TSMC adopts 3D stacking tech for chips along with Google and AMD

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industryleadersmagazine.com, Nov. 25, 2020 – 

Taiwan Semiconductor Manufacturing Co. (TSMC) the world's biggest chip-making contract company has found a new way to manufacture chips along with Advanced Micro Devices or AMD and Google.

In a bid to find innovative ways to pack more information on a tiny chip, the semiconductor maker has come up with a new way of packaging more in a tiny space.

Chip packaging is a part of the final stage of the process of chip making. Semiconductors are placed in another case before being put on a printed circuit board.

TSMC is now using a new 3D technology called SoIC to stack and link several different types of chips – such as processors, memory and sensors – into one package, according to the company.

The SoIC method makes the chips more efficient and powerful.

These new 3D technology chipsets will be manufactured at TSMC's new factory in Miaoli in Taiwan. The plant will be built by 2021 and the mass production for the chip will begin at latest by 2022. Google and AMD have already committed to the SoIC chips and are helping TSMC to test and certify them.

TSMC supplies chips to Apple, Qualcomm, Nvidia and Broadcom, almost all the big players in the market. Earlier, it outsourced the chip packaging part to specialized suppliers, including ASE Technology Holding, Amkor and Powertech, Chinese companies such as Jiangsu Changjiang Electronics Technology, Tongfu Microelectronics, and Tianshui Huatian Technology Co.

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