AGIC Tape Out First Silicon at 14nm FinFET Technology

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AGIC C-Fuse OTP has been taped out on the foundry's 14nm technology platform on June 20th. In addition, AGIC will have a bunch of tape out events from 180nm to 22nm platform in Tier 1 foundries later 2019.

Taiwan, Jul. 04, 2019 – 

AGI Corporation (AGIC), a leading-edged non-volatile memory (NVM) IP provider, today announced the first tape-out of its C-Fuse OTP on 14-nanometer FinFET process technology.

Comparing to 28/22nm process technology, 14nm FinFET technology offers 50~55% higher speeds and consumes 50~60% less power at the same speed. The features of superior performance and the advantage of power consumption make 14nm FinFET a must-to-port process for automotive electronic, next generation high-end mobile computing and to benefit the using of IoT sensors for real-time monitoring.

As IC reliability and security have become extremely important, the existing one-time programmable memory solutions shall add more supplements to reduce the serious side effects, such as data retention in floating gate OTP or high defect rate occurred in anti-fuse OTP. C-Fuse logic-compatible OTP is given birth through the fundamental theories and delivers the industry's smallest footprint and lowest power Logic NVM IP solution.

C-Fuse technology, based on AGIC Particle Momentum, enables a wide range of applications for its "power-efficient" and "high temperature tolerated." To accommodate the rapidly shifting IoT market, C-Fuse is tailored for automotive, AIoT era, and edge computing solutions especially in advance nodes.

In collaboration with one of the most advanced pure play wafer foundries, AGIC C-Fuse OTP has been taped out on the foundry's 14nm technology platform on June 20th. In addition, AGIC will have a bunch of tape out events from 180nm to 22nm platform in Tier 1 foundries later 2019.

Welcome to visit our office and have more detail discussion if you are interested to know more detail about AGIC technology

1. Smaller area to lower the cost for silicon wafer.
2. No charge pump (CP) required.
3. Field programmability during system development.
4. Density supports a widely range from 8K to 4M bits.
5. Low voltage/current PGM and read.
6. High-Temp Immunity (>650°C~1000°C) and high reliability from -55°C to 175°C.
7. Supporting BCD/BJT/DRAM/Flash/CDMOS/MS and HV processes for analog, power and LCD/OLED/Touch Panel applications.
8. Portable across all Nodes, from 350nm to 5nm and beyond.
9. Require very lower power consumption.
10. High security and difficult-to-reverse engineer.

Artificial General Intelligence Cosmos IP total solution

Welcome to visit our website www.agicip.com and contact with us Sales@agicip.com for more detail presentation and discussion.

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