Wireless 3D Integration - Making Stacking Silicon as Easy as Stacking Lego (2/2)

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community.arm.com, Nov. 11, 2019 – 

In the previous instalment of this blog series we discussed some of the benefits that contactless (or wireless) 3D integration can offer in an Internet of Things (IoT) context. These being: low cost manufacturing and assembly, short design cycles, facility for heterogeneous integration, and intrinsic voltage level conversion. But how are they designed? In this second instalment, we dive into the technical details of how these wireless inter-tier links can be realised. Summarising some of the recent research contributions from the Arm-ECS Research Centre including COIL-3D (our automated CAD tool for the generation of ICL inductors). Our award-winning low energy data transceiver (using spike-based time-domain encoding), and finally CoDAPT (our wireless transceiver for Concurrent Data and Power Transmission).

Inductive Coupling Links

As discussed in the previous instalment, inductive coupling links are a form of near-field communication that relies on Faraday's principle of electromagnetic induction. The link consists of two inductors (one transmitting, TX, inductor, and one receiving, RX, inductor) ...

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