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Samsung and NAVER Collaborate on Chip Solutions for Hyperscale AI

Samsung and NAVER are collaborating to develop semiconductor solutions tailored for hyperscale AI models

www.eetasia.com, Dec. 07, 2022 – 

Samsung Electronics Co. Ltd and NAVER Corp. are collaborating to develop semiconductor solutions tailored for hyperscale artificial intelligence (AI) models.

Leveraging Samsung's next-generation memory technologies like computational storage, processing-in-memory (PIM) and processing-near-memory (PNM), as well as Compute Express Link (CXL), the companies intend to pool their hardware and software resources to dramatically accelerate the handling of massive AI workloads.

Recent advances in hyperscale AI have led to an exponential growth in data volumes that need to be processed. However, the performance and efficiency limitations of current computing systems pose significant challenges in meeting these heavy computational requirements, fueling the need for new AI-optimized semiconductor solutions.

Developing such solutions requires an extensive convergence of semiconductor and AI disciplines. Samsung is combining its semiconductor design and manufacturing expertise with NAVER's experience in the development and verification of AI algorithms and AI-driven services, to create solutions that take the performance and power efficiency of large-scale AI to a new level.

For years, Samsung has been introducing memory and storage that support high-speed data processing in AI applications, from computational storage (SmartSSD) and PIM-enabled high bandwidth memory (HBM-PIM) to next-generation memory supporting the CXL interface. Samsung will now join with NAVER to optimize these memory technologies in advancing large-scale AI systems.

NAVER will continue to refine HyperCLOVA, a hyperscale language model with over 200 billion parameters, while improving its compression algorithms to create a more simplified model that significantly increases computation efficiency.

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