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TSMC's 3DFabric Technology is the next big wave in Chip Design that Apple will take advantage of in the not-too-distant Future

www.patentlyapple.com, Jun. 08, 2021 – 

In January Patently Apple posted a report titled "TSMC's CEO confirms that 3nm Processors are on target for mass production in 2022 while Advancing 3DFabric Technology." TSMC's CEO CC Wei was quoted as stating, "We observe chiplets are becoming an industry trend. We are working with several customers on 3DFabric to enable chiplet architecture." Interesting enough, Apple's work on developing a chiplet design started in 2017. Apple was granted their first patent for their chiplet design in March 2021 while filing an update just last month.

Considering that Apple is likely one of the partners that TSMC stated that they were working with on 3DFabric chiplet technology, I wanted to at least provide a basic report on Apple's patent so that engineers and geeks could further explore it, knowing that Apple could further advanced their chip designs using chiplets in the not-too-distant future.

I first discovered this patent over the weekend in the European Patent Office's archive and then worked it back to its U.S. filing under continuation patent 20210159180 titled "High Density Interconnection using Fanout Interposer Chiplet.

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