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UMC and Chipbond to Establish Strategic Cooperation

UMC and Chipbond are establishing a long-term strategic partnership.

www.eetasia.com, Sept. 07, 2021 – 

The Boards of Directors of United Microelectronics Corp. (UMC), Fortune Venture Capital (a 100% subsidiary of UMC), and Chipbond Technology Corp. have approved the proposal of share exchange resolution. Following the issuance and exchange of new shares, UMC and Chipbond will establish a long-term strategic partnership.

UMC manufactures chips with advanced process technology for various IC applications. The company continues to pursue a comprehensive portfolio of technology and solutions, from 14 nanometers to 0.6 micron processes, in order to fulfill customers' design needs. Chipbond's operations mainly focus on panel driver IC assembly and testing, flip chip bumping, and wafer level chip scale packages (WLCSP). It also invests in fan-out system-in-package (FOSiP) and flip-chip system packaging (FCSiP) and other related high-end advanced packaging technology processes.

UMC is the first Taiwanese foundry to manufacture panel driver ICs, as well as the first to successfully use 28nm high-voltage process in AMOLED panel driver IC production, which has now advanced to 22nm process capabilities. Chipbond is the world's leading driver IC packaging and testing house in capacity and technology. The two companies will cooperate closely in the field of driver ICs, integrate front-end and back-end process technologies, and develop driver IC solutions of higher frequency and lower power consumption, jointly providing a complete solution for customers in the panel industry.

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