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The future of leading-edge chips according to TSMC: 5nm, 4nm, 3nm and beyond
TSMC details process technologies that will be used for billions of chips
www.techradar.com, Aug. 31, 2020 –
Taiwan Semiconductor Manufacturing Co. (TSMC) recently shared some details about its progress and plans for the coming years.
TSMC will continue to introduce new leading-edge manufacturing processes annually; 5nm chips this year and 3nm processors in late 2022.
For customers that need more than a leading-edge node, meanwhile, TSMC will offer new packaging technologies that will enable to create ultra-compact SiPs, as well as behemoth-sized SoCs for supercomputers.