OmniVision Launches Automotive SoC for Entry-Level Rearview Cameras With Industry's Best Low-Light Performance, Lowest Power and Smallest Size

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In Combination With Onscreen Display Overlays, Curve Distortion Correction, 120dB HDR and Low Noise, Single-Chip Image Sensor and Signal Processor Enables Best Image Quality and Smallest Modules

SANTA CLARA, Calif., May. 05, 2020 – 

OmniVision Technologies, Inc., a leading developer of advanced digital imaging solutions, today announced its 1.3MP OX01E10 SoC, providing automotive designers with the industry's best imaging performance for entry-level rearview cameras (RVC) across a wide range of challenging lighting conditions, along with the most compact form factor and lowest power consumption. In a single, 1/4" optical format package, the OX01E10 integrates a 3 micron image sensor and an advanced image signal processor (ISP), enabling designers to achieve a small form factor with excellent low-light performance, ultra-low power and reduced cost while improving reliability by using only one printed circuit board (PCB). Additionally, the OX01E10 provides two onscreen display overlay layers for driver guidelines, as well as distortion correction to straighten any curved edges from lenses with a wide viewing angle.

In addition to the regulatory requirements driving growth in rearview cameras, car buyers have come to expect them. Yole Développement estimates that 42 million image sensors were shipped for RVC applications in 2019, and they forecast a 5 year CAGR of 7% (1).

"RVC remains the largest volume application in the automotive camera market," said Andy Hanvey, director of automotive marketing at OmniVision. "Our OX01E10 SoC provides the best option for automotive designers responding to the growing consumer demand for better RVCs. Additionally, this SoC's functional safety features allow module providers to create a single platform for both the viewing cameras and the machine vision applications that require ASIL B, while offering pin-to-pin compatibility and design reuse with our OX01F10 SoC for surround view systems (SVS)."

The OX01E10 features power consumption that is over 35% lower than competitors' and significantly reduces temperature. In fact, this is the only imaging device for entry-level RVC that does not require a metal heat sink, allowing for the use of plastic camera module bodies to reduce costs. With its compact package size, it also enables smaller cameras that can fit in much tighter spaces. In addition, by integrating both the image sensor and ISP into a single chip, designers can save on both cost and space by eliminating the second PCB in typical two-chip implementations.

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