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Telink TLSR9 Wireless Audio & IoT RISC-V SoC integrates RISC-V DSP/SIMD P-extension
www.cnx-software.com, Nov. 04, 2020 –
At the end of last month, there was a lot of buzz about Bouffalo BL602, one of the first RISC-V SoC with built-in wireless connectivity, namely WiFi 4 and Bluetooth 5.0 LE.
We should expect more and more of those types of solutions, and Telink & Andes jointly introduced TLSR9-series of wireless audio chips for hearables, wearables, and other high-performance IoT applications. The chips are powered by an Andes D25F RISC-V 5-stage core that happens to be the first core to integrate RISC-V DSP/SIMD P-extension and offer Bluetooth 5.2, Zigbee 3.0, HomeKit, 6LoWPAN, Thread, and/or 2.4 GHz proprietary protocol.
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