09, 2020)
- China Only Region to Register Pure-Play Foundry Market Growth in 2019 (Jan 09, 2020)
- UK Judge Finds Conversant Wireless' European Standard-Essential Patents Infringed by Huawei and ZTE (Jan 09, 2020)
- Synopsys Expands Portfolio of Automotive VDKs with Support for NXP S32G Vehicle Network Processor (Jan 09, 2020)
- Xiaomi and MPEG LA Announce Xiaomi's Signing of MPEG LA's HEVC License (Jan 09, 2020)
- Half-bridge SOI driver offers integrated bootstrap diodes (Jan. 09, 2020)
- Build your own Edge AI SoC with SiFive RISC-V CPUs and CEVA AI chips (Jan. 09, 2020)
- How to Get Started with RISC-V-Based Microcontrollers (Jan. 09, 2020)
- Qualcomm Accelerates Autonomous Driving with New Platform - Qualcomm Snapdragon Ride (Jan 08, 2020)
- Low-Power FD-SOI FPGA Melds AI and Bridging (Jan. 08, 2020)
- Open Source Hardware Risks (Jan. 08, 2020)
- ONiO.zero offers a RISC-V Microcontroller that runs without battery (Jan. 08, 2020)
- SHA IP Core with native SHA2-256 HMAC support (Jan 07, 2020)
- Omni Design Joins TSMC IP Alliance Program (Jan 07, 2020)
- Bluespec, Inc. to Open Source Its Proven BSV High-level HDL Tools (Jan 07, 2020)
- CEVA Speeds the Development of True Wireless Stereo Earbuds with its Support of Bluetooth LE Audio (Jan 07, 2020)
- Synopsys Releases Industry's First Bluetooth LE Audio Codec for Power-Sensitive Audio and Voice Applications (Jan 07, 2020)
- ESD Alliance Reports EDA Industry Revenue Increase for Q3 2019 (Jan 07, 2020)
- LC3 for Bluetooth LE Audio Now Available for Cadence Tensilica HiFi DSPs (Jan 07, 2020)
- Siemens partners with Arm to accelerate the future of mobility by redefining design capabilities for complex electronic systems (Jan 07, 2020)
- SiFive and CEVA Partner to Bring Machine Learning Processors to Mainstream Markets (Jan 07, 2020)
- Synopsys to Acquire Certain IP Assets of INVECAS (Jan 07, 2020)
- Imagination in action at CES 2020 (Jan. 07, 2020)
- Processors for ADAS and auto computing (Jan. 07, 2020)
- IoT security: What we can learn from recent threats (Jan. 07, 2020)
- GUC Monthly Sales Report - Dec 2019 (Jan 06, 2020)
- zGlue Launches ChipBuilder Pro to Quickly and Easily Enable the Next Generation of Consumer Experiences on IoT and AI-Powered Devices (Jan 06, 2020)
- CEVA Debuts SenslinQ Platform to Streamline Development of Contextually Aware IoT Devices (Jan 06, 2020)
- Novatek Adopts CEVA Audio/Voice DSP and Software for Smart TV SoCs (Jan 06, 2020)
- Gowin Semiconductor Takes Leadership Position in Always-on Low Power FPGAs with GW1NZ-ZV Device Production (Jan 06, 2020)
- Siemens-Arm Looks to 2025 Vehicles' Platform Design (Jan. 06, 2020)
- Wi-Fi Alliance brings Wi-Fi 6 into 6 GHz (Jan 03, 2020)
- Global Semiconductor Market Likely to Grow 6% in 2020, reports SIA (Jan. 03, 2020)
- Imagination and Apple Sign New Agreement (Jan 02, 2020)
- HiSilicon No Longer Huawei's Captive Chipmaker (Jan 02, 2020)
- 2020: When AVs Attack, Who's at Fault? (Jan. 02, 2020)
- Cloud, 5G and 'wetware' attacks – the 5 biggest cybersecurity threats of 2020 (Jan. 02, 2020)
- Israeli Startup TriEye Collaborates with Porsche to Help Drivers "See" Better in Low Visibility Conditions (Jan. 02, 2020)
- OmniVision Announces 4K Video Processor with Industry's Lowest Power Consumption and HEVC Compression Capability for Battery-Powered Security and Surveillance Applications (Jan 02, 2020)
- Architecture of AI chip slightly tweaked, results in cutting power consumption by 5x (Jan. 02, 2020)
- CES 2020: Biggest Computing Trends to Watch (Jan. 01, 2020)
- RISC-V Lagarto is First Open Source Chip Developed in Spain (Dec. 31, 2019)
- Our 2020 tech predictions: Samsung, Surface Duo, 5G and Elon Musk (Dec. 31, 2019)
- China semiconductor equipment expense to see double-digit growth (Dec. 31, 2019)
- Digital Blocks extends leadership of UDP/IP networking with 50 & 100 GbE (Dec 30, 2019)
- AImotive's latest aiWare3P delivers superior NN acceleration for production L2-L3 automotive AI (Dec 30, 2019)
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- AI: A Little Too Human, But Not Human Enough (Dec. 30, 2019)
- SiFive to Attend CES 2020 (Dec. 30, 2019)
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- Teardown Reveals Globalfoundries 22FDX Shipping In End Products Like Google's 2nd Gen Nest Mini (Dec. 28, 2019)
- 5 Pivotal Events in IoT and Embedded (Dec. 26, 2019)
- SYSGO and ST to Demonstrate Secure Vehicle Connectivity at CES 2020 (Dec. 26, 2019)
- IoT Applications and AI at The Edge Level (Dec. 24, 2019)
- Record Amount of IC Capacity Forecast to be Added in 2021 (Dec 23, 2019)
- Arm puts loss-making cyber security venture up for sale (Dec 23, 2019)
- PRO DESIGN Extends FPGA Based Prototyping Portfolio With proFPGA XCVU13P Module - Offering Highest Interface and System Performance (Dec 23, 2019)
- Bluespec Unveils Groundbreaking "RISC-V Factory" - Empowering Open Source Hardware Developers to Build Faster and More Efficiently (Dec 23, 2019)
- Semiconductor industry will recover in 2020 (Dec. 23, 2019)
- Why the Memory Subsystem is Critical in Inferencing Chips (Dec. 22, 2019)
- 5 Pivotal Events in AI Chips in 2019 (Dec. 22, 2019)
- NEC Selects Synopsys ZeBu Server 4 Emulation Solution for Super Computer Verification (Dec 20, 2019)
- North American Semiconductor Equipment Industry Posts November 2019 Billings (Dec 20, 2019)
- How RISC-V is creating a globally neutral, open source processor architecture (Dec. 20, 2019)
- Faraday Unveils New IoT SoC Platform to Accelerate Early-Stage ASIC Development (Dec 19, 2019)
- eMemory Joins Arm Ecosystem for Secure IoT Chips (Dec 19, 2019)
- videantis AI processor platform adopted for KI-FLEX autonomous driving chip (Dec 19, 2019)
- Vidatronic Appoints New Member to Its Board of Directors (Dec 19, 2019)
- CEVA Puts Intuitive Motion Control in the Palm of Your Hand with New Sensor Fusion Solution for Consumer Handheld Devices (Dec 19, 2019)
- Atmosic Technologies Raises $28.5 Million in Latest Round of Funding (Dec 19, 2019)
- GreenWaves Unveils Groundbreaking Ultra-Low Power GAP9 IoT Application Processor for the Next Wave of Intelligence at the Very Edge (Dec 19, 2019)
- Xilinx Powers Baidu's Production-Ready ACU-Advanced Platform for Automated Valet Parking (Dec 19, 2019)
- Industry Awards for SOI Luminaries at UCLouvain, Lattice, NXP & Soitec (Dec. 19, 2019)
- FPGA Platform from Lattice Semi Sets a New Standard for Efficiency (Dec. 19, 2019)
- AI processing architecture to be on display at CES 2020 (Dec. 19, 2019)
- Synopsys and Porsche Consulting Introduce a Framework for Accelerating Automotive Development for the Digital Future (Dec. 19, 2019)
- Microchip unveils details and opens early access program for RISC-V enabled low-power PolarFire SoC family (Dec. 19, 2019)
- What Worked, What Didn't In 2019 (Dec. 19, 2019)
- Veriest instrumental in verification of Innoviz automotive LIDAR device (Dec 18, 2019)
- Wind River Announces RISC-V Support for VxWorks RTOS (Dec 18, 2019)
- SLX FPGA v2019.4 Delivers an Average of 45x HLS Performance Improvement (Dec 18, 2019)
- Aldec Enhances Riviera-PRO's VHDL and UVVM Support (Dec 18, 2019)
- Tortuga Logic Awarded Multi-Million Dollar DoD Contracts to Increase The Security and Assurance of Microelectronics (Dec 18, 2019)
- Samsung to make chips for China's Baidu in notable first partnership (Dec. 18, 2019)
- Latest AI Algorithms Presented at NeurIPS (Dec. 18, 2019)
- After the biggest fall for 18 years, it's all going to get better, says SI (Dec. 18, 2019)
- Japan Symposium '19 Summaries Part 1 – 5G/RF-SOI (Dec. 18, 2019)
- Microchip PolarFire Takes a RISC (-V) (Dec. 18, 2019)
- Trust and data privacy remain consumers' biggest fears about connected cars (Dec. 18, 2019)
- Intrinsic ID Raises 2.5 Million Euros for Internet of Things Security (Dec 17, 2019)
- Global Fab Equipment Spending Rebounds in Second Half of 2019 with Stronger 2020 Projected, SEMI Reports (Dec 17, 2019)
- Renesas Electronics Collaborates with Xilinx on Versal ACAP Reference Designs (Dec 17, 2019)
- Mobiveil's PCI Express 4.0 Endpoint Controller Passes PCI-SIG Gold and Interoperability Testing (Dec 17, 2019)
- Apple Buys Image Fusion Startup Spectral Edge (Dec 17, 2019)
- A Renaissance in the Emulation Business Is Nigh (Dec 17, 2019)
- Intel Acquires Artificial Intelligence Chipmaker Habana Labs (Dec 17, 2019)
- Lattice Semiconductor launched new low-power FPGA based on FD-SOI (Dec. 17, 2019)
- Gartner: Blockchain is the perfect match for the IoT (Dec. 17, 2019)
- Mentor collaborates with Arm on unique eMRAM test solution using Samsung FDSOI technology (Dec 16, 2019)
- Enflame leverages Mentor's Tessent DFT solutions for innovative cloud AI chip targeting neural network training (Dec 16, 2019)
- Alma Technologies Announces Availability of a New Ultra-High Throughput JPEG 2000 Encoder IP Core (Dec 16, 2019)
- How to multiply by 18 battery autonomy of voice control devices? (Dec 16, 2019)
- Codasip Studio and Codasip CodeSpace 8.2 available (Dec. 16, 2019)
- An Introduction to Machine Learning on Mobile (Dec. 16, 2019)
- Nokia signs contract with TIM Brazil to launch IoT offer (Dec. 16, 2019)
- The 8 AI trends we're watching in 2020 (Dec. 16, 2019)
- CEA-Leti Builds Fully Integrated Bio-Inspired Neural Network with RRAM-Based Synapses & Analogue Spiking Neurons (Dec 13, 2019)
- Revenue Ranking of Global Top 10 IC Design Companies Shows U.S. Companies Having Divergent Performances in 3Q19, Says TrendForce (Dec 13, 2019)
- INSPECTOR diagnostic and debug platform passed the PCIe 4.0 compliance (Dec 13, 2019)
- Aldec's new FPGA-based NVMe Data Storage Solution Targets High Performance Computing Applications (Dec 13, 2019)
- Breker Verification Systems Launches Unique RISC-V TrekApp for Automated, High-Coverage System Integration Test Suite Synthesis (Dec 13, 2019)
- Functional Safety on Arm – Beyond Automotive (Dec. 13, 2019)
- MediaTek selects Nucleus RTOS for next-generation modem technology (Dec 12, 2019)
- Calterah Semiconductor's Automotive Radar SoC Enters Mass Production Using Synopsys DesignWare ARC Processor IP (Dec 12, 2019)
- Enflame Technology Selects Rambus HBM2 Memory Subsystem Solution For Next-Generation AI Training Chip (Dec 12, 2019)
- Lattice and SiFive Announce Collaboration to Allow Lattice FPGA Developers Easy Access to RISC-V Processors (Dec 12, 2019)
- All M31 Automotive IP Products Received ISO 26262 Certifications (Dec 12, 2019)
- Global Semiconductor Equipment Sales Forecast - 2020 Rebound, 2021 Record High (Dec 12, 2019)
- Enflame Technology Announces CloudBlazer with DTU Chip on GLOBALFOUNDRIES 12LP FinFET Platform for Data Center Training (Dec 12, 2019)
- Codasip Teams Up with Western Digital to Support Adoption of Open-Source Processors (Dec 12, 2019)
- SiFive Announces New Technologies for Mission-Critical and AI Markets (Dec 11, 2019)
- Cobham Releases RISC-V Processor IP Core (Dec 11, 2019)
- Dialog Semiconductor and Flex Logix Establish Strategic Partnership for Mixed Signal Embedded Field-Programmable Gate Arrays (eFPGA) (Dec 11, 2019)
- Lattice Announces New Low Power FPGA Platform (Dec 11, 2019)
- AccelerComm Reduces 5G Latency by up to 16x with NR LDPC Channel Coding (Dec 11, 2019)
- Industry Veteran Randy Allen Joins SiFive as Vice President of RISC-V Software (Dec 11, 2019)
- New Lattice CrossLink-NX FPGAs Bring Power and Performance Leadership to Embedded Vision and Edge AI Applications (Dec 11, 2019)
- Cobham Releases LEON5 Processor IP Core (Dec 11, 2019)
- Lattice Unveils First FPGAs on FD-SOI (Dec. 11, 2019)
- Arm's 2020 predictions (Dec. 11, 2019)
- RISC-V grows globally as an alternative to Arm and its license fees (Dec. 11, 2019)
- Andes Technology and Deeplite, INC. Join Forces To Deploy Highly Compact Deep Learning Models Into Daily Life (Dec 10, 2019)
- TSMC November 2019 Revenue Report (Dec 10, 2019)
- Global Unichip Corporation Uses Cadence Digital Implementation and Signoff Flow to Deliver Advanced-Node Designs for AI and HPC Applications (Dec 10, 2019)
- Hex Five Announces General Availability of MultiZone Security for Linux - The First Commercial Enclave for RISC-V processors (Dec 10, 2019)
- Creonic Continues to Extend its Leading SATCOM IP Core Portfolio (Dec 10, 2019)
- Attopsemi's I-fuse OTP IP Embedded into Melexis' Sensor ICs In Mass Production (Dec 10, 2019)
- Codasip Teams Up with Western Digital to Support Adoption of Open?Source Processors (Dec 10, 2019)
- PLDA Announces Augmented Presence in Asia with Increased R&D, Support and Sales, and a New Chinese Language Website (Dec 10, 2019)
- NSITEXE Selects SmartDV TileLink Verification IP for RISC-V Based Applications (Dec 10, 2019)
- INSPECTOR™ diagnostic and debug platform passed the PCIe 4.0 compliance (Dec. 10, 2019)
- Microchip Unveils Family Details and Opens Early Access Program for RISC-V Enabled Low-Power PolarFire SoC FPGA Family (Dec. 10, 2019)
- RISC-V Xmas gifts: SiFive emits vector-enabled cores, Western Digital teases new SweRVs, VxWorks hugs ISA, Samsung rolls it into 5G... (Dec. 10, 2019)
- Tech Industry Heavyweight Joins SiFive - Manoj Gujral Tapped As SVP & GM of Silicon Business Unit (Dec 09, 2019)
- Andes Corvette-F1 N25 Platform Becomes one of the first RISC-V Platforms Qualified for Amazon FreeRTOS (Dec 09, 2019)
- UltraSoC donates RISC-V trace implementation to enable true open-source development (Dec 09, 2019)
- Xilinx Issues Statement in Response to Analog Devices Patent Infringement Lawsuit (Dec 09, 2019)
- Synopsys Posts Financial Results for Fourth Quarter and Fiscal Year 2019 (Dec 09, 2019)
- GUC Monthly Sales Report - Nov 2019 (Dec 09, 2019)
- UMC Reports Sales for November 2019 (Dec 09, 2019)
- Verimatrix Completes Sale of its Silicon IP Business Unit to Rambus (Dec 09, 2019)
- Rambus Completes Acquisition of the Verimatrix Silicon IP, Secure Protocols and Provisioning Business (Dec 09, 2019)
- WiLAN Subsidiary and CXMT Enter into License and Acquisition Agreements (Dec 09, 2019)
- Andes' Core has RISC-V Vector Instruction Extension (Dec. 09, 2019)
- New Vidatronic CTO to Innovate and Scale Technology (Dec 06, 2019)
- Andes certifies Imperas models and simulator as reference for new Andes RISC-V Vectors Core with lead customers and partners (Dec 05, 2019)
- SiFive To Present New Technologies At RISC-V Summit 2019 (Dec 05, 2019)
- Andes 45-Series Expands RISC-V High-end Processors 8-Stage Superscalar Processor Balances High Performance, Power Efficiency, and Real-time Determinism with Rich RISC-V Ecosystem (Dec 05, 2019)
- BrainChip and Tata Consultancy Services (TCS) jointly Present a Demonstration Featuring Its Akida Neuromorphic Technology Platform at NeurIPS 2019 (Dec 05, 2019)
- Where Is The Edge AI Market And Ecosystem Headed? (Dec. 05, 2019)
- Taking Self-Driving Safety Standards Beyond ISO 26262 (Dec. 05, 2019)
- Neoverse N1 makes debut in new AWS cloud instances (Dec 04, 2019)
- Third Quarter 2019 Worldwide Semiconductor Equipment Billings Jump 12 Percent, SEMI Reports (Dec 04, 2019)
- Andes Presents Ground-Breaking 27-Series Processor at RISC-V Summit 2019 (Dec 04, 2019)
- SmartDV's TileLink, Verilator VIP on Full Display at RISC-V Summit (Dec 04, 2019)
- Veriest marks 1st anniversary of meetup series with special event in Belgrade (Dec 04, 2019)
- Aldec's Active-HDL Verification Capabilities Enhanced to Support SystemVerilog Constructs and UVM (Dec 04, 2019)
- Global Semiconductor Sales Increase 2.9 Percent Month-to-Month in October; Annual Sales Projected to Decrease 12.8 Percent in 2019 (Dec 04, 2019)
- SOI Consortium 2019/20 New Members AMAT, Analog Bits, Antaios, Silicon Catalyst, SmarterMicro, Thalia (Dec. 04, 2019)
- Cadence to Acquire AWR Corporation from National Instruments to Accelerate System Innovation for 5G RF Communications (Dec 03, 2019)
- Think Silicon demonstrates early preview of Industry's first RISC-V ISA based 3D GPU at the RISC-V Summit (Dec 03, 2019)
- Mixel Announces Immediate Availability of MIPI D-PHY v2.5 IP (Dec 03, 2019)
- SiFive Learn Inventor Development System Now AWS Qualified (Dec 03, 2019)
- Imagination launches IMG A-Series: "The GPU of Everything" (Dec 03, 2019)
- UNISOC and Imagination carry out strategic cooperation on AI based on IMG Series3NX neural network accelerator (Dec 03, 2019)
- RISC-V Foundation Founding Member Andes Technology Turns Platinum (Dec 03, 2019)
- Lift off: De-RISC to create first RISC-V, fully European platform for space (Dec 03, 2019)
- Cadence and National Instruments Enter into Strategic Alliance Agreement to Enhance Electronic System Innovation (Dec 03, 2019)
- D&R announces the opening of an IP Core Store to support Soft IP Cores sales to the Chinese market (Dec. 03, 2019)
- Moortec's In-Chip Monitoring Subsystem Supports Uhnder in Groundbreaking Digital Automotive Radar-on-Chip (Dec 02, 2019)
- SiFive Announces SiFive Learn Initiative (Dec 02, 2019)
- Dolphin Design is ISO 9001 and EN 9100 certified (Dec 02, 2019)
- UMC Announces 22nm Technology Readiness Following Silicon Validation on World's Smallest USB 2.0 Test Vehicle (Dec 02, 2019)
- EnSilica and Macnica Europe GmbH Sign Distribution Agreement for Custom ASIC Design and Supply Services (Dec 02, 2019)
- Intel Completes Sale of Smartphone Modem Business to Apple (Dec 02, 2019)
- SiFive Welcomes Ann Chin As SiFive IP Business Unit General Manager (Nov 28, 2019)
- Semico Forecasts Strong Growth for RISC-V (Nov 28, 2019)
- Creonic Participates in H2020 "VERTIGO" Research Project (Nov 28, 2019)
- University of Tokyo and TSMC Announce Organization-Wide Advanced Semiconductor Technology Collaboration (Nov. 27, 2019)
- GlobalWafers completes new fab in South Korea (Nov. 27, 2019)
- Soitec reports First Half Results of Fiscal Year 2020 (Nov. 27, 2019)
- Trade dispute drives RISC-V-Foundation to Switzerland (Nov. 27, 2019)
- SiFive Welcomes Stuart Ching As Chief Revenue Officer (Nov. 27, 2019)
- Inmarsat GX5 satellite, manufactured by Thales Alenia Space, now in orbit (Nov. 27, 2019)
- European Union Cybersecurity Agency focuses on connected cars in latest research (Nov. 27, 2019)
- Aldec's Latest Embedded Development Platform is First to Feature Largest PolarFire and SmartFusion2 FPGAs on a Single Board (Nov 26, 2019)
- MediaTek Announces Dimensity, World's Most Advanced 5G Chipset Family, & Dimensity 1000 5G SoC (Nov 26, 2019)
- Imperas delivers highest quality RISC-V RV32I compliance test suites to implementers and adopters of RISC-V (Nov 26, 2019)
- Silex Insight Introduces Video Codec IP using RAW input (CFA) (Nov 26, 2019)
- The transformation of UMC (Nov. 26, 2019)
- AccelerComm introduces improved channel equalisation for 5G NR at MWC Barcelona 2020 (Nov 25, 2019)
- MediaTek and Intel Partner to Bring 5G Connectivity to the Next Generation of PCs (Nov 25, 2019)
- S2C Delivers New Prodigy FPGA Prototyping Solutions with the Industry's Highest Capacity FPGA from Intel (Nov 25, 2019)
- WiLAN Signs Wireless License with LG (Nov 25, 2019)
- Netherlands Energy Harvesting Semiconductor Firm Nowi Reaches $14 Million in Funding (Nov 25, 2019)
- SparkFun Picks SiFive's FE310 to Power RISC-V-Based RED-V Thing Plus, RED-V RedBoard Dev Boards (Nov. 23, 2019)
- Renesas' R-IN32M4-CL3 IC Boosts Next-Generation Ethernet TSN, Linking IT and OT Seamlessly With CC-Link IE TSN (Nov. 21, 2019)
- SmartDV's Platform-Independent VIP Portfolio Ensures Seamless Coverage-Driven Verification Flow (Nov 21, 2019)
- UltraSoC joins the OpenHW Group and extends its commitment to an open-source future for technology development (Nov 21, 2019)
- SiFive Welcomes Stuart Ching As Chief Revenue Officer (Nov 21, 2019)
- North American Semiconductor Equipment Industry Posts October 2019 Billings (Nov 20, 2019)
- Alereon Adopts Omni Design's Low Power Analog-to-Digital and Digital-to-Analog Converters for Ultra-Wideband Applications (Nov 20, 2019)
- Credo Joins Open Compute Project (OCP) to Accelerate 400G and Beyond Connectivity Solutions for Hyperscale Datacenters and Telecom (Nov 20, 2019)
- Attopsemi Technology Attended 4th Japan SOI Symposium and Presented a Talk "I-fuse: A Disruptive OTP Technology" (Nov 20, 2019)
- Cadence Named the #1 Technology Company on Investor's Business Daily List of the Top 50 ESG Companies (Nov. 20, 2019)
- High-speed comms options enable in-life debug and optimization for datacenter, HPC and storage customers (Nov 19, 2019)
- Graphcore leveraged Mentor's Questa technologies to verify massive Colossus GC2 AI processor (Nov 19, 2019)
- IntelliProp to Demo World's First UPI to Gen-Z Load/Store Host Adapter at SC19 (Nov 19, 2019)
- Expanding Universe for HPC, NVIDIA CEO Brings GPU Acceleration to Arm (Nov 19, 2019)
- EasyIC Design joins Arm Approved Design Partner Program (Nov 19, 2019)
- UVM-AMS Working Group Formed to Standardize UVM Analog/Mixed-Signal Extensions (Nov 19, 2019)
- RISC-V Not So Risky (Nov. 19, 2019)
- RISC-V Myths and More (Nov. 19, 2019)
- ST signs up for more Cree silicon carbide wafers (Nov. 19, 2019)
- SMIC Proposed Issue of US$200 Million Zero Coupon Convertible Bonds (Nov. 19, 2019)
- Intel to Reclaim Number One Semiconductor Supplier Ranking in 2019 (Nov 18, 2019)
- Faraday and UMC Collaborate to Launch a Complete Set of 22nm Fundamental IP (Nov 18, 2019)
- NUVIA Raises $53 Million to Reimagine Silicon Design for the Data Center (Nov 18, 2019)
- Synopsys Custom Compiler Adopted by Samsung Foundry to Accelerate IP Design for 5LPE Process Technology with EUV Technology (Nov 18, 2019)
- Moortec To Showcase Its Latest Embedded PVT Monitoring IP For 40nm-5nm At The 2019 ICCAD in Nanjing (Nov 18, 2019)
- ArchiTek Select SiFive and DTS-Insight To Enable Next-Generation AI Solution Development (Nov 18, 2019)
- Intel announces open oneAPI initiative and development beta release with Data Parallel C++ language for programming CPUs, GPUs, FPGAs, and other accelerators (Nov 18, 2019)
- Jim Cable (pSemi) & Herb Huang (Ningbo Semi) Honored for Pioneering RF-SOI Work (Nov. 18, 2019)
- RISC-V Markets, Security And Growth Prospects (Nov. 18, 2019)
- Gyrfalcon's New Chip Raises Bar (12.6 TOPS/W) on High Performance Edge AI with Lower Power Use (Nov 15, 2019)
- Synopsys Completes Acquisition of DINI Group (Nov 15, 2019)
- Diamond Design Software from Lattice Semiconductor Enables Enhanced Security Features for MachXO3D FPGAs (Nov 15, 2019)
- Gyrfalcon Unveils Fourth AI Accelerator Chip (Nov. 15, 2019)
- Gyrfalcon Technology and Sensory Deliver Enhanced AI Biometric Access on Edge Devices (Nov 14, 2019)
- Nordic Semiconductor unveils world's first dual Arm Cortex-M33 processor wireless SoC for the most demanding low power IoT applications (Nov 14, 2019)
- FlexIC Foundry enables custom flexible integrated circuit design (Nov 14, 2019)
- Reduce TCO with Arm Based SmartNICs (Nov. 14, 2019)
- Rambus Announces Comprehensive PCI Express 5.0 Interface Solution (Nov 13, 2019)
- New Cadence UltraLink D2D PHY IP for Die-to-Die Connectivity Enables High-Performance Applications with Cost-Effective Packaging (Nov 13, 2019)
- Efinix Rolls Out Trion T120 FPGAs (Nov 13, 2019)
- Secure-IC and Andes Technology jointly provide cybersecurity enhanced RISC-V cores (Nov 13, 2019)
- Mirabilis Design unveils the first rapid prototyping platform for Artificial Intelligence Processors and Applications (Nov. 13, 2019)
- GOWIN Semiconductor Releases the First FPGA with Integrated Bluetooth Radio (Nov 12, 2019)
- Synopsys DesignWare ARC Data Fusion IP Subsystem Incorporated by Himax in Their Artificial Intelligence WiseEye ASIC (Nov 12, 2019)
- Achronix to Showcase 7nm FPGA Solutions at SC19 (Nov 12, 2019)
- Xilinx Announces the World's Highest Performance Adaptive Devices for Advanced ADAS and AD Applications (Nov 12, 2019)
- Blaize Emerges from Stealth to Transform AI Computing (Nov 12, 2019)
- Aerendir Mobile Inc. and SiFive Inc. Collaborate to Accelerate the Adoption of AI-Enabled Processors (Nov 12, 2019)
- New Smart Meter using Adesto's Memory and Communications Technologies Begins Pilot Program in Africa and Middle East (Nov 12, 2019)
- Rianta Releases Ethernet MAC/PCS/FEC IP Suite for ASICs targeting Datacenter, Networking and 5G Mobile Infrastructure (Nov 12, 2019)
- Mentor introduces Tessent Safety ecosystem to meet IC test requirements of the autonomous vehicles era (Nov 12, 2019)
- SMIC Reports 2019 Third Quarter Result (Nov 12, 2019)
- Xilinx Vitis Unified Software Platform Now Available for Download (Nov 12, 2019)
- Silicon Wafer Area Shipments Fall for Fourth Consecutive Quarter (Nov 12, 2019)
- TSMC Board of Directors Meeting Resolutions (Nov. 12, 2019)
- Avnet Releases MaaXBoard for Embedded Computing, Edge AI Development (Nov. 12, 2019)
- Arasan Announces MIPI D-PHY IP compliant to the latest MIPI D-PHY v2.1 Specifications for TSMC 16nm (Nov 11, 2019)
- Accolade Technology Partners with Titan IC in Search Acceleration on FPGA-based SmartNICs and ATLAS Packet Conditioners (Nov 11, 2019)
- eSilicon to be Acquired by Inphi and Synopsys (Nov 11, 2019)
- Synopsys to Acquire Certain IP Assets from eSilicon (Nov 11, 2019)
- Palma Ceia SemiDesign to Showcase Complete NB-IoT Solution during Synopsys ARC Processor Summit in Beijing (Nov 11, 2019)
- Inphi to Acquire eSilicon, a Leading Provider of 2.5D Packaging, SerDes and Custom Silicon (Nov 11, 2019)
- MediaTek Delivers 112G Long Range SerDes IP, Silicon-Proven on 7nm for ASIC Services (Nov 11, 2019)
- Samsung Foundry Deploys Industry-Leading Synopsys TestMAX XLBIST Dynamic In-System Test Solution for Automotive Safety (Nov 11, 2019)
- Wireless 3D Integration - Making Stacking Silicon as Easy as Stacking Lego (2/2) (Nov. 11, 2019)
- MediaTek's World-Leading 8K DTV SoC in Volume Production on TSMC 12FFC Technology (Nov 08, 2019)
- TSMC October 2019 Revenue Report (Nov 08, 2019)
- UMC Reports Sales for October 2019 (Nov 08, 2019)
- Are Smartphones Equipped to Control a Vehicle? (Nov. 08, 2019)
- SmartDV to Exhibit at SemIsrael Expo, ICCAD China 2019 (Nov 07, 2019)
- CEVA, Inc. Announces Third Quarter 2019 Financial Results (Nov 07, 2019)
- Synopsys VC LP for Low Power Signoff Verification Delivers Up to 5X Runtime Gain at Samsung (Nov 07, 2019)
- Abaco Announces Industry's First 6U VPX Solution to Feature New Xilinx RF System-on-Chip Technology (Nov 07, 2019)
- GLOBALFOUNDRIES and SiFive to Deliver Next Level of High Bandwidth Memory on 12LP Platform for AI Applications (Nov 06, 2019)
- Marvell Completes Acquisition of Avera Semi (Nov 06, 2019)
- Top 5 Share of Semiconductor Industry Capex to Set New Record in 2019 (Nov 06, 2019)
- Announcing OpenTitan, the First Transparent Silicon Root of Trust (Nov 06, 2019)
- Cadence Announces Tempus Power Integrity Solution for Signoff Timing-Aware IR Drop Analysis (Nov 06, 2019)
- Wireless 3D Integration – Making Stacking Silicon as Easy as Stacking Lego (1/2) (Nov. 06, 2019)
- Applause's new AI solution helps tackle bias and sources data at scale (Nov. 06, 2019)
- Dream Chip Technologies (DCT) joins the Arm Functional Safety Partnership Program (Nov 05, 2019)
- IAR Systems delivers development from device to cloud through integration with Amazon Web Services (Nov 05, 2019)
- GUC Monthly Sales Report - Oct 2019 (Nov 05, 2019)
- AdaCore Introduces Support for C++ Embedded Environments (Nov 05, 2019)
- Rambus Reports Third Quarter 2019 Financial Results (Nov 05, 2019)
- Renesas and Altair Semiconductor Announce Collaboration for Cellular IoT Solutions (Nov 05, 2019)
- 6 MEMS and Sensors Startups on Fast Track to Grow (Nov. 05, 2019)
- Wearable AI market to cross $180bn frontier by 2025 (Nov. 05, 2019)
- Xilinx Alveo Accelerators Power SK Telecom's Real-Time AI-based Physical Intrusion and Theft Detection Service (Nov 04, 2019)
- Arasan Announces MIPI D-PHY IP compliant to the latest MIPI D-PHY v2.1 Specifications (Nov 04, 2019)
- Palma Ceia SemiDesign Establishes United Kingdom Center (Nov 04, 2019)
- Global Semiconductor Sales Increase 3.4 Percent Month-to-Month in September (Nov 04, 2019)
- UltraSoC furthers academic support with Europractice partnership (Nov 04, 2019)
- OPENEDGES unveils high performance & low power GDDR6 controller IP (Nov 04, 2019)
- Faraday Reports Third Quarter 2019 Financial Results (Nov 04, 2019)
- TSMC adding 8,000 new jobs as it focuses on 3nm and beyond (Nov. 04, 2019)
- Rambus Achieves Industry-Leading GDDR6 Performance at 18 Gbps (Oct 31, 2019)
- Cadence Presented with Four 2019 TSMC Partner of the Year Awards (Oct 31, 2019)
- AI Takes Over Linley Fall Processor Conference (Oct 31, 2019)
- CEVA Appoints Bernadette Andrietti to its Board of Directors (Oct 31, 2019)
- How to Choose Between AI Accelerators (Oct 31, 2019)
- China GDP and PMI Contraction A Risk Factor For Global Economy (Oct 31, 2019)
- DMP adopted for NEDO project of "Survey of issues for finding ideas regarding Technology Development for AI Chip and Next-generation Computing for High-efficiency and High-speed Processing" (Oct 31, 2019)
- China IC 'Big Fund' Phase II Aims Self-Sufficiency (Oct 31, 2019)
- The Linley Group Microprocessor Report Highlights BrainChip's Akida™ Spiking-Neural-Network Processor (Oct. 31, 2019)
- GLOBALFOUNDRIES Appoints Amir Faintuch as SVP and General Manager Leading Computing and Wired Infrastructure Business (Oct 30, 2019)
- Silex Insight Fast-track FIPS 140-2 Certification with NIST-Validated Crypto Coprocessor (Oct 30, 2019)
- Synopsys and AMD Execute Multi-Year ZeBu Emulation Agreement (Oct 30, 2019)
- Arm to Deliver CHERI-based Prototype to Tackle Security Threats (Oct 29, 2019)
- Synopsys Accelerates Cloud Computing SoC Designs with New Die-to-Die PHY IP in Advanced 7nm FinFET Process (Oct 29, 2019)
- Optima Design Automation Launches with Focus on Next-Generation Semiconductor Functional Safety Tools (Oct 29, 2019)
- AIC Semiconductor Licenses CEVA's 802.11ax Wi-Fi 6 IP for IoT Connectivity (Oct 29, 2019)
- Hex Five Adds MultiZone Security Isolation with Micron's Authenta Flash (Oct 29, 2019)
- 'The AI Inference Processor is Dead' (Oct 29, 2019)
- Achronix and BittWare Launch VectorPath Accelerator Card with Speedster7t FPGAs (Oct 29, 2019)
- Synopsys Ships More Than 3,000 HAPS-80 Prototyping Systems (Oct 29, 2019)
- TSMC and GLOBALFOUNDRIES Announce Resolution of Global Disputes Through Broad Global Patent Cross-License (Oct 29, 2019)
- Pre-Silicon Security Assessment (Oct. 29, 2019)
- Adesto Joins STMicroelectronics Partner Program to Accelerate Time-to-Market for Customers (Oct 29, 2019)
- David Zinsner Appointed to Credo Board of Directors (Oct 29, 2019)
- NSITEXE Achieves First-Pass Silicon Success for High-Performance Data Flow Processor-based SoC Test Chip Using DesignWare IP (Oct 28, 2019)
- Xilinx Envisions its Future Without Huawei (Oct 28, 2019)
- Dr. Necip Sayiner Joins Rambus Board of Directors (Oct 28, 2019)
- SiFive Announces New U8-Series Core IP For High-Performance Compute (Oct 28, 2019)
- Micron Introduces Industry's First Silicon-Based Security-as-a-Service Platform for IoT Edge Devices (Oct 28, 2019)
- North American Semiconductor Equipment Industry Posts September 2019 Billings (Oct 28, 2019)
- Micron Introduces Comprehensive AI Development Platform (Oct 28, 2019)
- Gidel Provides 3x Acceleration of FPGA and ASIC Development and Validation for Vision and Image Processing (Oct 28, 2019)
- Sofics Analog I/O's and ESD clamps proven for TSMC 16nm, 12nm and 7nm FinFET processes (Oct 28, 2019)
- Accellera Announces Standardization Initiative to Address Design Automation and Tool Interoperability for Functional Safety (Oct 28, 2019)
- PathPartner Technology to Showcase Driver and Passenger Safety Solutions at TU-Automotive Europe (Oct. 28, 2019)
- AES Encryption IP Cores from CAST Receive NIST Certification (Oct 24, 2019)
- Renesas Expands Access to Portfolio of Leading-Edge IP Licenses (Oct 24, 2019)
- Innosilicon's Broad IP Portfolio Qualified on GLOBALFOUNDRIES 12LP FinFET Platform for High-Performance Applications (Oct 24, 2019)
- VeriSilicon Releases Most Advanced FD-SOI Design IP Platform on GLOBALFOUNDRIES 22FDX for Edge AI and IoT Applications (Oct 24, 2019)
- TensorFlow gets native support for PowerVR GPUs via optimised open-source SYCL libraries (Oct 24, 2019)
- SiFive Announces New SiFive Shield For Modern SoC Design (Oct 24, 2019)
- Veriest experts presenting at DVCon Europe Conference (Oct 24, 2019)
- RISC-V Challenges And Opportunities (Oct. 24, 2019)
- New Arm IP brings intelligent, immersive experiences to mainstream markets (Oct 23, 2019)
- Astera Labs Accelerates PCI Express 5.0 System Deployment in Collaboration with Intel and Synopsys (Oct 23, 2019)
- TSMC Outlines 5nm Plans, 7nm and EUV Progress (Oct. 23, 2019)
- The Crucial Role of PUF in AIoT Security (Oct. 23, 2019)
- Attopsemi Published Two Papers About Innovative I-fuse™ 0.4V/1uA read and 250°C Bake Reliability Data on 22nm FD-SOI at IEEE S3S Conference, 2019. (Oct. 23, 2019)
- OPENEDGES and INNOSILICON unveil advanced DDR Controller and DDR PHY integrated IP solutions (Oct 22, 2019)
- Rambus Closes Sale of Payments and Ticketing Businesses to Visa (Oct 22, 2019)
- PHY Wireless Launched to Address Today's Real World Cellular Location and Capacity Challenges (Oct 22, 2019)
- Microchip's Low-Power Radiation-Tolerant (RT) PolarFire FPGA Enables High-Bandwidth Space Systems with Lower Total System Cost (Oct 22, 2019)
- Synopsys Launches New ARC VPX DSP Processor IP for High-performance Signal Processing SoC Designs (Oct 22, 2019)
- Cadence Reports Third Quarter 2019 Financial Results (Oct 22, 2019)
- USC ISI The MOSIS Service and Samsung Foundry collaborate to spur microelectronics innovation in the US (Oct 22, 2019)
- CEVA Celebrates Wireless IoT Milestone, Surpassing 100 Licensing Deals for its Bluetooth and Wi-Fi Technologies (Oct 22, 2019)
- Chips&Media Delivers The World's First Commercial AV1 Hardware Decoder IP, WAVE510A (Oct 22, 2019)
- BrainChip Awarded New Patent for Artificial Intelligence Dynamic Neural Network (Oct 22, 2019)
- Cadence Announces First-to-Market NVMe 1.4 Verification IP for High-Performance Computing (Oct 22, 2019)
- Dialog further extends IoT influence, acquires Creative Chips for $80m cash (Oct. 22, 2019)
- GCC support for the draft Bit Manipulation Extension for RISC-V (Oct. 22, 2019)
- Samsung wants to rally more fabless customers (Oct 21, 2019)
- TSMC Recognizes Synopsys with Four "Partner of the Year" Awards (Oct 21, 2019)
- Shanghai FD-SOI Forum 2019 – the Full Recap (Oct. 21, 2019)
- Cadence 3D-IC Advanced Packaging Integration Flow Certified by Samsung Foundry for its 7LPP Process Technology (Oct 18, 2019)
- Cadence Automotive Reference Flow Certified by Samsung Foundry for Advanced-Node Design Creation (Oct 18, 2019)
- M31 Memory Compiler and GPIO are certified with ASIL-D safety level of ISO 26262 (Oct 17, 2019)
- SmartDV Heads to DVCon Europe to Showcase VIP Support for Verilator and TileLink, Demonstrate Smart ViPDebug Protocol Debugger (Oct 17, 2019)
- Locix using Imagination's Ensigma Wi-Fi IP for high-performance local positioning (Oct 17, 2019)
- The Benefits of C-Fuse OTP in IoT, FinTech, and Biometric Applications with High Security Feature (Oct 17, 2019)
- Silex Insight Introduces Hardware Security Module (HSM) for Xilinx FPGA Devices (Oct 17, 2019)
- SEAKR Selects Rambus SerDes and Security IP for Aerospace and Satellite Communications (Oct 17, 2019)
- Lattice MachXO3D Secure Control FPGA Receives Security Certification from NIST (Oct 17, 2019)
- Consortium to Set APIs for AV Hardware (Oct. 17, 2019)
- Cadence Custom/AMS Flow Certified for Samsung 5LPE Process Technology (Oct 17, 2019)
- TSMC Reports Third Quarter EPS of NT$3.90 (Oct 17, 2019)
- Synopsys Design Platforms Enabled for Samsung Foundry 2.5D-IC Multi-Die Integration (Oct 17, 2019)
- Wafer Capacity by Feature Size Shows Rapid Growth at <10nm (Oct 17, 2019)
- X-FAB Adds Non-Volatile Memory Functions to its 180nm BCD-on-SOI Platform (Oct 17, 2019)
- Confidential Computing Consortium Establishes Formation with Founding Members and Open Governance Structure (Oct 17, 2019)
- Samsung Foundry and Synopsys Deliver Comprehensive Automotive Solutions for Autonomous Driving and ADAS (Oct 17, 2019)
- CHIPS Alliance Growth Continues With New Members and Design Workshop this November (Oct 16, 2019)
- Numem Inc. Exhibits at Samsung Foundry SAFE FORUM 2019 (Oct 16, 2019)
- sureCore PowerMiser Low Power SRAM IP Now on Samsung 28nm FDS Process Technology (Oct 16, 2019)
- Silicon IP Provider Allegro DVT Acquires Amphion Semiconductor to Create a New Leader in the Video Codec IP Space (Oct 16, 2019)
- QuickLogic Teams with SiFive to Make eFPGA Technology Available via DesignShare Portfolio (Oct 16, 2019)
- Brite Semiconductor Begins Mass Production of Smart Meter Chips (Oct 16, 2019)
- 360 Reality Audio Immersive Music Services and Devices Announced with MPEG-H (Oct. 16, 2019)
- ON Semi and AImotive hook up on autonomous cars (Oct. 16, 2019)
- View from Brussels: EU refuses to play 5G blame game (Oct. 16, 2019)
- Mercury Systems Announces Strategic Investment in Trusted Microelectronics Technology Innovation (Oct 15, 2019)
- Imagination announces second generation IEEE 802.11n Wi-Fi IP designed for low-power applications (Oct 15, 2019)
- Synopsys Introduces Native Automotive Solutions Optimized for Efficient Design of Autonomous Driving and ADAS SoCs (Oct 15, 2019)
- NXP to Adopt Synopsys' Native Automotive Design Solutions for Next-generation Safety-critical SoCs (Oct 15, 2019)
- BrainChip Introduces First in a Revolutionary New Breed of Neuromorphic Computing Devices at the Linley Processor Conference (Oct 15, 2019)
- TSMC Leads in Adoption of EUV (Oct. 15, 2019)
- Infineon announces new microcontroller optimized for automotive 77 GHz radar applications (Oct. 15, 2019)
- AMBA moves forward with major revisions to AXI and CHI specifications (Oct. 15, 2019)
- Aspects of machine learning on the edge (Oct. 15, 2019)
- GLOBALFOUNDRIES Acquires Smartcom's PDK Engineering Team to Expand Worldwide Design Enablement Capacity (Oct 14, 2019)
- Arm Responds to RISC-V, and More (Oct 14, 2019)
- Samsung To Fabricate RISC-V Chip With 14LPP In Partnership With SemiFive (Oct. 14, 2019)
- Don't Miss SOI Consortium's Japan Event: 30-31 October '19, Yokohama (Oct. 14, 2019)
- Ksmartech, Leading Korean Developer Partners with Verimatrix to Offer Powerful App Security Technology for Automotive, Financial Markets (Oct. 14, 2019)
- When Your Teenage Robot Can Drive (Oct. 13, 2019)
- 2019 Microprocessor Slump Snaps Nine Years of Record Sales (Oct 11, 2019)
- Achronix, Cisco, Facebook, Netronome, NXP and zGlue Collaborate on Proof-of-Concept for Chiplet Solutions as Part of OCP ODSA Subproject (Oct 10, 2019)
- GLOBALFOUNDRIES Qualifies Synopsys Fusion Design Platform on 12LP FinFET Platform (Oct 10, 2019)
- GLOBALFOUNDRIES and Racyics GmbH Demonstrate Ultra-Low-Power Microcontroller for the Internet of Things (Oct 10, 2019)
- Samsung Introduces Advanced Automotive Foundry Solutions Tailored to EMEA Market at Samsung Foundry Forum 2019 Munich (Oct 10, 2019)
- GLOBALFOUNDRIES Brings New Level of Security and Protection on 22FDX Platform for Connected Systems (Oct 10, 2019)
- UMC Reports Sales for September 2019 (Oct 09, 2019)
- TSMC September 2019 Revenue Report (Oct 09, 2019)
- Cadence Collaborates with Arm and Samsung Foundry on Delivery of 5LPE Flow for Mission-Critical Applications Using Next-Generation "Hercules" CPU (Oct 09, 2019)
- Renesas Electronics Unveils RA Family of 32-Bit Arm Cortex-M Microcontrollers with Superior Performance and Advanced Security for Intelligent IoT Applications (Oct 09, 2019)
- Enterprises are leaving IoT devices vulnerable to cybersecurity threats, finds nCipher Security (Oct. 09, 2019)
- IEEE SOI Conference takes place 14-17 October 2019 (Oct. 09, 2019)
- Qorvo Acquires Cavendish Kinetics, Inc. (Oct 08, 2019)
- Dream Chip Technologies joined Samsung Foundry's Design Solution Partner (DSP) Program (Oct 08, 2019)
- IC'Alps joins Arm Approved Design Partner program to better support customers with ASIC development (Oct 08, 2019)
- Synopsys, Arm, and Samsung Foundry Enable Accelerated Development of Next-Generation Arm "Hercules" Processor on 5LPE Process (Oct 08, 2019)
- Silex Insight and Medium Inc. accelerate towards 1 million ECDSA signature verifications per second on a blockchain (Oct. 08, 2019)
- CCIX Consortium Releases CCIX Base Specification Revision 1.1 Version 1.0 with Support for 32GT/s (Oct. 08, 2019)
- A Total Compute approach to delivering digital immersion under a common architecture (Oct 08, 2019)
- Arm and silicon partners collaborate on IoT development through new Mbed OS Partner Governance model (Oct 08, 2019)
- Collaborating for an autonomous future: Arm and industry leaders establish the Autonomous Vehicle Computing Consortium (Oct 08, 2019)
- UltraSoC announces next-generation hardware-based cybersecurity products (Oct 08, 2019)
- Arm Announces Custom Instructions for embedded CPUs and Mbed OS Partner Governance (Oct 08, 2019)
- Samsung Electronics Announces Earnings Guidance for 3Q 2019 (Oct. 08, 2019)
- Mentor boosts 64-bit Arm-based server platform by enabling Arm architecture support for Questa simulation tools (Oct. 08, 2019)
- US adds Chinese AI firms to ban list citing abuses against Muslims in Xinjiang (Oct. 08, 2019)
- MIPI Alliance Advances Activities for ADAS, ADS and Other Automotive Applications (Oct. 08, 2019)
- Synopsys to Showcase Optimized Solutions for Arm-based Designs at Arm TechCon 2019 (Oct 07, 2019)
- GUC Monthly Sales Report - Sep 2019 (Oct 07, 2019)
- Dialog Semiconductor to Acquire Creative Chips adding Industrial IoT Products to its Portfolio (Oct 07, 2019)
- Achronix Exhibits High-Performance FPGA and eFPGA IP Solutions at Arm TechCon (Oct 07, 2019)
- Synopsys Announces Industry-First Unified Functional Safety Verification Solution to Accelerate Time-to-Certification for IPs and SoCs (Oct 07, 2019)
- TSMC's N7+ Technology is First EUV Process Delivering Customer Products to Market in High Volume (Oct 07, 2019)
- Adesto Engages with the European Space Agency to Develop Next-Generation Satellite Communications Technology (Oct 07, 2019)
- Moortec to Showcase its Latest Embedded PVT Monitoring IP for 40nm-5nm at the 2019 ARM TechCon in San Jose (Oct 07, 2019)
- LG Launched Phone Powered by Gyrfalcon Technology Inc.'s AI Chip (Oct. 07, 2019)
- ESA Contract Awarded for High-Performance Compute Board (Oct. 07, 2019)
- Verimatrix nTitleMe Receives Perfect Score from Broadband Technology Report’s Diamond Technology Reviews 2019 (Oct. 07, 2019)
- How China is aiming for a state of technological independence (Oct. 07, 2019)
- CAN to TSN Gateway from CAST Bridges CAN 2.0/FD Buses with Time Sensitive Ethernet (Oct 04, 2019)
- IP Controller Core CAN 2.0b and CAN FD of Fraunhofer IPMS certified according to ISO security standard (Oct. 03, 2019)
- Synopsys Completes Acquisition of QTronic GmbH (Oct 03, 2019)
- Silicon Creations Named 2019 TSMC Partner of the Year for Analog / Mixed-Signal IP (Oct 03, 2019)
- Los Alamos National Laboratory Teams with Arm to Develop Tailored, Efficient Processor Architectures (Oct 03, 2019)
- NXP Launches the GHz Microcontroller Era (Oct 03, 2019)
- Xilinx Announces Vitis - a Unified Software Platform Unlocking a New Design Experience for All Developers (Oct 02, 2019)
- M31 Technology Won TSMC's 2019 Partner of the Year Award for Specialty Process IP (Oct 02, 2019)
- Adesto and Cadence Collaborate to Expand xSPI Ecosystem for Emerging IoT Devices (Oct. 02, 2019)
- SmartDV Adds Support for Verilator Open Source HDL Verilog Simulator (Oct 01, 2019)
- TSMC Files Complaints Against GlobalFoundries in U.S., Germany and Singapore for Infringement of 25 Patents to Affirm its Technology Leadership and to Protect Its Customers and Consumers Worldwide (Oct. 01, 2019)
- HDL Design House Appoints Frank Werner as Worldwide Sales Director (Oct 01, 2019)
- Global Semiconductor Sales Down 15.9 Percent Year-to-Year in August (Oct 01, 2019)
- Andes Technology and Tiempo Secure Announce Strategic Partnership to Enhance RISC-V Platform Security up to CC EAL5+ Certification (Oct. 01, 2019)
- How big data and IoT initiatives render the 'garbage in, garbage out' theory invalid (Oct. 01, 2019)
- Announcing the Winners of the RISC-V Soft CPU Contest (Oct. 01, 2019)
- Total Wafer Shipments to Drop 6 Percent in 2019, Resume Growth in 2020, Set New High in 2022, SEMI Reports (Sep 30, 2019)
- Huawei & Arm Meet Behind Closed Doors (Sep 30, 2019)
- New Lattice CrossLinkPlus FPGAs Accelerate and Enhance Video Bridging for World-class MIPI-based Embedded Vision Systems (Sep 30, 2019)
- Live webinar from Dolphin Design: Pushing the limit of SoC energy efficiency with a NEW secret technique (Sep 30, 2019)
- XMOS secures $19M funding to accelerate growth (Sep 30, 2019)
- SiFive Enables Embedded Vision With New DesignShare Partners (Sep 30, 2019)
- Synopsys Introduces PrimeECO Solution for Zero-Iteration Signoff-Driven Design Closure (Sep 30, 2019)
- Titan IC to Accelerate Pattern and String Matching on Mellanox's New BlueField-2 I/O Processing Unit (IPU) Device (Sep 30, 2019)
- UltraSoC selected by Japan's NSITEXE for automotive development (Sep 30, 2019)
- Gen-Z Physical Layer Specification 1.1 now available for download (Sept. 30, 2019)
- Globalfoundries to IPO (Sept. 30, 2019)
- Going All-in with Edge AI (Sept. 30, 2019)
- Software infuses AI into high-performance computing (Sept. 30, 2019)
- Accurate Current Detection for Motor Control, Battery Life (Sept. 30, 2019)
- AI-Based Soft Switching Cuts Losses to Extend EV Range (Sept. 30, 2019)
- GLOBALFOUNDRIES Achieves More Than $1 Billion in Design Wins for 45RFSOI Solution for Mobile and Wireless Infrastructure Applications (Sep 27, 2019)
- Multiple Mentor product lines now certified on TSMC's most advanced processes (Sep 27, 2019)
- Sofics releases pre-silicon analog I/O's for high-speed SerDes for TSMC N5 process technology (Sep 27, 2019)
- Data Compression Accelerators from CAST Now Available on Xilinx Alveo Boards (Sep 27, 2019)
- GLOBALFOUNDRIES Appoints Michael Hogan as SVP and General Manager to Support New Market Engagement Strategy (Sep 27, 2019)
- Lattice Semiconductor and Synopsys Renew Partnership on FPGA Synthesis Tools (Sep 26, 2019)
- TSMC's Leading-Edge Fab Investments Set Stage for Sale Surge in 2H19 (Sep 26, 2019)
- Rambus Tapes Out 112G XSR SerDes PHY on Leading-edge 7nm Process (Sep 26, 2019)
- Truechip Announces First Customer Shipment of CXL Verification IP (Sep 26, 2019)
- Adesto Reaches Shipment Milestone of One Billion Non-Volatile Memory Devices (Sept. 26, 2019)
- Synopsys and TSMC Collaborate for Certification on 5nm Process Technologies to Address Next-generation HPC, Mobile Design Requirements (Sep 26, 2019)
- Analog Bits Showcases Silicon of Analog and Mixed Signal IP Products on TSMC N7 Process Targeting Automotive Grade with Split Corner Lots and PVT Characterization Results Available (Sep 26, 2019)
- SiFive Announces Key Enablement Of Trace And Debug (Sep 26, 2019)
- Moortec to Showcase its Advances in Embedded PVT Monitoring IP for 40nm-5nm at 2019 TSMC Open Innovation Platform Ecosystem Forum in Santa Clara (Sep 26, 2019)
- Arm and TSMC Demonstrate Industry's First 7nm Arm-based CoWoS Chiplets for High-Performance Computing (Sep 26, 2019)
- Synopsys and TSMC Collaborate to Develop Portfolio of DesignWare IP for TSMC 5nm FinFET Plus (N5P) Process (Sep 26, 2019)
- New Version of Most Widely Used Camera and Imaging Interface - MIPI CSI-2 - Designed to Build Capabilities for Greater Machine Awareness (Sep 26, 2019)
- Veriest announces opening of Budapest office (Sep 25, 2019)
- CEO Leaves Wave, Putting MIPS' Future in Doubt (Sep 25, 2019)
- Synopsys Extends Portfolio of Cloud Computing IP with 112G Ethernet PHY for Hyperscale Data Center SoCs (Sep 25, 2019)
- Achronix Joins TSMC IP Alliance Program (Sept. 25, 2019)
- European Space Agency Selects AdaCore's Qualified Multitasking Solution for Spacecraft Software Development (Sep 25, 2019)
- UMC Receives Final Approval for 100% Acquisition of Mie Fujitsu Semiconductor (Sep 25, 2019)
- Kandou Secures $56 Million in Series C Funding (Sep 25, 2019)
- M31 Technology Develops Optimized IP Solutions on Multiple TSMC Specialty Processes (Sep 25, 2019)
- Breker Verification Systems Unveils Intelligent Regression Optimization Solution to Accelerate Simulation, Emulation Execution (Sep 25, 2019)
- Evaluation Boards Now Available for Flex Logix EFLX4K eFPGA on GLOBALFOUNDRIES' Most Advanced FinFET Platform (Sept. 25, 2019)
- Andes and Dover Microsystems Partner to Deliver Professional Network Security Solution for RISC-V (Sept. 25, 2019)
- Cadence Digital and Signoff Full Flow and Custom/Analog Tools Certified for TSMC N6 and N5/N5P Process Technologies (Sep 25, 2019)
- Moortec to Showcase its Advances in Embedded PVT Monitoring IP for 40nm-5nm at 2019 TSMC Open Innovation Platform® Ecosystem Forum in Santa Clara (Sept. 25, 2019)
- No-Shows Blight AI Hardware Summit (Sept. 25, 2019)
- Alibaba unveils new AI chip aimed at speeding up e-commerce and cloud computing tasks (Sept. 25, 2019)
- CSEM joins GLOBALFOUNDRIES' FDXcelerator Program bringing ultra-lowPower IP to 22FDX process (Sept. 24, 2019)
- Andes Technology Features 32-bit A25MP and 64-bit AX25MP RISC-V Multicore Processors With Andes Custom Extension at TSMC 2019 Open Innovation Platform Ecosystem Forum (Sept. 24, 2019)
- eMemory Wins 2019 TSMC IP Partner of the Year Award (Sep 24, 2019)
- GLOBALFOUNDRIES Introduces 12LP+ FinFET Solution for Cloud and Edge AI Applications (Sept. 24, 2019)
- Analog Bits and Aragio Solutions Team Up with GLOBALFOUNDRIES to Deliver Automotive IP Solutions (Sep 24, 2019)
- Synergy between the Arm ecosystem and OCP communities to support the growth of compute infrastructure (Sept. 24, 2019)
- Tessolve Proudly Announces The Launch Of 'Qubo' By It's Parent Company Hero Electronix (Sept. 24, 2019)
- Avery Design Introduces CXL VIP (Sep 23, 2019)
- Avery Design Partners with Marquee Semiconductor to Provide Sales, Support in India, and Deepens its Relationship to Prime Marquee's SoC Solution Platform (Sep 23, 2019)
- Cambridge Consultants Becomes Arm Approved Design Partner (Sep 23, 2019)
- Spectral Design and Test Inc., Announces a New Family of MemoryIP Targeted at the 5G Market (Sep 23, 2019)
- IAR Systems launches functional safety tools for STMicroelectronics' 8-bit MCUs (Sep 23, 2019)
- Rambus Announces Portfolio of Advanced Memory and SerDes PHYs on TSMC N7 Process (Sep 23, 2019)
- Silicon Creations to Showcase PLL Developments on 22nm to 5nm Processes at TSMC 2019 Open Innovation Platform Ecosystem Forum (Sep 23, 2019)
- eSilicon Announces Availability of 7nm High-Bandwidth Interconnect (HBI+) PHY for Die-to-Die Interconnects (Sep 23, 2019)
- Moortec Drives Optimised Performance & Increased Device Reliability on TSMC's N5 and N5P Process Technologies with its Complete In-Chip Monitoring Subsystem (Sep 23, 2019)
- Dolphin Integration becomes Dolphin Design (Sep 23, 2019)
- North American Semiconductor Equipment Industry Posts August 2019 Billings (Sep 23, 2019)
- Xilinx Announces Chief Financial Officer Transition (Sep 20, 2019)
- Intel Ships Stratix 10 DX FPGAs; VMware Among Early Partners (Sep 20, 2019)
- Alphawave IP Announces Industry Veteran and Marvell Founder Dr. Sehat Sutardja Has Joined Its Board of Directors (Sep 20, 2019)
- Attopsemi Technology Presented "I-fuse: Dream OTP Finally Comes True" and won the best Innovative IP award on IP SoC 2019 China (Sep 20, 2019)
- CAST CAN 2.0/FD Bus IP is Safety-Ready with ISO 26262 Certification (Sep 20, 2019)
- ECOC 2019: eSilicon to Demonstrate 7nm 58G DSP-Based SerDes Over Seven-Meter and Three-Meter Samtec Cable Assemblies (Sep 19, 2019)
- SEGGER Makes Its Entire Ecosystem of Tools Available for AndesCores (Sep 19, 2019)
- Semiconductor Acquisitions Regain Momentum in 2019 (Sep 19, 2019)
- 5G和电动汽车市场快速发展，SOI晶圆会缺货吗？ (Sept. 19, 2019)
- Intensivate Engages SiFive's RISC-V Expertise to Develop Leading Accelerator (Sep 19, 2019)
- Veriest kick-starts Formal Verification methodology at Valens (Sep 18, 2019)
- Faraday's SoC Projects Doubled for Three Consecutive Years (Sep 18, 2019)
- Compute Express Link Consortium (CXL) Officially Incorporates; Announces Expanded Board of Directors (Sep 18, 2019)
- 5倍产能爬坡，FD-SOI的体量又庞大了一圈 (Sept. 18, 2019)
- Mixel's MIPI D-PHY IP Integrated into Microsoft's Azure Kinect DK Depth Camera (Sep 17, 2019)
- Notes from 7th Shanghai FD-SOI Forum held on September 16, 2019 (Sept. 17, 2019)
- Infineon and Synopsys Collaborate to Accelerate Artificial Intelligence in Automotive Applications (Sep 17, 2019)
- Alphawave IP Announces Industry Veteran and Marvell Founder Dr. Sehat Saturdja Has Joined Its Board of Directors (Sep 17, 2019)
- CEVA Introduces New AI Inference Processor Architecture for Edge Devices with Co-processing Support for Custom Neural Network Engines (Sep 17, 2019)
- SmartDV Announces Availability of Ethernet TSN Design IP (Sep 17, 2019)
- ESD Alliance Reports EDA Industry Revenue Increase for Q2 2019 (Sep 17, 2019)
- LIWEST Becomes Latest Austrian Operator to Evolve IPTV Security with Verimatrix and Ocilion (Sept. 17, 2019)
- Intrinsic ID Security Summit 2019 (Sept. 17, 2019)
- UltraSoC opens engineering center in Poland and accelerates its global expansion (Sep 16, 2019)
- Fabs Valued at Nearly $50 Billion to Start Construction in 2020 (Sep 16, 2019)
- Sri Lanka Telecom Selects Proven Partner Ecosystem to Deploy Large Scale TV Everywhere Experience in Island Nation (Sep 16, 2019)
- Arm Flexible Access for Research to accelerate innovation for academia and research (Sep 16, 2019)
- Synopsys Simplifies Automotive SoC Development with New ARC Functional Safety Processor IP (Sep 16, 2019)
- Synopsys' New Embedded Vision Processor IP Delivers Industry-Leading 35 TOPS Performance for Artificial Intelligence SoCs (Sep 16, 2019)
- Wi-Fi CERTIFIED 6 delivers new Wi-Fi era (Sep 16, 2019)
- GOWIN Semiconductor Announces their GoAI Solution for AI Acceleration at the Edge (Sep 16, 2019)
- Silvaco Partners with HDL Design House for Analog and Digital IC Design Services (Sep 16, 2019)
- Socionext Adds 8K Encoding Feature to M820L Media Accelerator Card (Sep 16, 2019)
- Moortec Announces Lee Vick as their New VP of North America Sales (Sep 16, 2019)
- India Branching Out into Chip Design (Sep 16, 2019)
- AI Hardware Summit 2019: Booth-to-Booth eSilicon 58G DSP-Based SerDes Demonstration Over a Five-Meter Samtec Copper Cable (Sep 16, 2019)
- SiTune Passes Milestone of Shipping Two Million 8K TV Silicon Tuners (STN6528) (Sep 16, 2019)
- Advantech accelerates the move to IP with Adeas/Nextera ST2110/NMOS Core (Sep 16, 2019)
- 剪刀手"拍照泄露指纹信息？辟谣来了！ (Sept. 16, 2019)
- Synopsys ARC Embedded Vision Processors Deliver 35 TOPS (Sept. 16, 2019)
- Tasking Lives Up To Its Promises (Sept. 13, 2019)
- Leading the Digital Transformation of the Car at IAA Frankfurt (Sept. 13, 2019)
- MIT engineers build advanced microprocessor out of carbon nanotubes (Sep 12, 2019)
- AI Chip Market to More than Double in 5 Years (Sep 12, 2019)
- Verimatrix signs a binding agreement to sell its Silicon IP business unit to Rambus (Sep 12, 2019)
- AGIC C-Fuse OTP High-Temperature-Immunity Tailored for AEC-Q100 Grade 0 Applications (Sep 12, 2019)
- Rambus Signs Agreement to Acquire Silicon IP and Secure Protocols Business from Verimatrix (Sep 12, 2019)
- Second Quarter 2019 Worldwide Semiconductor Equipment Billings of $13.3 Billion Down 20 Percent from 2018, 3 Percent from Prior Quarter (Sep 12, 2019)
- Silex Insight releases ARIA crypto engine for the Korean market (Sep 12, 2019)
- Samsung's (Very!) Good 28FDS News Just Keeps Coming (Sept. 12, 2019)
- SmartDV to Demonstrate TileLink Verification IP for RISC-V Based Systems, Smart ViPDebug Protocol Debugger at DVCon India (Sep 11, 2019)
- MIPI Alliance Opens Access to its Debug and Trace Specifications (Sep 11, 2019)
- Western Digital Accelerates Leadership in Next-Generation Data Center Architectures With Acquisition of Kazan Networks (Sep 11, 2019)
- JEDEC Announces Publication of Serial Presence Detect Support and Module Labels Specifications to Support New Hybrid Memory (NVDIMM) (Sep 11, 2019)
- Synopsys Delivers Industry's First Compute Express Link (CXL) IP Solution for Breakthrough Performance in Data-Intensive SoCs (Sep 11, 2019)
- IAR Systems updates RISC-V development tools (Sept. 11, 2019)
- Memory Forecast to Account for 43% of Total 2019 Semi Spending (Sep 10, 2019)
- Swift Media Reinvests in Verimatrix with VCAS Ultra Upgrade and Expansion (Sep 10, 2019)
- WiSig Networks License CEVA's Cellular IoT Technology to Serve the India Market (Sep 10, 2019)
- Swift Navigation Partners with Arm to Bring Precise Positioning Technology to Autonomous Vehicle Compute Platforms (Sep 10, 2019)
- TSMC August 2019 Revenue Report (Sep 10, 2019)
- Agile Analog welcomes Sir Hossein Yassaie, former Imagination Technologies Founder and CEO, to its Board (Sep 10, 2019)
- HCL Technologies to acquire Sankalp Semiconductor to enhance leadership in the semiconductors and industrial IoT spaces (Sep 10, 2019)
- The Journey of RISC-V Implementation (Sept. 10, 2019)
- Apple Will Be Hard-Pressed to Build a Rock Star 5G Modem (Sep 09, 2019)
- Synopsys Collaborates with Google Cloud to Broadly Scale Cloud-based Functional Verification (Sep 09, 2019)
- Kandou Announces Development of USB4 Retimer (Sep 09, 2019)
- UMC Reports Sales for August 2019 (Sep 09, 2019)
- PLDA Achieves PCI Express 4.0 Compliance for its XpressRICH PCIe Controller IP During the First Official PCI-SIG PCIe 4.0 Compliance Workshop (Sep 09, 2019)
- eMemory IP Garners Most Stringent Level of Certification for Automotive Applications (Sep 09, 2019)
- Huawei, Qualcomm, Samsung Reveal Integrated 5G Chips (Sep 09, 2019)
- Rambus Reports Inducement Grants under NASDAQ Listing Rule 5635(c)(4) (Sep 09, 2019)
- PUFsecurity Leverages NeoPUF to Lead Hardware Security Technology (Sep 06, 2019)
- Imagination launches game-changing IMG Edge services platform for design verification and validation (Sep 06, 2019)
- Palma Ceia SemiDesign Receives "Excellent Solution Award" at Internet of Things and Smart City Exhibition in Shenzhen (Sep 05, 2019)
- Vidatronic and IP-Semantics Join Forces in California's Silicon Valley (Sep 05, 2019)
- GUC Monthly Sales Report - Aug 2019 (Sep 05, 2019)
- CacheQ Debuts Heterogeneous Compute Development Environment (Sep 05, 2019)
- Veriest collaborates with MINRES on RISC-V development (Sep 05, 2019)
- Silex Insight and Wave Computing Collaborate to Deliver Security-Conscious Artificial Intelligence (AI) Platforms Across Enterprise and Automotive Markets (Sep 05, 2019)
- Edgewater Expands into Licensing of Breakthrough IP (Sep 05, 2019)
- Nations Technologies Selects QuickLogic's ArcticPro eFPGA to Power its Next Generation Low Power IoT SoC (Sep 04, 2019)
- Global Semiconductor Sales Decrease 15.5 Percent Year-to-Year in July (Sep 04, 2019)
- InnoGrit adopts M31's optimization solutions of PCIe 4.0/3.0 and ONFi 4.1 I/O IP cores for Artificial Intelligence Storage chips (Sep 04, 2019)
- Rambus to Acquire Silicon IP and Secure Protocols Business From Verimatrix, Creating Global Authority in Semiconductor Security IP (Sep 04, 2019)
- Credo Announces Production Availability of HiWire Active Electrical Cables (Sep 04, 2019)
- Verimatrix Enters into Exclusivity Agreement to Sell its Silicon IP Business Unit to Rambus (Sep 04, 2019)
- NASA awards five 2019 SBIR/STTR Phase I research programs to Alphacore (Sep 04, 2019)
- VESA Updates DisplayHDR Standard with Tighter Specifications and New DisplayHDR 1400 Performance Level (Sep 04, 2019)
- High-Efficiency Power Management for Electric Vehicles (Sept. 04, 2019)
- Seeed Releases Sipeed's Longan Nano RISC-V Development Board (Sept. 04, 2019)
- RISC-V for everybody (Sept. 04, 2019)
- Nvidia Turns to RISC-V for RC18 Research Chip IO Core (Sept. 04, 2019)
- IP Security Assurance Standard (Sept. 04, 2019)
- Details of Hailo AI Edge Accelerator Emerge (Sep 03, 2019)
- Credo Announces the HiWire Consortium for Standardization and Certification of Active Electrical Cables (AEC) (Sep 03, 2019)
- Brite Semiconductor and Synopsys Extend IP OEM Partnership (Sep 03, 2019)
- USB-IF Announces Publication of USB4 Specification (Sep 03, 2019)
- 300mm Fab Equipment Spending to Seesaw, Reach New Highs in 2021 and 2023, SEMI Reports (Sep 03, 2019)
- Synopsys Enables First-Pass Silicon Success of High Performance NSITEXE Data Flow Processor-based SoC Test Chip for Autonomous Driving (Sep 03, 2019)
- Healthcare IoT requires stronger security strategies against cyberattacks, says Irdeto Research (Sept. 03, 2019)
- ProtectMyApp From Verimatrix Wins Gold in 2019 International Business Awards (Sept. 03, 2019)
- Verimatrix Integrates Multi-DRM with Amazon Web Services Elemental Secure Packager Encoder Key Exchange (SPEKE) API (Sep 02, 2019)
- Keysight Technologies, Kandou Bus Collaborate to Advance Chord Signaling Technology for High-Speed Digital Applications (Sep 02, 2019)
- Moortec's 28nm Embedded Thermal Sensing Solution selected by InnoGrit to Optimise Performance and Reliability in their latest SSD Controller Chip (Sep 02, 2019)
- GlobalFoundries' Goal: Harass TSMC Customers (Sep 02, 2019)
- Gartner forecasts explosion in enterprise and automotive IoT endpoint usage (Sept. 02, 2019)
- Intel Ships First 10nm Agilex FPGAs (Aug 30, 2019)
- Full support for first flash-based RISC-V microcontroller (Aug. 30, 2019)
- SMIC Announces Unaudited 2019 Interim Results (Aug 29, 2019)
- Sean Fan Joins Rambus as Chief Operating Officer (Aug 29, 2019)
- Global Top Ten IC Design Companies for 2Q19 Ranked by Revenue Released, with Top Five Registering Revenue Fall, Says TrendForce (Aug 29, 2019)
- Researchers build RISC-V chip from carbon nanotubes (Aug. 29, 2019)
- BFloat16 processing for Neural Networks on Armv8-A (Aug. 29, 2019)
- Machine vision utilising artificial intelligence (Aug. 29, 2019)
- Global Foundries/TSMC Wrangle Seen Dragging Industry Down (Aug 28, 2019)
- Mellanox Technologies Selects Verimatrix Silicon IP to Secure Family of Chipsets (Aug 28, 2019)
- Sofics releases pre-silicon analog I/O's for high-speed SerDes for 5nm FinFET technology (Aug 28, 2019)
- AndesCore N22 RISC-V Core Supports RV32IMAC or RV32EMAC Instruction Sets (Aug. 28, 2019)
- Homomorphic Encryption Finally Ready for Commercial Adoption (Aug. 28, 2019)
- Blockchain Bolstering the Internet of Things (Aug. 28, 2019)
- Arasan and Xilinx announce their design win in providing a Total UFS 3.0 Solution to Wuhan Jingce (Aug 27, 2019)
- TSMC Will Vigorously Defend its Proprietary Technology in Response to GlobalFoundries Complaints (Aug 27, 2019)
- sureCore Unveils Low Power Design Service (Aug 27, 2019)
- GigaDevice unveils the GD32V series with RISC-V core, in a brand new 32bit general purpose microcontroller (Aug 27, 2019)
- Creonic Participates in National Research Project KI-Radar (Aug 27, 2019)
- Rambus Completes Acquisition of Northwest Logic, Extending Leadership in Interface IP (Aug 27, 2019)
- RISC-V Bases and Extensions Explained (Aug. 27, 2019)
- RISC-V Is Experiencing a Period of Optimism and Growth with Global Revenue Expected to Reach $1.1 Billion by 2025, According to Tractica (Aug. 27, 2019)
- Blog: AI's Memory Problem (Aug. 27, 2019)
- Sofics releases analog I/O's for high-speed SerDes in TSMC N5 FinFET technology (Aug 26, 2019)
- Does Your AI Chip Have Its Own DNN? (Aug 26, 2019)
- GLOBALFOUNDRIES Files Patent Infringement Lawsuits Against TSMC In the U.S. and Germany (Aug 26, 2019)
- DARPA unveils first SSITH prototype to mitigate hardware flaws (Aug. 23, 2019)
- Next Generation Video Codec Standard Proposed: MPEG Video Coding for Machines (VCM) (Aug 22, 2019)
- Synopsys Posts Financial Results for Third Quarter Fiscal Year 2019 (Aug 22, 2019)
- Qualcomm And LGE Enter Into a New Global Patent License Agreement (Aug 22, 2019)
- HDL Design House Introduces Expandable SoC IoT Platform (Aug 22, 2019)
- Porsche Invests in Israeli Startup TriEye to Increase Road Visibility and Safety (Aug 22, 2019)
- Meet EnSilica at TI Automotive, India 2019 (Aug. 22, 2019)
- Is It Time to Forget about Huawei? (Aug 22, 2019)
- Creonic Demonstrates its Beyond 5G FEC IP at the EuCNC Conference (Aug 22, 2019)
- Unlocking Cortex-A53's Safety Potential (Aug. 22, 2019)
- How to Design SmartNICs Using FPGAs to Increase Server Compute Capacity (WP017) (Aug. 22, 2019)
- Top-15 Semiconductor Suppliers' Sales Fall by 18% in 1H19 (Aug 21, 2019)
- Western Digital's Long Trip from Open Standards to Open Source Chips (Aug. 21, 2019)
- Xilinx Announces the World's Largest FPGA Featuring 9 Million System Logic Cells (Aug 21, 2019)
- Intel unwraps its first chip for AI and calls it Spring Hill (Aug. 21, 2019)
- Autonomous Robots Put to Work: The Top Five Robots in Common Use (Aug. 21, 2019)
- Will More-than-Moore Take Off in China? (Aug 20, 2019)
- Lauterbach to support JTAG debug for RISC-V Linux (Aug. 20, 2019)
- Codasip studio and Codasip Codespace 8.1 available (Aug. 20, 2019)
- Arm TechCon 2019: Showcasing the New Era of Total Compute (Aug. 20, 2019)
- Atmosic and QuickLogic Partner to Enable Always-On, Always-Listening Voice Interactivity in Audio and Sensor Processing Platform (Aug. 20, 2019)
- MediaTek on track to unveil 5G SOCs (Aug. 20, 2019)
- Arm, WDC and Qualcomm Announce OpenChain Conformance Activities (Aug 19, 2019)
- Arasan Chip Systems expands its storage IP Portfolio with ONFI 4.1 PHY and I/O PAD IP seamlessly integrated with its NAND Flash Controller IP for UMC 28nm SoC Designs (Aug 19, 2019)
- Alphacore To Develop Rad-Hard CMOS Standard Cell Library, Meeting DOD Standards, For U.S. Navy (Aug 19, 2019)
- UPMEM Puts CPUs Inside Memory to Allow Applications to Run 20 Times Faster (Aug 19, 2019)
- Chinese Foundry SMIC Begins 14nm Production (Aug. 19, 2019)
- Questa Slec tool from Mentor, a Siemens Business, to help Codasip speed up verification of multiple HDL outputs (Aug. 19, 2019)
- Arm and Clavister partnership brings security to the edge (Aug. 19, 2019)
- Startup Spins Whole Wafer for AI (Aug. 19, 2019)
- Researchers Publish Roadmap for RISC-V Opportunities in Space Tech (Aug. 16, 2019)
- Growing adoption of IoT devices is the largest cyber security risk (Aug. 16, 2019)
- Gyrfalcon's Cutting-edge Technology for Creating AI Accelerator Chips Commended by Frost & Sullivan (Aug 15, 2019)
- eSilicon to debut AI Accelerator software and a new chiplet model at Hot Chips 2019 (Aug 15, 2019)
- Meera Rao Joins Rambus Board of Directors (Aug 14, 2019)
- Perceptia Joins GLOBALFOUNDRIES Events in Santa Clara, Munich (Aug 14, 2019)
- SmartDV to Exhibit at OpenPower Summit August 19-20 (Aug 14, 2019)
- Tortuga Logic Verifies Rambus CryptoManager Root of Trust with Industry-Leading Security Verification Framework, Radix (Aug 14, 2019)
- Microcontrollers Will Regain Growth After 2019 Slump (Aug 14, 2019)
- RISC-V EMEA Roadshow Spotlight: GreenWaves Technologies (Aug. 14, 2019)
- TSMC board approves US$6.5 billion for advanced process, capacity expansion business (Aug. 14, 2019)
- Gyrfalcon's Cutting-edge Technology for Creating AI Accelerator Chips Commended by Frost & Sullivan (Aug. 14, 2019)
- Industry survey highlights eSIM and iSIM deployment challenges (Aug. 13, 2019)
- What OEMs Really Think About eSIM and iSIM (Aug. 13, 2019)
- Safety improvements becoming key to measuring IoT project success, says IDC (Aug. 13, 2019)
- Taiwan is fast in 5G deployments, says Ericsson executive (Aug. 13, 2019)
- Toppan Photomasks and GLOBALFOUNDRIES Enter into Multi-Year Supply Agreement (Aug. 13, 2019)
- Adesto's FT 6050 Smart Transceiver Now Natively Supports both LonWorks and BACnet Protocols (Aug 12, 2019)
- StarHub and Temasek to Bolster Ensign's Cyber Security Capabilities with D'Crypt (Aug 12, 2019)
- TSMC July 2019 Revenue Report (Aug 12, 2019)
- Everspin and Seagate Sign IP Patent Assignment and Licensing Agreements (Aug 12, 2019)
- Sundance launches VCS-1 embedded processor module for precision robotics applications (Aug 12, 2019)
- EDA, AVs Find Common Language (Aug 12, 2019)
- The Century War: AC vs. DC Has Returned to the Battlefield (Aug. 12, 2019)
- 5G Announcements Coming Fast and Furious (Aug. 12, 2019)
- 38 Chip Billionaires Created in China (Aug. 12, 2019)
- China's First Open Source Software Foundation Coming Up Soon (Aug. 12, 2019)
- IBM-owned Red Hat Joins Foundation for Developing Open Source RISC-V ISA (Aug. 09, 2019)
- Arm Revenues Up, Royalties Down (Aug 08, 2019)
- UltraSoC strengthens global team with appointments in Asia and USA (Aug 08, 2019)
- 76% of IC Products Expected to See Flat/Negative Growth in 2019 (Aug 08, 2019)
- Forming a Benchmark for ML at the Edge (Aug. 08, 2019)
- Faraday Leads Industry with 28G Programmable SerDes at 28nm for Networking ASIC (Aug 08, 2019)
- UMC Reports Sales for July 2019 (Aug 08, 2019)
- CEVA, Inc. Announces Second Quarter 2019 Financial Results (Aug 08, 2019)
- SMIC Reports 2019 Second Quarter Results (Aug 08, 2019)
- Western Digital Announces Technology Leadership Transition (Aug. 08, 2019)
- Synopsys to Acquire QTronic GmbH (Aug 07, 2019)
- VeriSilicon Launches VIP9000, New Generation of Neural Processor Unit IP (Aug 07, 2019)
- GLOBALFOUNDRIES and Arm Demonstrate High-Density 3D Stack Test Chip for High Performance Compute Applications (Aug 07, 2019)
- RISC-V Roadshow in Europe, Sep 16-26, 2019 (Aug. 07, 2019)
- CEVA and Immervision Enter into Strategic Partnership for Advanced Image Enhancement Technologies (Aug 06, 2019)
- Cadence and UMC Collaborate on Certification of Analog/Mixed-Signal Flow for 28HPC+ Process (Aug 06, 2019)
- Mid-Year Global Semiconductor Sales Down 14.5 Compared to 2018 (Aug 06, 2019)
- Eta Compute Appoints Dr. Ted Tewksbury Chief Executive Officer (Aug 06, 2019)
- Andes Records Rapid Growth of RISC-V Processors Licensing Agreements in the First Half of 2019 (Aug 06, 2019)
- Xilinx Expands Alveo Portfolio with Industry's First Adaptable Compute, Network and Storage Accelerator Card Built for Any Server, Any Cloud (Aug 06, 2019)
- Enhancing System Architecture Implementation for AI Applications, Microchip Delivers its Analog Embedded SuperFlash Technology (Aug 06, 2019)
- Taking Constrained ML to the Next Level (Aug. 06, 2019)
- Gartner: AI will drive business value by supporting human decisions (Aug. 06, 2019)
- China Looks At RISC-V As A Viable Replacement For Proprietary CPU Architecture Amid Trade War Tensions (Aug. 06, 2019)
- Arasan to demonstrate its SD Card UHS-II PHY IP and eMMC 5.1 PHY IP for 12nm SoC Designs at the 2019 Flash Memory Summit (Aug 05, 2019)
- Avery Design Systems Announces SimAccel FPGA Accelerator (Aug 05, 2019)
- GUC Monthly Sales Report - July 2019 (Aug 05, 2019)
- InAccel's Accelerated ML suite boosts Spark ML as much as 7x using Intel's Arria FPGAs (Aug 05, 2019)
- Intel 10nm Chip Gets Mixed Reviews (Aug 05, 2019)
- Everspin Expands Spin-transfer Torque MRAM Ecosystem Support for its 1 Gigabit STTMRAM with Cadence Design IP and Verification IP (Aug 05, 2019)
- Intel Expands Workload Acceleration with Hewlett Packard Enterprise in New Programmable Acceleration Card (Aug 05, 2019)
- Kalray announces the Tape-Out of Coolidge on TSMC 16NM process technology (Aug 01, 2019)
- PLDA Announces Major PCIe 5.0 Design Win on Cutting Edge 5nm Process Node (Aug 01, 2019)
- Agile Analog Awarded Innovate UK Grant to Accelerate Semiconductor IP Development (Aug 01, 2019)
- Silvaco Appoints Babak Taheri as new Chief Executive Officer (Aug. 01, 2019)
- Silvaco, Inc. Appoints Babak Taheri as CEO Succeeding David Dutton who assumes Role of Board Vice-Chair (Aug 01, 2019)
- China, Huawei Hit Q'Comm Where it Hurts (Aug 01, 2019)
- Mobiveil to Demonstrate its Latest SSD IP Solutions at Flash Memory Summit 2019 (Aug 01, 2019)
- Arm brings automation to IoT connectivity management (Aug 01, 2019)
- Startup Puts AI Core in SSDs (Aug 01, 2019)
- Silvaco Appoints Babak Taheri as new Chief Executive Office (Aug 01, 2019)
- A Pillar Of Sparks: Interview With The RISC-V Foundation (Aug. 01, 2019)
- InAccel Accelerates XGboost and releases the IP core for FPGAs (Jul 31, 2019)
- Despite 38% Sales Decline, DRAM Expected to Remain Largest IC Market (Jul 31, 2019)
- Accellera Announces Public Source Code Repository (Jul 31, 2019)
- Tessolve Highlights Test Engineering Practices, Participating At The ITC India 2019 As Platinum Sponsors (Jul. 31, 2019)
- RISC-V EMEA Roadshow Spotlight: MINRES Technologies (Jul. 31, 2019)
- Blocking 5G from mmWave Will Limit its Potential, GSMA Warns (Jul. 31, 2019)
- Apple's iPhone Sales Down Again (Jul. 31, 2019)
- Apple to Buy Intel's Modem Business for $1 Billion (Jul 30, 2019)
- Tortuga Logic's Radix Hardware Security Verification Solutions Licensed by Xilinx (Jul 30, 2019)
- Wave Computing Signs New License Agreement with MediaTek (Jul 30, 2019)
- Adesto Appoints Two New Board Members (Jul. 30, 2019)
- What's the best IP for machine learning workloads – CPU, GPU or NPU? (Jul. 30, 2019)
- Alibaba Reveals 16-core RISC-V Chip (Jul 29, 2019)
- SCALINX new ASIC design center in SOPHIA-ANTIPOLIS, France (Jul 29, 2019)
- Khronos Releases OpenXR 1.0 Specification Establishing a Foundation for the AR and VR Ecosystem (Jul 29, 2019)
- Rambus to Acquire Northwest Logic, Extending Leadership in Interface IP (Jul 29, 2019)
- TSMC to Boost Recruitment by More Than 3,000 New Hires (Jul 29, 2019)
- SRAM Challenges and MRAM Achievements (Jul. 29, 2019)
- Rambus Reports Second Quarter 2019 Financial Results (Jul. 29, 2019)
- Open Source Processors: Fact Or Fiction? (Jul. 27, 2019)
- Global GDP Impact on Worldwide IC Market Growth Expected to Rise (Jul 26, 2019)
- North American Semiconductor Equipment Industry Posts July 2019 Billings (Jul 26, 2019)
- Xilinx Reports Record Revenues In Fiscal First Quarter 2020 (Jul 25, 2019)
- New NVM Express, Inc. Specifications Bolster Cloud and Enterprise Advancements (Jul 25, 2019)
- Allegro DVT Announces the Availability of the First AVS3 Compliance Test Suite (Jul 25, 2019)
- Semiconductor's Dinosaurs (Jul. 25, 2019)
- Q&A: Why it's time to focus on app security technologies for cars (Jul. 25, 2019)
- Mixel Granted US Patent for its Innovative MIPI D-PHY RX+ Configuration (Jul 24, 2019)
- Silvaco Partners with Incubator Silicon Power Technology to Accelerate Success of Semiconductor Startups (Jul 24, 2019)
- Taiwan Startups Build on Hardware Heritage with AI Focus (Jul. 24, 2019)
- Adesto's AFE IP Licensed by GCT Semiconductor for Advanced 4G LTE Modem (Jul 24, 2019)
- Is Apple planning to acquire Intel's mobile business? (Jul 24, 2019)
- UMC Reports Second Quarter 2019 Results (Jul 24, 2019)
- Qualcomm Introduces End-to-End Over-the-Air 5G mmWave Test Network in Europe to Drive 5G Innovation (Jul. 24, 2019)
- China's chipmakers could use RISC-V to reduce impact of US sanctions (Jul. 24, 2019)
- RISC-V's Role in Securing IoT-Connected Devices (Jul. 24, 2019)
- Cadence Reports Second Quarter 2019 Financial Results (Jul 23, 2019)
- Faraday Reports Second Quarter 2019 Financial Results 2Q19 Revenues NT$1.2 Billion, Up 11% QoQ (Jul 23, 2019)
- Samsung Begins Mass Production of Industry's First 12Gb LPDDR5 Mobile DRAM for Premium Smartphones (Jul 23, 2019)
- Pioneer Micro Technology Launches Silvaco PDK for its 0.35 um Silicon Foundry CMOS Process (Jul 23, 2019)
- Who's Who in the Exodus from China to Southeast Asia (Jul. 23, 2019)
- Second Quarter 2019 Silicon Wafer Area Shipments Fall 2.2 Percent from First Quarter Levels (Jul 23, 2019)
- IoT Nets Eye LoRa, NB-IoT (Jul. 23, 2019)
- When reset is the only option, what do you do if there is no button? (Jul. 23, 2019)
- CEVA Acquires Hillcrest Labs Intelligent Sensor Technologies Business from InterDigital (Jul. 22, 2019)
- Cadence Introduces Conformal Litmus to Deliver Fastest Path to Full-Chip Constraints and CDC Signoff (Jul 22, 2019)
- Gartner Says Worldwide Semiconductor Revenue to Decline 9.6% in 2019 (Jul 22, 2019)
- Innovium Adopts the Cadence Innovus Implementation System for Its Highly Scalable Switch Silicon Family for Data Centers (Jul 22, 2019)
- Nvidia Poaches Intel Safety Guru (Jul 22, 2019)
- TSMC Sees 5G Driving Strong Demand for 7nm (Jul. 22, 2019)
- Startup Runs AI in Novel SRAM (Jul 22, 2019)
- CEOs Diverge on Moore's Law (Jul 22, 2019)
- TSMC Reports Second Quarter EPS of NT$2.57 (Jul 18, 2019)
- Semi Content in Electronic Systems Forecast to Drop to 26.4% in 2019 (Jul 18, 2019)
- Samsung Begins Mass Production of Industry's First 12Gb LPDDR5 Mobile DRAM for Premium Smartphones (Jul. 18, 2019)
- InAccel releases world's first universal bitstream repository for FPGAs based on JFrog (Jul 18, 2019)
- DSP Concepts and CEVA Partner to Streamline Audio/Voice DSP Software Development for High-End Sound Applications (Jul 18, 2019)
- UltraSoC-led consortium secures £2m Innovate UK funding to develop cybersecurity solutions for connected and autonomous vehicles (Jul 18, 2019)
- Synopsys and Ixia, a Keysight Business, Announce Collaboration to Enable Scalable Networking SoC Validation Solution (Jul 18, 2019)
- Arasan announces the immediate availability of its Ultra Low Power MIPI D-PHY IP Compliant to D-PHY Specification v1.20 for TSMC 22nm SoC Designs (Jul 18, 2019)
- UltraSoC-led consortium secures £2m Innovate UK funding to develop cybersecurity solutions for connected and autonomous vehicles (Jul 18, 2019)
- Pioneer Micro Technology Launches Silvaco PDK for its 0.35 µm Silicon Foundry CMOS Process (Jul 17, 2019)
- Lattice Semiconductor Delivers Flexible Connectivity for Industrial Vision Applications with New CrossLink Reference Design (Jul 17, 2019)
- StreamDSP Announces Major Update to 17.3 IP Core (Jul 17, 2019)
- PCIe a Battlefield for Intel, Rivals (Jul 17, 2019)
- Xiaomi picks up 6% stake in chip designer VeriSilicon (Jul 17, 2019)
- Cadence Delivers Portable Test and Stimulus Methodology and Library (Jul 17, 2019)
- Pioneer Micro Technology Launches Silvaco PDK for its 0.35 µm Silicon Foundry CMOS Process (Jul 17, 2019)
- Attopsemi Technology Attended ChipEx2019 and Presented a Speech "I-fuse A Disruptive OTP (One-Time Programmable)" (Jul 16, 2019)
- New IP catalog from Terminus Circuits (Jul 16, 2019)
- Arm Flexible Access gives chip designers the freedom to experiment and test before they invest (Jul 16, 2019)
- Alphawave IP Announces Immediate Availability of Advanced PCIe Gen1-5 PHY on TSMC's 7nm process (Jul 16, 2019)
- NSITEXE Accelerates Delivery of Data Flow Processor IP for Automotive and Industrial Applications Using the Cadence Digital Design Full Flow (Jul 16, 2019)
- SmartDV Adds DisplayPort 2.0 to its Portfolio of Verification IP (Jul 16, 2019)
- CFX announces commercial availability of anti-fuse OTP technology on SMIC 55HV process (Jul 16, 2019)
- Intel's Neuromorphic Loihi Processor Scales to 8M Neurons, 64 Cores (Jul. 16, 2019)
- Dolphin Integration and Maple Solutions announce their reseller partnership to support South Korean semiconductor companies (Jul 15, 2019)
- WiSig Networks Adopts Palma Ceia SemiDesign for IoT Application Targeting Agricultural Environments (Jul 15, 2019)
- Synopsys Awarded DARPA ERI Contract Extension for Analog/Mixed-Signal Emulation Technology Innovation (Jul 15, 2019)
- Accelerate Smart Embedded Vision Designs with Microchip's Expanding Low-Power FPGA Video and Image Processing Solutions (Jul 15, 2019)
- eSOL and Kalray extend their cooperation to address demanding needs of automotive, industrial and medical applications (Jul. 15, 2019)
- RISC-V Foundation Launches Design Contest to Drive Security Innovation and Advance the Development of Secure RISC-V Solutions (Jul. 15, 2019)
- AI at the Very, Very Edge (Jul. 12, 2019)
- TSMC achieved massive sales turnaround in June (Jul 11, 2019)
- DRAM Capex to Plunge 28% in 2019 After Huge Outlays in 2017-18 (Jul 11, 2019)
- Memory Startup Targets High-Performance Computing (Jul 11, 2019)
- The MOSIS Service Selects Synopsys' IC Validator for Large-scale FinFET SoCs (Jul 11, 2019)
- IC Compiler II 2019 Extends Runtime and QoR Leadership with 2X Faster Throughput and 10% Lower Total Power (Jul 11, 2019)
- TSMC June 2019 Revenue Report (Jul 10, 2019)
- AI Seeks New Moore's Law (Jul 10, 2019)
- NTT, NTT DOCOMO, and SK TELECOM Join the HEVC Advance Patent Pool (Jul 10, 2019)
- RISC-V Foundation Announces Ratification of the RISC-V Base ISA and Privileged Architecture Specifications (Jul 10, 2019)
- Cisco Intends to Acquire Acacia Communications (Jul 10, 2019)
- Tower Semiconductor : TowerJazz, Cadence and Lumerical Deliver Silicon-Photonics and SiGe- Integrated PDK with a Complete Optical Transceiver Design Environment (Jul. 10, 2019)
- A Week in European Automotive: Startups Reinventing the Car (Jul. 10, 2019)
- Server, networking device players expanding manufacturing in Taiwan and North America (Jul. 10, 2019)
- SensiML and Neurosense Announce Strategic Partnership for Highly Integrated Intelligent Edge Technology Platform (Jul. 10, 2019)
- Arteris IP Ncore Cache Coherent Interconnect Licensed by Bitmain for Sophon TPU Artificial Intelligence (AI) Chips (Jul 09, 2019)
- UMC Reports Sales for June 2019 (Jul 09, 2019)
- Verimatrix Brings Effortless Application Security to the Masses, Launches New ProtectMyApp Service for Developers (Jul 09, 2019)
- UltraSoC joins AESIN to further automotive safety and security (Jul 09, 2019)
- Think Silicon secures Seed investment round led by Metavallon VC (Jul 09, 2019)
- China's Tsinghua Launches DRAM Unit (Jul 09, 2019)
- 5G: transforming user experiences on devices (Jul. 09, 2019)
- New online training course - Machine Learning using Arm (Jul. 09, 2019)
- CHIPS Alliance Brings Powerful Players into Open Source Hardware Collaboration (Jul. 09, 2019)
- The RISC-V Foundation Receives Donation From Arduino To Further Strengthen Its Open Source Community (Jul. 09, 2019)
- GUC Monthly Sales Report - June 2019 (Jul 08, 2019)
- Omni Design Technologies opens design center in Bangalore, India (Jul 08, 2019)
- InAccel releases open-source Logistic Regression IP core for FPGAs (Jul 08, 2019)
- ESD Alliance Reports EDA Industry Revenue Increase for Q1 2019 (Jul 08, 2019)
- Tessolve's 15th Anniversary Lunch Panel At The GSA Silicon Summit Brings Out New Perspective On Ethical Issues Concerning IoT Proliferation (Jul. 08, 2019)
- Global AI Race Divided Over Data Privacy (Jul. 05, 2019)
- Europe votes against EU's plan to use WiFi over 5G for connected cars (Jul. 05, 2019)
- EU AI Will Rely on Emerging Memory Technologies (Jul. 05, 2019)
- AGIC Tape Out First Silicon at 14nm FinFET Technology (Jul. 04, 2019)
- Cadence Digital Full Flow Achieves Certification for Samsung Foundry 5LPE Process Technology (Jul 03, 2019)
- Vidatronic Announces New Silicon-Proven Power Management Unit Intellectual Property Core for Samsung Foundry (Jul 03, 2019)
- Taiwan forms alliance to develop AI chips (Jul. 03, 2019)
- Blog: Where Security Meets Privacy (Jul. 03, 2019)
- Ambiq Micro Achieves World-Leading Power Consumption Performance with TSMC 40ULP Technology (Jul 02, 2019)
- Global Semiconductor Sales Decrease 14.6 Percent Year-to-Year in May (Jul 02, 2019)
- Samsung Accelerates New Product Ramp for 7nm Technology Node Using Synopsys' Yield Explorer (Jul 02, 2019)
- Samsung Electronics Introduces A High-Speed, Low-Power NPU Solution for AI Deep Learning (Jul. 02, 2019)
- Edge Complexity To Grow For 5G (Jul. 02, 2019)
- Private 5G Networks Expected to Support IIoT (Jul. 02, 2019)
- Automotive and Mobility Industry Leaders Publish First-of-its-Kind Framework for Safe Automated Driving Systems (Jul. 02, 2019)
- AI Startup Preps Inference Chip (Jul 01, 2019)
- GOWIN Semiconductor Introduces Their latest FPGA Product Line with Built-In Security (Jul 01, 2019)
- PLDA Reaches Key Milestone in Gen-Z IP Development (Jul 01, 2019)
- Semiconductor Industry Capex Forecast to Slump in 2019 and 2020 (Jul 01, 2019)
- SiFive Expands DesignShare IP Ecosystem to 20 Partner Companies (Jul 01, 2019)
- Avery Design Systems Announces SimRegress and SimCompare (Jul 01, 2019)
- Andes Technology and Silex Insight Announce Strategic Partnership for RISC-V Based Root-of-Trust IP Solutions (Jul 01, 2019)
- Inside Secure Announces Group Company Name, New Identity and New Trading Symbol (Jul 01, 2019)
- Building an AI Platform for Medical Imaging System (Jul. 01, 2019)
- Longtime X11/Linux Developer Joins SiFive To Work On RISC-V Processors (Jul. 01, 2019)
- Samsung Electronics and SK Telecom Advance in Bringing Korea Closer to 5G Standalone Commercialization (Jul. 01, 2019)
- BrainChip and Socionext Sign a Definitive Agreement to Develop the Akida Neuromorphic System-on-Chip (Jun 27, 2019)
- Rambus Expands Family of CryptoManager Root of Trust Secure Silicon IP Cores (Jun 27, 2019)
- Renesas Appoint New CEO (Jun. 27, 2019)
- Micron Cuts Capex, Wafer Starts (Jun 27, 2019)
- InAccel release world's first FPGA orchestrator (Jun 26, 2019)
- Real Intent Announces 10X+ Speedup & 5X Capacity Improvement for Ascent AutoFormal Automatic RTL Verification (Jun 26, 2019)
- NanoSemi Relies on OneSpin Automated Formal Verification Tools to Verify SystemC Designs for 5G ASICs (Jun 26, 2019)
- MorningCore Technology License CEVA DSP for High Performance Wireless and Automotive Communication Platforms (Jun 26, 2019)
- Aspinity Enables 10x Less Power for Always-on Sensing (Jun 26, 2019)
- Mentor's Veloce Strato emulation platform selected by Iluvatar CoreX for verification of AI chips and software (Jun 26, 2019)
- VESA Publishes DisplayPort 2.0 Video Standard Enabling Support for Beyond-8K Resolutions, Higher Refresh Rates for 4K/HDR and Virtual Reality Applications (Jun 26, 2019)
- Cadence Announces First-to-Market DisplayPort 2.0 Verification IP (Jun 26, 2019)
- Arteris IP FlexNoC Interconnect Implemented in Uhnder Digital Automotive Radar-on-Chip (Jun 25, 2019)
- eMemory's NeoFuse Qualified on Winbond 25nm DRAM Process (Jun 25, 2019)
- Visa to Acquire Rambus Payments Portfolio (Jun 25, 2019)
- Synopsys Expands Center of Excellence with Infineon to Deliver Virtualizer Development Kit for AURIX TC4x Automotive Microcontroller (Jun 25, 2019)
- CEVA Introduces Fully-Integrated Wi-Fi Solution to Connect IoT Devices to the Alibaba Cloud (Jun 25, 2019)
- SmartDV Adds New Verification IP to Support OpenCAPI Standard (Jun 25, 2019)
- Aspinity Puts Neural Networks Back to Analog (Jun. 25, 2019)
- Is Your AV Safe? Prove It (Jun. 25, 2019)
- Qualcomm Snapdragon 855 Becomes First Mobile SoC to Receive Smart Card Equivalent Security Certification (Jun. 25, 2019)
- Vidatronic Licenses Power Management Unit and Analog IP to Leading Semiconductor IP Company, Arm (Jun 24, 2019)
- UltraSoC secures £5m investment to target safety and security applications with its embedded analytics (Jun 24, 2019)
- eSilicon, Samtec and Wild River Technology Offer High-Performance Communications Webinar (Jun 20, 2019)
- Attopsemi Technology's Notification of Office Relocation (Jun 20, 2019)
- Purdue & TSMC Partner to Enhance Chip Security (Jun. 20, 2019)
- "Video For Machines" Using MPEG's New CDVA Standard, On Gyrfalcon's Industry Leading Chips (Jun 20, 2019)
- ON Semiconductor Completes Acquisition of Quantenna Communications (Jun 20, 2019)
- Western Digital Extends Openness of PlatformIO and Enhances its RISC-V Portfolio to Accelerate Data-Centric Innovation (Jun 20, 2019)
- PCI-SIG Announces Upcoming PCI Express 6.0 Specification to Reach 64 GT/s (Jun 19, 2019)
- U.S. Companies Dominate Worldwide IC Marketshare (Jun 19, 2019)
- Nurlink Completes First Call on Commercial NB-IoT Network with its CEVA-powered eNB-IoT SoC (Jun. 19, 2019)
- Acacia Communications Adopts Cadence Palladium Z1 Enterprise Emulation Platform to Accelerate Optical Networking Development (Jun. 19, 2019)
- CSEM and MIFS demonstrate world-record lows in energy consumption for a microcontroller (Jun. 19, 2019)
- China sees Taiwan supply chain as alternative to IDMs for power IC devices (Jun. 19, 2019)
- Arm joins Trusted Computing Group, driving towards secure devices everywhere (Jun. 19, 2019)
- Chiplet Ecosystem Slowly Picks up Steam (Jun 18, 2019)
- NVIDIA Brings CUDA to Arm, Enabling New Path to Exascale Supercomputing (Jun 18, 2019)
- Telechips selects PowerVR GPU for Automotive (Jun. 18, 2019)
- Astera Labs Verifies Its System-Aware PCI Express 5.0 Smart Retimer Using Avery Design Systems PCIe 5.0 Verification IP (Jun 18, 2019)
- Arteris IP FlexNoC Interconnect Licensed by Achronix for New Speedster7t FPGA family (Jun. 18, 2019)
- Achronix Selects Moortec's 7nm Embedded Temperature Sensor to Optimise Performance and Reliability in its 4th Generation Speedster FPGA (Jun. 18, 2019)
- Xilinx Hits Milestone with First Customer Shipments of Versal ACAP (Jun. 18, 2019)
- SiFive Enhances Silicon Hills Operations with Office in Austin, Texas (Jun 18, 2019)
- Can Huawei Survive? (Jun. 18, 2019)
- GLOBALFOUNDRIES Adds Industry Veteran Glenda Dorchak to its Board of Directors to Support Next Phase of Transformative Growth (Jun. 18, 2019)
- "Video For Machines" Using MPEG's New CDVA Standard, On Gyrfalcon's Industry Leading Chips (Jun. 18, 2019)
- Samsung Electronics to Strengthen its Neural Processing Capabilities for Future AI Applications (Jun. 18, 2019)
- Can We Believe The Hype About China's Domestic IC Production Plans? (Jun 17, 2019)
- UltraSoC joins GSA IoT Security Working Group (Jun 17, 2019)
- Moortec to Showcase its PVT Monitoring IP at TSMC China Technology Symposium (Jun 17, 2019)
- Global Top Ten Foundries for 2Q19 Perform Less-than-expected Due to Sliding Demand and High Inventories, Says TrendForce (Jun 17, 2019)
- Introducing Intel's New Network and Custom Logic Group (Jun 17, 2019)
- At the Paris Air Show 2019 Cobham will be showcasing its unique role in the world. (Jun. 17, 2019)
- Mythic Secures $30M in New Financing and Strengthens Leadership Team (Jun 13, 2019)
- X-FAB and Efabless Announce Successful First Silicon of Raven, An Open-Source RISC-V Microcontroller (Jun 13, 2019)
- UltraSoC strengthens management team with appointment of CFO (Jun 13, 2019)
- Toshiba Selects Cadence Tensilica Vision P6 DSP as Image Recognition Processor for its Next-Generation ADAS Chip (Jun 13, 2019)
- Why do Enterprises favor private or hybrid IoT deployments over public clouds? (Jun. 13, 2019)
- Magewell Selects Lattice Semiconductor ECP FPGA Family For Video Capture Devices (Jun 12, 2019)
- Global Fab Equipment Spending to Rebound in 2020 with 20 Percent Growth (Jun 12, 2019)
- Synopsys Achieves ISO 9001 Certification for IP Quality Management System (Jun 12, 2019)
- Everspin Enters Pilot Production Phase for the World's First 28 nm 1 Gb STT-MRAM Component (Jun 12, 2019)
- AI: Friend or Foe? (Jun. 12, 2019)
- Report: Apple Still Eyes Intel's Modem Business (Jun. 12, 2019)
- Gartner Identifies Five Challenges to Growth and Adoption for Virtual Customers (Jun. 12, 2019)
- Media Alert: Cadence to Showcase Aerospace and Defense Solutions at the 2019 International Paris Air Show (Jun. 12, 2019)
- Gyrfalcon's 2803 Plai Plug Development Hardware Delivers 24 TOPS/W for AI From Edge to Cloud (Jun 11, 2019)
- HDL Design House Adds New Representative in Europe (Jun 11, 2019)
- Logic Design Solutions Introduces the first NVMe Host IP on PolarFire FPGA (Jun 11, 2019)
- Silicon-Proven Arteris IP Ncore Cache Coherent Interconnect Implemented in Toshiba ISO 26262-Compliant ADAS Chip (Jun. 11, 2019)
- Dream Chip opened new ASIC Design Center in Eindhoven, Netherlands (Jun 11, 2019)
- Intel to Acquire Barefoot Networks, Accelerating Delivery of Ethernet-Based Fabrics (Jun. 11, 2019)
- intoPIX Presents the Smart Path for AV Over IP at InfoComm 2019 (Jun. 11, 2019)
- Cobham Releases New Instruction Simulator for Radiation Hardened Processors (Jun. 11, 2019)
- The Point Where IoT, AI & Quantum Computing Intersect (Jun. 11, 2019)
- RISC-V Foundation Announces Call For Papers For The 2nd Annual RISC-V Summit (Jun. 11, 2019)
- India's IC Imports Grew Dramatically in 2018, and U.S.-China Trade Tensions Could be a Reason (Jun. 11, 2019)
- SingMai offer universal encoding and decoding of analogue video (Jun 10, 2019)
- Space Codesign Systems Announces Support of Zynq UltraScale+ MPSoC (Jun. 10, 2019)
- CEVA Collaborates with Ellisys to Achieve SIG Qualification for its Bluetooth 5.1 Low Energy IP (Jun 10, 2019)
- TSMC May 2019 Revenue Report (Jun 10, 2019)
- Imperas and Metrics Collaborate to Jump Start RISC-V Core Design Verification Using Open Source Instruction Stream Generator (Jun. 10, 2019)
- UMC Reports Sales for May 2019 (Jun 10, 2019)
- Andes Technology Launches RISC-V FreeStart Program with its Commercial-Grade CPU N22 (Jun 10, 2019)
- Imperas delivers first RISC-V Simulator for new Vector and Bit Manipulation specifications to Lead Customers (Jun 07, 2019)
- SiFive Secures $65.4 Million In Series D Funding (Jun 07, 2019)
- SiFive Celebrates Historic 100 Design Win Milestone (Jun 07, 2019)
- GLOBALFOUNDRIES and Soitec Announce Multiple Long-term SOI Wafer Supply Agreements to Meet Accelerating Demand in 5G, IoT and Data Center (Jun 07, 2019)
- Silex Insight now supports 1GbE, 2.5GbE & 10GbE with their AV over IP OEM boards (Jun 07, 2019)
- Communications IC Market to Again Surpass Computer IC Market (Jun 06, 2019)
- GUC Monthly Sales Report - May 2019 (Jun 06, 2019)
- Lattice Diamond 3.11 Software Adds Support for New MachXO3D FPGA (Jun 06, 2019)
- OpenHW Group created and announces CORE-V family of open-source cores for use in high volume production SoCs (Jun. 06, 2019)
- Side-Channel Attacks on Embedded Processors (Jun. 06, 2019)
- Achronix Chooses Rambus GDDR6 PHY IP for Next-Generation FPGA (Jun 06, 2019)
- ARM gets a rival as AMD licenses graphics IP to Samsung (Jun 06, 2019)
- Global Semiconductor Sales Decrease 14.6 Percent Year-to-Year in April; 12 Percent Decrease in Annual Sales Projected for 2019 (Jun 05, 2019)
- Inside Secure Releases Industry's First Tool to Quickly, Graphically Create Secure Crypto Architectures (Jun 05, 2019)
- Avery Design Systems Announces SimCluster GLS to Accelerate Gate-Level Sign-Off Simulations (Jun 05, 2019)
- Faraday Adopts Synopsys SpyGlass Design Handoff Kit to Ensure High Design Quality (Jun 05, 2019)
- First steps towards a made-in-Europe high-performance microprocessor (Jun 05, 2019)
- HBM2e Top Contender for AI Applications (Jun. 05, 2019)
- Marvell Extends Strategic Partnership with Arm (Jun. 05, 2019)
- Omni Design Demos Hyperon 14-bit 1.2Gsps ADC at the 2019 Design Automation Conference in Las Vegas (Jun 04, 2019)
- ASPEED Technology adopts M31 Technology MIPI D-PHY IP to provide global 360-degree imaging SoC solution (Jun 04, 2019)
- Truechip Offering complimentary licenses of PCIe Gen 3 Verification IP (Jun 04, 2019)
- First Quarter 2019 Worldwide Semiconductor Equipment Billings Drop 19 Percent Year-Over-Year (Jun 04, 2019)
- Analog Bits and GLOBALFOUNDRIES Deliver Differentiated Analog and Mixed Signal IP for High-Performance Mobile and Compute Applications (Jun 04, 2019)
- Wave Computing and Imperas Introduce New MIPS Open Simulator - MIPSOpenOVPsim (Jun 04, 2019)
- True Circuits Demonstrates Silicon Proven DDR 4/3 PHY at the Design Automation Conference (Jun 04, 2019)
- Socionext Adopts the Cadence Full-Flow Digital and Signoff Tools for 7nm Designs (Jun. 04, 2019)
- Cadence Introduces the Spectre X Simulator, a Massively Parallel Circuit Simulator Delivering Up to 10X Faster Simulation with the Same Golden Accuracy (Jun 04, 2019)
- Cadence Expands Customer-Managed Cloud Options with New Cloud Passport Partner Program (Jun 04, 2019)
- Synopsys Fusion Design Platform First to be Certified by Samsung Foundry for 5LPE Process with EUV Technology (Jun 04, 2019)
- Thalia DA attracts $2m investment to grow analog IP re-use platforms (Jun 04, 2019)
- Avery Design Systems Announces SymXprop for X Accurate RTL Simulation (Jun 04, 2019)
- Synopsys and GLOBALFOUNDRIES Collaborate to Develop Broad Portfolio of DesignWare IP for 12LP FinFET Process (Jun 04, 2019)
- Efabless Collaborates with GLOBALFOUNDRIES to Enable New IP Development Models for Emerging Applications (Jun. 04, 2019)
- NI, Tessolve, and Johnstech Collaborated To Develop A Quad-site mmWave 5G Packaged Test Solution (Jun. 04, 2019)
- Infineon to acquire Cypress, strengthening and accelerating its path of profitable growth (Jun 03, 2019)
- Silvaco and Si2 Release Unique, Free 15nm Open-Source Digital Cell Library (Jun 03, 2019)
- Gyrfalcon offers Automotive AI Chip Technology (Jun 03, 2019)
- NXP to acquire Marvell's WiFi and Bluetooth Connectivity Assets (Jun 03, 2019)
- Avatar Integrated Systems Physical Implementation Tool Certified on TSMC 7nm FinFET Process (Jun 03, 2019)
- Intel Says EUV Ready, Challenging (Jun 03, 2019)
- UltraSoC embedded analytics selected to support Wave Computing's TritonAI 64 IP platform (Jun 03, 2019)
- Mentor sets new software scaling benchmark for Semiconductor Design Workload on Microsoft Azure (Jun 03, 2019)
- Fab Joint Venture Seen for 200 mm (Jun 03, 2019)
- AMD and Samsung Announce Strategic Partnership in Ultra Low Power, High Performance Graphics Technologies (Jun 03, 2019)
- SolidRun and Gyrfalcon Team Up to Accelerate On-Device AI Performance with Powerful New i.MX 8M Mini SOM (Jun. 03, 2019)
- PCI-SIG Achieves 32GT/s with New PCI Express 5.0 Specification (May 30, 2019)
- Pixilica Licenses SiFive's RISC-V Embedded Processor IP (May 30, 2019)
- Efinix and M31 Technology Corporation Partner to Address Demand for Emerging AI Edge Computing Requirements (May 30, 2019)
- Moortec to Showcase its High Accuracy Embedded Sensing Fabric at DAC 2019 in Las Vegas (May 30, 2019)
- SMIC Delisting Raises Question Mark Over China Tech (May. 30, 2019)
- Global top-3 memory vendors to see sales hit bottom in 2Q19, says Digitimes Research (May. 30, 2019)
- Synopsys Extends Leadership with Enhanced Verification Continuum Platform (May 30, 2019)
- Synopsys Design and Verification Solutions Enable Astera Labs to Develop Industry's First PCIe 5.0 Retimer SoC (May 30, 2019)
- Google and eSilicon at DAC 2019: Doing EDA in the Cloud? Yes, It's Possible! (May 29, 2019)
- MediaTek Unveils Groundbreaking New 5G SoC for First Wave of 5G Flagship Devices (May. 29, 2019)
- BrainChip Announces the Availability of Advanced AI Intellectual Property (May 29, 2019)
- Silvaco Announces Viola I0-X - 10X Faster I/O Pad Characterization for Nanometer Silicon (May 29, 2019)
- Mixel MIPI D-PHY IP Integrated into Teledyne e2v Snappy CMOS Image Sensors (May 29, 2019)
- Globalfoundries use AR Glasses in Fab (May. 29, 2019)
- Mentor's new Calibre Recon functionality methodically analyzes "early draft" IC designs for faster verification (May. 29, 2019)
- Edge AI Going Beyond Voice and Vision (May. 29, 2019)
- Arm portrays its strategy for machine learning at the edge (May. 29, 2019)
- Renesas Electronics Offers Complete Automotive Integrated Cockpit Reference Solution Based on R-Car System on Chip (May. 29, 2019)
- Functional Safety for Automotive HMI Systems (May. 29, 2019)
- Q'comm Cites U.S. Security in Appeal (May. 29, 2019)
- Hex Five Adds MultiZone Security to the AdaCore Software Ecosystem (May 28, 2019)
- Sofics' clipping/scaling circuit enhances reliability of Near Field Communication (NFC) and other wireless interfaces (May 28, 2019)
- NVIDIA Deploys the New Cadence Protium X1 Platform to Accelerate Software Development of Large-Capacity GPUs (May 28, 2019)
- Cadence Launches Protium X1, the First Scalable, Data Center-Optimized Enterprise Prototyping System for Early Software Development (May. 28, 2019)
- IC Compiler II with Advanced Fusion Technologies Delivers Optimal QoR and Reduces ECO Turnaround Time More Than 40% at Juniper Networks (May 28, 2019)
- Synopsys Introduces PrimeYield for 100X Faster SoC Yield Analysis and Optimization (May 28, 2019)
- Arm unveils new solutions for premium smartphones in 2020 (May. 28, 2019)
- Companies Pushing Open Source RISC-V Silicon Out to the Edge (May. 28, 2019)
- OneSpin's Newest App Assures Quality of RISC-V Processor Cores for Safety-, Security-Critical Applications (May 27, 2019)
- TSMC to Keep Supplying Chips to Huawei (May 27, 2019)
- Cadence Full-Flow Digital and Signoff Tools Optimized for New 7nm Arm Cortex-A77 CPU (May 27, 2019)
- Delivering next-generation AI experiences for the 5G world (May 27, 2019)
- eSilicon Technical Advisory Board Members Win Facebook Research Award (May 27, 2019)
- Synopsys and Arm Collaborate to Enable Tapeouts by Early Adopters of Arm's Latest Premium Mobile Processors (May 27, 2019)
- Credo First to Demonstrate 7nm, 112G XSR SerDes (May 27, 2019)
- Thinci Deploys Full Cadence Verification Suite for AI Designs, Accelerating Project Schedule by Months (May 27, 2019)
- Faraday Showcases FinFET ASIC Solutions and SoCreative!V SoC Platform at DAC 2019 (May 27, 2019)
- Intrinsic ID Secures EUR 11 Million Loan from European Investment Bank (May 24, 2019)
- SmartDV Unveils First Verification IP to Support Ethernet TSN (May 23, 2019)
- CAST Expands Popular UDP/IP Networking Cores Line (May 23, 2019)
- IAR Systems takes RISC-V to the next level with launch of professional development tools with leading performance and ensured code quality (May 23, 2019)
- Synopsys Posts Financial Results for Second Quarter Fiscal Year 2019 (May 23, 2019)
- AnalogX Launches Ultra Low Power Interconnect SerDes IP Portfolio to Fuel Next-Generation I/O Connectivity (May 23, 2019)
- AGIC Technology to Achieve In-Memory Computing for AI Edge Computation (May. 23, 2019)
- Cut Off From ARM, x86, What CPU Architectures Can Huawei Use? (May. 23, 2019)
- Taiwan's TSMC says chip shipments to Huawei not affected by U.S. ban (May. 23, 2019)
- China vs. US: Tech Warfare Hurts All (May. 23, 2019)
- Synopsys Delivers 100X Faster Formal Verification Closure for AI, Graphics, and Processor Designs (May 23, 2019)
- TSMC-Certified OIP Virtual Design Environment with Synopsys Tools Now Available on Google Cloud (May 23, 2019)
- Synopsys Announces Software-driven SoC Power Analysis Solution, Enabling 1000X Faster Time-to-Results (May 23, 2019)
- SmartDV Speeds Delivery of its New CXL Verification IP (May 23, 2019)
- MVSILICON License and Deploy CEVA Bluetooth IP in its latest Wireless Audio Platform (May. 22, 2019)
- North American Semiconductor Equipment Industry Posts April 2019 Billings (May 22, 2019)
- Fraunhofer IIS Licenses MPEG-H Audio Patents to LG Electronics (May 22, 2019)
- US Grants 90-Day Reprieve for Huawei Suppliers (May 22, 2019)
- After 2Q19 Bottom, Expectations Increase for a 3Q19 IC Market Rebound (May 22, 2019)
- Arm Deals Massive Blow to Huawei (May. 22, 2019)
- Sankalp Semiconductor to Exhibit at Design Automation Conference - 2019 (May 22, 2019)
- Arasan announces the immediate availability of its MIPI CSI-2 v2.1 IP supporting C-PHY v1.2 and D-PHY v2.1 (May 22, 2019)
- ClioSoft and Silvaco Collaborate to Integrate ClioSoft's SOS Design Data Management Platform with Silvaco's Analog Custom Design Tools (May 21, 2019)
- Innovative Logic USB IP Portfolio Strengthens RISC-V Ecosystem (May. 21, 2019)
- Faraday Geared Up for Data Communication Applications in ASIC Development (May 21, 2019)
- Marvell to Acquire Avera Semi, Creating an Infrastructure ASIC Powerhouse (May 21, 2019)
- Minima Processor names Semiconductor Veteran Tuomas Hollman as CEO (May 21, 2019)
- Arteris IP and Wave Computing Collaborate on Reference Architecture for Enterprise Dataflow Platform (May. 21, 2019)
- Achronix Introduces Ground-Breaking FPGA Family, Delivering New Levels of Performance with Adaptability for High-Bandwidth Data Acceleration Applications (May. 21, 2019)
- sureCore Appoints Cedric Plomion Global Sales Director (May 21, 2019)
- Synopsys ARC EV6x Vision Processor IP Named Best Processor of the Year by the Embedded Vision Alliance (May. 21, 2019)
- Imagination GPU Joins SiFive RISC-V Design Ecosystem (May. 21, 2019)
- Autotalks Accelerates C-V2X Readiness Following Interoperability Testing and Successful Bench Tests (May. 21, 2019)
- PathPartner to Demonstrate its Advanced Automotive and Driver Monitoring Solution at Embedded Vision Summit 2019 (May. 21, 2019)
- Trump's Huawei ban raises hopes for Chinese chip suppliers (May. 21, 2019)
- Synopsys and Kudan Collaborate to Accelerate Development of Intelligent Computer Vision Processing SoCs (May 20, 2019)
- CEVA Announces Availability of SLAM Software Development Kit for CEVA-XM Intelligent vision DSPs and NeuPro AI Processors (May 20, 2019)
- INGChips selects Dolphin Integration's Power Management IP Platform for its ultra Low Power Bluetooth Low-Energy SoC in 40 nm eFlash (May 20, 2019)
- Lattice's New MachX03D FPGA Enhances Security with Hardware Root-of-Trust Capabilities (May 20, 2019)
- Cadence Palladium and Protium Platforms Enable Innovium to Accelerate First-Pass Silicon Success for the Data Center Market (May 20, 2019)
- Intel Recaptures Number One Quarterly Semi Supplier Ranking from Samsung (May 17, 2019)
- lowRISC Expands and Appoints New Members to the Board of Directors from Google and ETH Zurich (May 17, 2019)
- SmartDV Reduces Protocol Debug Time with Smart ViPDebug (May 16, 2019)
- TSMC board approves nearly US$4 billion for advanced-node manufacturing (May. 15, 2019)
- eSilicon Announces Production Qualification of 5G Infrastructure ASIC (May 15, 2019)
- Silicon Labs Partners with Pulsic, Selecting Animate as Its Automated Layout Solution for Analog IC Designs (May 15, 2019)
- New Cadence Tensilica Vision Q7 DSP IP Doubles Vision and AI Performance for Automotive, AR/VR, Mobile and Surveillance Markets (May. 15, 2019)
- Cadence Announces Broad Next-Generation Memory Standard Support in Samsung Foundry's Advanced Process Technologies (May 15, 2019)
- Making virtual more of a reality with the new Arm Mali-D77 display processor (May 15, 2019)
- Cadence Tapes Out 112G Long-Reach SerDes IP on Samsung Foundry's 7LPP Process Technology (May 15, 2019)
- AI Chipmaker Hailo Releases Industry-Leading Deep Learning Processor (May 15, 2019)
- Samsung Electronics' Leadership in Advanced Foundry Technology Showcased with Latest Silicon Innovations and Ecosystem Platform (May 15, 2019)
- An Introduction to the RISC-V-Based SweRV Core (May. 15, 2019)
- Synopsys and Arm Extend Collaboration to Fusion Compiler to Accelerate Implementation of Arm's Next-Generation Client and Infrastructure Cores (May. 14, 2019)
- Arteris IP FlexNoC Interconnect and Resilience Package Licensed by Black Sesame for ISO 26262-Compliant AI Chips for ADAS (May 14, 2019)
- Wave Computing Adds MIPS32 microAptiv Cores to MIPS Open Program (May. 14, 2019)
- EDA Vendors Spread Wings as Market Softens (May 14, 2019)
- Cadence Custom/AMS Flow Certified for Samsung 28nm FD-SOI Process Technology (May 14, 2019)
- Eta Compute Awarded Additional Patent For Asynchronous Microprocessor Technology (May 14, 2019)
- Tiempo Secure Joins Deutsche Telekom's nuSIM Partnering Network (May 14, 2019)
- Arm demonstrates new IoT test chip and board for highly efficient, secure IoT designs (May. 14, 2019)
- When AI Goes Wrong (May. 14, 2019)
- Imagination Technologies joins SiFive's DesignShare Ecosystem, Enabling RISC-V users to access industry-leading IP (May 13, 2019)
- Agile Analog secures $5M in funding to change the semiconductor industry (May 13, 2019)
- Elektrobit and Synopsys Collaborate to Accelerate Automotive Electronic System Virtual Development (May. 13, 2019)
- Amphion Semiconductor introduces 4K/UHD capable AV1 video decoder hardware IP extension to its Malone video decoder family (May 13, 2019)
- Moortec Support Canaan Creatives Mass Production ASIC on TSMC 7nm Process (May 13, 2019)
- Samsung Foundry Begins Partnership with Silvaco to Launch their Semiconductor IP Assets (May 13, 2019)
- PowerVR GPU and NNA available on SiFive platform (May 13, 2019)
- Does a SCM Controller Need a Translation Table? (May 13, 2019)
- Soitec expands its engineered substrate portfolio into GaN (Gallium Nitride) with the acquisition of EpiGaN nv (May. 13, 2019)
- Case study: accelerated chip design for drones and cameras with Arm DesignStart (May. 13, 2019)
- ClioSoft Achieves TUV SUD Certification in Support of Automotive ISO 26262 Standard (May 10, 2019)
- ON Semiconductor Executive Named to Alphacore Inc. Advisory Board (May 10, 2019)
- Texas Instruments Widens Its Lead As World's Top Analog IC Supplier (May 10, 2019)
- TSMC April 2019 Revenue Report (May 10, 2019)
- Intel Targets 2021 for 7 nm (May 10, 2019)
- eSilicon Tapes Out 7nm Combo PHY (HBM2/HBM2E/Low Latency) Test Chip (May. 09, 2019)
- SMIC Reports 2019 First Quarter Result (May 09, 2019)
- Wave Computing Appoints Industry Veteran Art Swift CEO (May 09, 2019)
- SmartDV Appoints HyperSilicon Exclusive Sales Representative in China (May 09, 2019)
- Algo-Logic Systems Delivers Ultra-Low-Latency Pre-Trade Risk Check (PTRC) Solution Powered by Xilinx (May 09, 2019)
- UMC Reports Sales for April 2019 (May 09, 2019)
- Efinix Partners with Samsung to Develop Quantum eFPGAs on 10nm Silicon Process (May 09, 2019)
- Imagination Tech to License Ray-Tracing IP as 5G Beckons (May 09, 2019)
- CoreHW and RoodMicrotec to establish long-term supply chain partnership (May 09, 2019)
- Imagination announces ray tracing technology for licensing (May 09, 2019)
- GOWIN Semiconductor Joins Arm DesignStart Offering Free Arm Cortex-M Processors for its FPGA Product Families (May. 08, 2019)
- IC designers placing additional foundry orders in anticipation of 3Q19 boom (May. 08, 2019)
- Samsung Foundry Forum 2019: eSilicon to unveil 14nm switching and 5G infrastructure ASICs (May. 08, 2019)
- At Dac 19 D&R demonstrates more Innovation and Intelligence in IPMS™ (May. 08, 2019)
- Arteris IP FlexNoC & Resilience Package Licensed by Semidrive for ISO 26262-Compliant Autonomous Driving Chips (May 07, 2019)
- Cycle-accurate trace boosts performance optimization capabilities of UltraSoC embedded analytics infrastructure (May 07, 2019)
- Codasip Presence at upcoming events: China Roadshow, DAC 2019, and RISC-V Workshop Zurich (May 07, 2019)
- Fudan Microelectronics Group Selects Synopsys' DesignWare Bluetooth IP for Smart IoT System-on-Chips (May 07, 2019)
- Cadence Delivers Smart JasperGold Formal Verification Platform (May 07, 2019)
- eSilicon Tapes Out 7nm neuASIC IP Platform Test Chip (May. 07, 2019)
- SmartDV Heads to ChipEx2019 in Israel with Extensive Design and Verification IP Portfolio (May. 07, 2019)
- OneSpin Joins The RISC-V Foundation (May. 07, 2019)
- How connected technology can help solve the supply chain challenges (May. 07, 2019)
- Marvell Doubles Down on Automotive Ethernet (May. 07, 2019)
- Toshiba adds Cortex-M4 core MCUs (May. 07, 2019)
- Blu Wireless raises $16.6 million in growth funding round for 5G applications (May 06, 2019)
- CEVA, Inc. Announces First Quarter 2019 Financial Results (May 06, 2019)
- ON Semi Acquiring GF Fab Deemed a Win-Win (May 06, 2019)
- PRO DESIGN Launches Intel Arria 10-Based Product Family of FPGA-Based Prototyping Systems (May 06, 2019)
- OPENEDGES NoC (Network on Chip) Interconnect IP & DDR Controller licensed by ASICLAND (May 06, 2019)
- Sankalp Semiconductor to Exhibit at ChipEx - 2019 (May 06, 2019)
- GUC Monthly Sales Report - Apr 2019 (May 06, 2019)
- Will Machines Ever Learn to Be Fair? (May. 03, 2019)
- Vela enters into strategic partnership with Enyx (May 02, 2019)
- 1Q19 Registers the 4th Largest Sequential IC Market Decline on Record (May 02, 2019)
- Qualcomm Booking $4.5B in Apple Deal (May 02, 2019)
- Moortec Provide Embedded Monitoring Solutions for Arm's Neoverse N1 System Development Platform on TSMC 7nm Process Technology (May. 01, 2019)
- Synopsys Announces Industry's First DDR5 NVDIMM-P Verification IP for Next-generation Storage-class Memory Designs (May. 01, 2019)
- Comcores and DENSO AUTOMOTIVE Deutschland GmbH test TSN Ethernet for Automotive Applications in the Research Project EMPHASE (May. 01, 2019)
- eSilicon Tapes Out 7nm 400G Gearbox/Retimer Test ASIC (May 01, 2019)
- ZTE Selects Intel's eASIC Devices for 5G Wireless Deployment (May. 01, 2019)
- GOWIN Adopts HyperBus for built-in PSRAM and HyperRAM Interfacing (Apr. 30, 2019)
- eSilicon Expands Technical Advisory Board (Apr 30, 2019)
- Multiple Arteris IP FlexNoC Interconnect Licenses Purchased by VeriSilicon for Multiple Chip Designs (Apr. 30, 2019)
- Global Semiconductor Sales Down 15.5 Percent in First Quarter of 2019 (Apr 30, 2019)
- Survey: China's Fabless IC Firms Optimistic on Sales Growth (Apr 30, 2019)
- Moortec To Showcase Its PVT Monitoring IP At TSMC 2019 Boston Technology Workshop (Apr. 30, 2019)
- Synopsys Launches New VESA DSC IP for Visually Lossless Compression in Mobile, AR-VR, and Automotive SoCs (Apr. 30, 2019)
- RISC-V Foundation Announces Agenda For RISC-V Workshop Zurich (Apr. 30, 2019)
- China Exodus as Tech Returns to Taiwan (Apr. 30, 2019)
- Arm announces appointment of Inder Singh as Chief Financial Officer (Apr 29, 2019)
- Silicon Wafer Shipments Drop to Lowest Level Since Fourth Quarter of 2017 (Apr 29, 2019)
- Intel Cuts 2019 Sales Forecast (Apr 29, 2019)
- ARM, MIPS, Imagination lose IP market share (Apr 29, 2019)
- SiFive Announces Strategic Partnership with QuickLogic and Launches SoC Templates for Rapid Chip Design (Apr 29, 2019)
- eSilicon Signs Multi-Year Agreement with Google Cloud (Apr 29, 2019)
- 4 reasons to use RISC-V for aerospace and defense applications (Apr. 29, 2019)
- Tamba Networks' IP Selected for Innovium's TERALYNX 12.8 Tbps Data-Center Optimized Switch (Apr 25, 2019)
- Xilinx Reports Record Revenues Exceeding $3 Billion For Fiscal 2019 (Apr 25, 2019)
- Xilinx to Acquire Solarflare (Apr 25, 2019)
- TSMC Steps Through 7, 6, 5, Moore (Apr 25, 2019)
- UK to give Huawei limited role in building 5G network: Report (Apr. 25, 2019)
- 60+ IoT statistics and facts (Apr. 25, 2019)
- Mobiveil, Inc. today announced availability of its PCI Express 5 controller IP (Apr 24, 2019)
- Cadence Design Solutions Certified for TSMC-SoIC Advanced 3D Chip Stacking Technology (Apr 24, 2019)
- Docker and Arm Partner to Deliver Frictionless Cloud-native Software Development and Delivery Model for Cloud, Edge, and IoT (Apr. 24, 2019)
- North American Semiconductor Equipment Industry Posts March 2019 Billings (Apr 24, 2019)
- Synopsys Design Platform Certified for TSMC's Innovative SoIC Chip Stacking Technology (Apr 24, 2019)
- Teledyne Imaging to showcase its advanced mapping, object recognition and tracking technology at AUVSI 2019 (Apr. 24, 2019)
- Intel launches latest-generation CPUs for mobile (Apr. 24, 2019)
- US, China Heading Towards Tech Cold War (Apr. 24, 2019)
- Samsung Electronics to Invest KRW 133 Trillion in Logic Chip Businesses by 2030 (Apr. 24, 2019)
- UMC Reports First Quarter 2019 Results (Apr. 24, 2019)
- Gyrfalcon Technology Introduces IP Licensing Model for Greater Customization for AI Chips from "Edge to Cloud" (Apr. 24, 2019)
- Alphawave Joins TSMC IP Alliance Program (Apr 23, 2019)
- Digital Blocks DB9000 TFT LCD and OLED Display Controller & Processor IP Application Leadership Advancements (Apr 23, 2019)
- Cadence Reports First Quarter 2019 Financial Results (Apr 23, 2019)
- Silvaco Opens Chengdu Office to Support Company's China Expansion and Growing Demand for Power Semiconductor Design Solutions (Apr 23, 2019)
- TSMC Celebrates 25th Anniversary of the North American Technology Symposium (Apr 23, 2019)
- Rambus Reports First Quarter 2019 Financial Results (Apr 23, 2019)
- Arteris IP FlexNoC Interconnect Licensed by Samsung's System LSI Business for Digital TV Chips (Apr 23, 2019)
- Tortuga Logic and Synopsys Collaborate to Deliver System-Level Security to SoCs Built with Synopsys DesignWare ARC Processor IP (Apr 23, 2019)
- Mobiveil's GPEX IP with PCI Express 5.0 technology support to be made available in End Point, Root Complex, Dual mode and Switch configurations with Configurability, Reliability and Serviceability (Apr 23, 2019)
- Analog Bits Showcases PCIe Gen2 / Gen3 / Gen4 Reference Clock PHY Design Kits Available on TSMC 7nm / 12nm / 16nm / 22nm process technology (Apr 23, 2019)
- Synopsys Achieves More Than 250 Design Wins with DesignWare IP on TSMC 7nm FinFET Process (Apr 23, 2019)
- Arasan Announces its Total eMMC IP Solution on TSMC 7nm Process Technology (Apr 23, 2019)
- Radiant 1.1 Lattice FPGA Design Tools Release Accelerates Design Reuse (Apr 23, 2019)
- Mentor certified for latest TSMC 5nm FinFET process and innovative TSMC-SoIC 3D chip stacking technology (Apr. 23, 2019)
- Synopsys Named a Leader in the Gartner Magic Quadrant for Application Security Testing for Third Consecutive Year (Apr. 23, 2019)
- Infineon is outgrowing all other leading suppliers of automotive semiconductors (Apr. 23, 2019)
- ON Semiconductor and GLOBALFOUNDRIES Partner to Transfer Ownership of East Fishkill, NY 300mm Facility (Apr 22, 2019)
- TSMC Certifies Synopsys' Digital and Custom Design Platforms on TSMC 5nm FinFET Process Technology (Apr 22, 2019)
- RISC-V, DARPA Advance Security (Apr 22, 2019)
- Desay SV Standardizes on Synopsys Virtualizer Virtual Prototyping Solutions (Apr 22, 2019)
- Cadence Collaborates with TSMC to Accelerate 5nm FinFET Innovation, Enabling Next-Generation SoC Production Design (Apr 22, 2019)
- Graphcore CEO Touts 'Most Complex Processor' Ever (Apr 22, 2019)
- Machine Learning on DSPs: Enabling Audio AI at the Edge (Apr 22, 2019)
- Andes Launches First DSP Instruction Set for RISC-V Multi-Core Processors to Challenge the HPC Marke (Apr. 22, 2019)
- Safety, cybersecurity and cost delaying mass deployment of autonomous cars (Apr 18, 2019)
- Rambus Announces Tapeout and Availability of 112G Long Reach SerDes PHY on Leading-edge 7nm Node for High-Performance Communications and Data Centers (Apr 18, 2019)
- TSMC Reports First Quarter EPS of NT$2.37 (Apr 18, 2019)
- Globalfoundries' Morgenstern: Diversity is key in Dresden (Apr 18, 2019)
- Allegro DVT Introduces the Industry First Real-Time AV1 Video Encoder Hardware IP for 4K/UHD Video Encoding Applications (Apr 18, 2019)
- Synopsys Establishes Center of Excellence with STMicroelectronics to Speed Development of Automotive Electronic Systems (Apr 18, 2019)
- Moortec to Showcase its PVT Monitoring IP at TSMC 2019 Technology Symposium (Apr. 17, 2019)
- M31 Technology Develops SRAM Compiler IP on TSMC's 28nm Embedded Flash Process Technology Providing High Performance and Low Power Solutions (Apr. 17, 2019)
- Exablaze and Algo-Logic partner to deliver ultra-low latency trading solutions (Apr 17, 2019)
- Cadence LPDDR4/4X Memory IP Subsystem Achieves ISO 26262 ASIL C Certification from SGS-TUV Saar Using TSMC 16FFC Process Technology (Apr. 17, 2019)
- Qualcomm and Apple agree to drop all litigation (Apr 17, 2019)
- Apple, Intel, Q'comm Keep Their Secrets (Apr. 17, 2019)
- Samsung Successfully Completes 5nm EUV Development to Allow Greater Area Scaling and Ultra-low Power Benefits (Apr 16, 2019)
- TSMC Unveils 6-nanometer Process (Apr 16, 2019)
- Fujitsu Begins Production of Post-K (Apr 16, 2019)
- Arteris IP FlexNoC Interconnect Licensed by DisplayLink for Systems-on-Chip (Apr. 16, 2019)
- Omnitek achieves world-leading CNN performance per watt in a midrange programmable device. (Apr 16, 2019)
- Intel Acquires Omnitek, Strengthens FPGA Video and Vision Offering (Apr 16, 2019)
- Cobham Processor Technology Powers Commercial NanoSatellite (Apr 16, 2019)
- Intel to Exit 5G Smartphone Modem Business, Focus 5G Efforts on Network Infrastructure and Other Data-Centric Opportunities (Apr. 16, 2019)
- Don't Worry, Be H(AI)ppy (Apr. 16, 2019)
- Silvaco Joins SEMI, and Electronic System Design Alliance, a SEMI Strategic Association Partner (Apr. 16, 2019)
- Life After Nokia (Apr. 16, 2019)
- China and its Pursuit for Chip Self-Sufficiency (Part 2) (Apr. 16, 2019)
- EDA Industry Revenue Grows for Full Year 2018 but Slows for Fourth Quarter (Apr 15, 2019)
- Ampere Computing raises new round of capital, including new investor Arm (Apr 12, 2019)
- Countdown: How Close is China to 40% Chip Self-Sufficiency? (Apr 12, 2019)
- Gartner Says Worldwide Semiconductor Revenue Grew 12.5 Percent in 2018 (Apr 11, 2019)
- CEVA Wins 2018 CEM Editor's Choice Award for its NB-IoT IP Solution (Apr. 11, 2019)
- SiFive Tapes Out First in a Series of 7nm IP Enablement Platforms (Apr 11, 2019)
- Qorvo to Acquire Active-Semi International (Apr 11, 2019)
- New sensor makes it easy for manufacturers to implement IIoT solutions (Apr. 11, 2019)
- Michael Boukaya Promoted to Chief Operating Officer of CEVA, Inc. (Apr 10, 2019)
- Creonic Shows 100 Gbps Polar Decoder in International SENDATE-TANDEM Research Project (Apr 10, 2019)
- Wave Computing Unveils New Licensable 64-Bit AI IP Platform to Enable High-Speed Inferencing and Training in Edge Applications (Apr. 10, 2019)
- SiFive Launches the World's Smallest Commercial 64-bit Embedded Core (Apr 10, 2019)
- 2018 Global Semiconductor Equipment Sales Jump to Record $64.5 Billion (Apr 10, 2019)
- Flex Logix Launches InferX X1 Edge Inference Co-Processor That Delivers Near-Data Center Throughput at a Fraction of the Power and Cost (Apr. 10, 2019)
- TSMC March 2019 Revenue Report (Apr 10, 2019)
- SmartDV's DVCon China Exhibit to Showcase Extensive Verification IP Portfolio (Apr. 10, 2019)
- Qorvo to Acquire Active-Semi (Apr. 10, 2019)
- Vidatronic Announces Series of 40 nm Integrated Power Management Unit (PMU) IP Cores Optimized for Wireless and NB-IoT Applications (Apr 09, 2019)
- Faraday Unveils RISC-V ASIC Solution to Support Edge AI and IoT SoCs (Apr 09, 2019)
- UMC Reports Sales for March 2019 (Apr 09, 2019)
- Numem Inc. Exhibits at IP-SoC Santa Clara 2019 (Apr 09, 2019)
- First software-driven JPEG XS solutions demonstrated by intoPIX at NAB Show 2019. (Apr. 09, 2019)
- Synaptics Selects and Designs SiFive Custom E2 Series Core IP in Record Time (Apr 09, 2019)
- intoPIX announces availability of TICO-XS IP-cores supporting HD and 4K with a low FPGA footprint at NAB 2019 (Apr 08, 2019)
- Sofics Releases Analog IO's and ESD protection clamps for Advanced Applications using TSMC 7nm FinFET process (Apr 08, 2019)
- Sankalp Semiconductor to Exhibit & Present at Design & Reuse IPSoC Santa Clara 2019 (Apr 08, 2019)
- Andes Records a Rapid Growth of Design Wins in 2018 For Its New Family of RISC-V Processor Cores (Apr 08, 2019)
- GUC Monthly Sales Report - March 2019 (Apr 08, 2019)
- Intrinsic ID's BroadKey Delivers Hardware Root-of-Trust Security at Core of Authentico's New Password Security System (Apr. 08, 2019)
- intoPIX TICO-RAW technology to simplify and improve image signal processing of next-gen 4K & 8K cameras at NAB Show 2019 (Apr 08, 2019)
- Autonomous challenges (Apr. 04, 2019)
- SIA calls for more government support for semiconductor industry (Apr. 04, 2019)
- V-Nova and NGCodec ship industry's lowest cost real-time UHD encoding (Apr 04, 2019)
- PLDA Announces Two Innovative vDMA Engine IP Solutions, Delivering Robust Performance and Scalability across a PCIe link or AMBA AXI fabric (Apr 04, 2019)
- Menta and Mentor Partner for High-Level Synthesis of Embedded FPGA IP (Apr 03, 2019)
- Cadence Unveils Clarity 3D Solver, Delivering Unprecedented Performance and Capacity for System Analysis and Design (Apr 03, 2019)
- Intel driving Data-Centric World with new 10nm Intel Agilex FPGA Family (Apr 03, 2019)
- TSMC and OIP Ecosystem Partners Deliver Industry's First Complete Design Infrastructure for 5nm Process Technology (Apr 03, 2019)
- SMIC to sell stake in LFoundry (Apr. 03, 2019)
- Renesas Electronics Simplifies Development of USB PD and USB-C™ Battery Charging Applications with New Reference Designs (Apr. 03, 2019)
- Silvaco CTO, Babak Taheri, to Present at IP-SoC Santa Clara, April 9 (Apr. 03, 2019)
- Using neural networks to predict failure on hard disk drives (Apr. 03, 2019)
- China's Share of Fabless Market Grows but U.S Dominant (Apr. 03, 2019)
- Movellus Raises $6M in Venture Funding, Led by Stata Venture Partners (Apr 02, 2019)
- Sambanova Systems Announces $150M Series B From Intel Capital And GV To Advance Its Breakthrough AI Platform (Apr 02, 2019)
- proteanTecs Completes Successful Series B Funding and Launches Out of Stealth Mode (Apr 02, 2019)
- Global Semiconductor Sales Decrease 7.3 Percent Month-to-Month in February (Apr 02, 2019)
- Linley Spring Processor Conference 2019: eSilicon to demonstrate 7nm DSP SerDes over a 5-meter cable assembly and present on IP platforms (Apr 02, 2019)
- Arteris IP FlexNoC Interconnect Licensed by Horizon Robotics for ADAS Chips (Apr. 02, 2019)
- Silex Insight expands into North America with opening of Silicon Valley office (Apr 02, 2019)
- Global Semiconductor Materials Sales Hit New High of $51.9 Billion (Apr 02, 2019)
- Cadence Eyes System Analysis Market (Apr. 02, 2019)
- SiFive To Present At Leading IP, Processor Conferences (Apr. 02, 2019)
- Chip Firms Expect IoT to Be Key Revenue Driver (Apr. 02, 2019)
- New high-speed GigE Vision cameras enable smooth transition from CCD to CMOS imaging (Apr. 02, 2019)
- AI: Market Trader and Market Cop (Apr. 02, 2019)
- How the global IP market looks from the heart of China's high-tech industry (Apr. 02, 2019)
- The MOST Ultimate OTP Technology - AGIC Particle Momentum (Apr 01, 2019)
- Vidatronic Sponsors Design & Reuse's IP SoC Days Conference 2019 in Santa Clara (Apr. 01, 2019)
- SMIC Announces 2018 Annual Results (Apr 01, 2019)
- Omnitek Releases Highly Optimised 3D LUT IP for FPGAs (Apr 01, 2019)
- Renesas Completes Acquisition of Integrated Device Technology (Apr 01, 2019)
- Cadence Digital Implementation and Parasitic Extraction Tools Enabled for Samsung Foundry Gate-All-Around Technology (Apr 01, 2019)
- Cadence Extends Cloud Leadership with New CloudBurst Platform for Hybrid Cloud Environments (Apr 01, 2019)
- SMIC Rift: Rare Peek into China IC Industry (Apr 01, 2019)
- Processors, Sensors Drive Embedded Vision (Apr 01, 2019)
- Tsinghua Poaches Talent to Aid China's Faltering DRAM Industry (Mar. 28, 2019)
- Top 10 China's most innovative companies (Mar. 28, 2019)
- Top court's new IP tribunal upholds French firm's patent (Mar. 28, 2019)
- EnSilica at IoT Tech Expo - Global London, 2019 (Mar. 28, 2019)
- Visit D&R at IP SoC 19 (Mar. 28, 2019)
- nnMAX™ Inference Acceleration Architecture presented by Flex Logic at the Autonomous Vehicle Hardware Summit (Mar. 28, 2019)
- SMIC Rift: Who's in Charge of China's Chip Industry? (Mar. 28, 2019)
- PathPartner Technology Opens New European Office in Frankfurt (Mar. 28, 2019)
- Moore's Law Ending? No Problem (Mar 27, 2019)
- Arm Pelion IoT platform provides foundation for comprehensive IoT utility deployments (Mar 27, 2019)
- U.S. Companies Continue to Represent Largest Share of Fabless IC Sales (Mar 27, 2019)
- Atmosic Technologies Extends Controlled Energy Harvesting Technology to Harness Photovoltaic Power for IoT Device Connectivity (Mar 27, 2019)
- Nextera Video Announces NMOS IS-08 as the Latest Addition to their Industry-Leading 2110 Video Over IP FPGA Core Set (Mar 27, 2019)
- Achronix Demonstrates Silicon Validation Device with 112 Gbps SerDes (Mar 27, 2019)
- CyberX Capitalizes on IIoT Security Momentum with Additional $18 Million in Strategic Funding (Mar 27, 2019)
- Synopsys Announces Collaboration with Samsung Foundry to Offer Secure and Scalable Environment on the Cloud for IC Design and Verification (Mar 27, 2019)
- Q1 Forecast Disappointing for Foundry Sales (Mar. 27, 2019)
- MIPI Alliance Announces Annual Membership Award Recipients (Mar. 27, 2019)
- ON Semiconductor to Acquire Quantenna Communications (Mar. 27, 2019)
- ON Semiconductor Reaches Key Milestones in Roznov Facility Expansion (Mar. 27, 2019)
- Wave Collaborates with UC Berkeley's BAIR Open Research Alliance to Accelerate Cutting-Edge Artificial Intelligence Research (Mar 26, 2019)
- China Lures SMIC Co-CEO Zhao (Mar 26, 2019)
- REALSEC includes Silex Insight high performance crypto IP for all their HSM solutions (Mar 26, 2019)
- Intrinsic ID's Hardware Root of Trust IP Selected by Tyrion Integration for Industry 4.0 IoT Security in Oil & Gas Deployment (Mar 26, 2019)
- Apple v. Q'comm Cases and Impacts (Mar 26, 2019)
- UltraSoC strengthens data science and machine learning team with appointment of new VP Software Development (Mar 26, 2019)
- Arteris IP FlexNoC Interconnect Licensed by Morningcore for Automotive LTE-V2X Modems for China Market (Mar 26, 2019)
- A*STAR and Soitec Launch Joint Program to Develop a New Layer Transfer Process for Advanced Packaging (Mar. 26, 2019)
- KT and Samsung Achieve 1Gbps Speed Over the Air on the 5G Commercial Network in Seoul (Mar. 26, 2019)
- Cortus Announces the General Availability of a RISC-V Processor Family - from Low End Embedded Controller to 64 bit Processor with Floating Point. (Mar 25, 2019)
- New Merced EOS S3AI HDK from QuickLogic Enables Fast AI Endpoint Solution Development (Mar. 25, 2019)
- A Chinese Perspective: Is the U.S. Ahead in AI? (Mar. 25, 2019)
- Qualcomm Joins Open Security & Safety Alliance to Help Transform the IP Surveillance Camera Industry (Mar. 24, 2019)
- InSync Technology Ltd Adopts the Adeas/Nextera ST2110 IP Core Set (Mar 21, 2019)
- Samsung Develops Industry's First 3rd-generation 10nm-Class DRAM for Premium Memory Applications (Mar 21, 2019)
- WIPO 2018 IP Services: Innovators File Record Number of International Patent Applications, With Asia Now Leading (Mar 21, 2019)
- sureCore Delivers Customised Low Power SRAM for Data Intensive Designs (Mar. 21, 2019)
- Sonics and Arteris IP Agree to Dismiss Litigation (Mar. 21, 2019)
- DATE 2019: eSilicon to present two papers on advanced floor planning techniques with the Polytechnic University of Catalonia (Mar 21, 2019)
- Synopsys Introduces New embARC Machine Learning Inference Software Library for Power-Efficient Neural Networks (Mar 21, 2019)
- Synopsys Fusion Design Platform Extends Leadership at 7nm, Surpasses 100-Tapeout Milestone in First Year (Mar 20, 2019)
- Synopsys Unveils TestMAX Family of Products to Address Critical and Evolving Test Challenges (Mar 20, 2019)
- Qualcomm Joins Open Security & Safety Alliance to Help Transform the IP Surveillance Camera Industry (Mar. 20, 2019)
- U.S. Court Finds Apple Infringed Qualcomm IP (Mar 19, 2019)
- Nvidia Mum on 7nm GPU (Mar 19, 2019)
- Arteris IP FlexNoC Interconnect & Resilience Package Licensed by Vayyar Imaging for ISO 26262-Compliant 3D Imaging Chips for Automotive Systems (Mar. 19, 2019)
- Imagination delivers new and enhanced developer tools for Android (Mar. 19, 2019)
- Mine Cryptocurrencies Sooner (Part 3) (Mar. 19, 2019)
- TSMC seeing chip orders for Android devices ramp up (Mar. 19, 2019)
- Samsung Electronics Introduces New High Bandwidth Memory Technology Tailored to Data Centers, Graphic Applications, and AI (Mar. 19, 2019)
- ON Semiconductor Collaborates with NVIDIA on Cloud-Based Autonomous Vehicle Simulation (Mar. 19, 2019)
- Automotive Industry Steers European Patent Growth (Mar. 19, 2019)
- Standardizing the ADAS Lexicon (Mar. 19, 2019)
- Number of 300mm IC Wafer Fabs Expected to Reach 121 in 2019 (Mar 18, 2019)
- Andes Technology Strengthens the RISC-V EasyStart Alliance to 15 ASIC Design Service Partners (Mar 18, 2019)
- Global Top Ten IC Foundries Ranked for 1Q19, with TSMC Expected to Reach 48.1% Market Share, Says TrendForce (Mar 18, 2019)
- Synopsys Unveils IC Validator NXT to Cut Physical Signoff Cycle by 2X (Mar 18, 2019)
- Boeing's B737 Max and Automotive 'Autopilot' (Mar 18, 2019)
- Baidu, Facebook and Microsoft work together to define the OCP Accelerator Module specification (Mar 15, 2019)
- Imagination in UK's top ten for European Patent Filing (Mar 15, 2019)
- Data Centers Open Source Silicon (Mar 15, 2019)
- Chips-as-a-Service on Startup's Menu (Mar 14, 2019)
- GOWIN Semiconductor Corporation Appoints Pan-European Representative (Mar 14, 2019)
- The RISC-V Foundation Appoints Calista Redmond As Chief Executive Officer (Mar 14, 2019)
- Andes and SEGGER Partner to Deliver Professional Development Solutions for RISC-V (Mar 14, 2019)
- Mobile Semiconductor Licenses memory compilers to Sandia National Laboratories (Mar 14, 2019)
- GlobalFoundries Says Neither the Company Nor Its Fab 7 Are Up for Sale (Mar. 14, 2019)
- Synopsys Delivers Industry's First USB4 Subsystem Verification Solution, VIP, and Test Suite for High-performance USB Architecture (Mar 14, 2019)
- Synopsys' Fusion Compiler Enables Renesas to Accelerate Delivery of Next-Generation Automotive Designs (Mar 14, 2019)
- Cadence Announces Industry's First Verification IP for USB4 (Mar 14, 2019)
- Latest Release of Synopsys' Design Compiler NXT is Ready for Broad Availability (Mar 13, 2019)
- Facebook Buys Interconnect IP Vendor Sonics (Mar. 13, 2019)
- OCP 2019: eSilicon to demonstrate 56G DSP SerDes over a 5-meter cable assembly in Samtec booth (Mar 13, 2019)
- Is Analog Signal Processing the Future of AI? (Mar. 13, 2019)
- Success with IoT requires the right organizational culture (Mar. 13, 2019)
- China to spend $134-220 billion on 5G between 2020 and 2025 (Mar. 13, 2019)
- Linux Foundation to Host CHIPS Alliance Project to Propel Industry Innovation Through Open Source Chip and SoC Design (Mar 12, 2019)
- Key Industry Players Converge to Advance CXL, a New High-Speed CPU Interconnect for Breakthrough Data Center Performance (Mar 12, 2019)
- News waiting for approval (Mar. 12, 2019)
- Arm, Cadence and Xilinx Introduce First Arm Neoverse System Development Platform for Next-Generation Cloud-to-Edge Infrastructure, Implemented on TSMC 7nm Process Technology (Mar 12, 2019)
- Andes Technology Announces RISC-V Single-core and Multicore Processors with DSP Instruction Set (Mar. 12, 2019)
- Global Fab Spending to See 2019 Decline, New Highs in 2020 (Mar 12, 2019)
- Arteris IP FlexNoC Interconnect Licensed by Silicon Mobility for OLEA ISO 26262 ASIL-D Automotive FPCU (Mar 12, 2019)
- Attopsemi's I-fuse OTP Passed 3 lots of HTS and HTOL Qualification for 1,000hr on GLOBALFOUNDRIES 22FDX FD-SOI Technology (Mar 12, 2019)
- CEVA Computer Vision, Deep Learning and Long Range Communication Technologies Power DJI Drones (Mar. 12, 2019)
- eFPGA IP from Menta Selected by Beijing Chongxin Communication Company to Enable Programmability in 4G/5G Wireless Baseband SoC (Mar. 12, 2019)
- GSMA bets on IoT as biggest market for the mobile industry in coming years (Mar. 12, 2019)
- Mine Cryptocurrencies Sooner (Part 2) (Mar. 12, 2019)
- TSMC February 2019 Revenue Report (Mar 11, 2019)
- Spectral Edge Fusion innovation brings RGB and Near Infrared light together for breakthrough, no-compromise performance in low lighting (Mar 11, 2019)
- Intel Expected to Recapture #1 Semi Supplier Ranking in 2019 (Mar 11, 2019)
- Sonics: Our Next Chapter (Mar 11, 2019)
- UMC Reports Sales for February 2019 (Mar 11, 2019)
- Intel, RISC-V Rally Rival Groups (Mar. 11, 2019)
- NVIDIA to Acquire Mellanox for $6.9 Billion (Mar 11, 2019)
- Teledyne LeCroy Demonstrates First Protocol Analyzer Platform for Next-Generation USB4 and Thunderbolt 3 Systems (Mar 07, 2019)
- AV Safety Ventures Beyond ISO 26262 (Mar 07, 2019)
- Edge Intelligence the Focus at Embedded World (Mar. 07, 2019)
- Dialog Semiconductor to Acquire Silicon Motion's Mobile Communications Business Including Ultra-Low-Power Wi-Fi, Extending its Position in IoT Connectivity (Mar 07, 2019)
- Nuvoton Debuts Arm Cortex-M23 Based MCU (Mar. 07, 2019)
- Samsung Electronics Starts Commercial Shipment of eMRAM Product Based on 28nm FD-SOI Process (Mar 07, 2019)
- Codasip to Demonstrate Technology Leadership and Commitment to Open Standards at Taiwan RISC-V Workshop (Mar 07, 2019)
- Arasan announces the immediate availability of its MIPI D-PHY / C-PHY Combo IP for TSMC 22nm SoC Designs (Mar 07, 2019)
- MACOM and GLOBALFOUNDRIES Collaborate to Scale Silicon Photonics to Hyperscale Cloud Data Center and 5G Network Buildouts (Mar 06, 2019)
- Interoperability demo at OFC: eSilicon 56G SerDes and Precise-ITC 400G FEC (Mar 06, 2019)
- Cobham Gaisler's HiRel GR712RC processor was launched on February 21, 2019 onboard the SpaceIL mission to the Moon (Mar. 06, 2019)
- Intel Announces First 58Gbps FPGA Transceiver in Volume Production Enabling 400G Ethernet Deployment (Mar 06, 2019)
- New SK Hynix China fab nears completion (Mar. 06, 2019)
- Cryptographers See Danger in Encryption Laws (Mar. 06, 2019)
- Crowded AI Chip Market Still Has Room for New Entrants According to New Linley Group Study (Mar 05, 2019)