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TSMC's 3nm Process On Track For 2 Year, 2X Performance Improvement – Chairman

wccftech.com, Feb. 23, 2021 – 

The Taiwan Semiconductor Manufacturing Company's (TSMC) chairman Dr. Mark Liu has confirmed that the company's next-generation 3nm chip manufacturing node is on schedule. TSMC, which supplies processors to customers all over the world is currently building a facility to manufacture 3nm chips, and the company hopes to commence production for these products next year.

TSMC's 3nm Will Nearly Double Logic Density Over Its 5nm Node and Deliver an 11% Performance Boost or 27% Power Efficiency Gain

The executive's comments regarding his company's next manufacturing technology confirm that TSMC believes that it will be able to manage both the increased demand for its current and future products at the same time - without letting the recent uptick in demand for automobile products affect its output. They came during his talk at the International Solid-State Circuits Conference (ISSCC) titled 'Unleashing the Future of Innovation' given on Monday last week.

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