Samsung, TSMC in heated race for industry's smallest 3 nm process node

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www.kedglobal.com, Aug. 04, 2021 – 

The world's two largest foundry chipmakers, Taiwan Semiconductor Manufacturing Co. (TSMC) and Samsung Electronics Co., are in a heated race for the 3-nanometer process node, the industry's narrowest circuitry.

While multiple news outlets from Taiwan reported on Wednesday that TSMC, the current industry leader, has begun installing a 3 nm chip fab at its plant in Tainan for mass production in 2022, Samsung is also said to be aiming for chip production using the same technology next year.

The competition is set to get fiercer as US tech giant Intel Corp. has thrown down the gauntlet to jump into the foundry business, a growing sector that manufactures cutting-edge chips for fabless firms, including chip designers.

According to Taiwan's DigiTimes and other local media, TSMC on Aug. 2 began installing equipment for the leading-edge, next-generation 3 nm chip process node at its Fab 18 in Tainan for mass production of chips in the second half of next year.

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