D&R News Alert
January 9th, 2025
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Welcome to the issue of January 9th, 2025 of D&R SoC News Alert, our email update to provide you with the latest news and information in the System-On-Chip Community.

Secure-IC
Secure-IC’s Securyzr achieves ASIL-D ready certification
  • Worldwide leader in safe & secure solutions for automotive
  • ASIL-D, ISO/SAE 21434 readiness combined with FIPS, CC...
  • Secure comm protocols, secure boot, fault detection, ECC.
  • ASIL-D Securyzr™ iSE S700 neo, crypto solutions neo and more
>> Discover the ASIL-D ready solutions

Foundry and Technology News
■ Nvidia and TSMC team up on a silicon photonics chip prototype
■ Silicon Photonics Pioneer CEA-Leti Will Unveil Major R&D Gains At Photonics West Jan. 25-30
■ Quantum Motion Announces Partnership with Semiconductor Manufacturer GlobalFoundries
Chiplets
■ GUC Taped Out UCIe 40Gbps IP using Adaptive Voltage Scaling (AVS)
Is your chip design consuming too much power?
SureCore
• Memory can use over 50% of a chip’s power needs
• Our special memory IP needs ~50% less power
• Silicon proven in volume
• We are the custom memory design specialists

Discover how to meet your chip’s power budget >>

Design Platform
■ Qualitas Semiconductor Secures Multiple Project Licensing Agreements with Pansemi Following Successful Initial Collaboration
■ Accelerating Design in Collaboration with NVIDIA at CES 2025 - by Cadence Design Systems
■ Cadence: Leading the EDA Industry with AI-Powered Platforms
Interface IP
■ Qualitas Semiconductor and Verisilicon signed a licensing agreement for 4nm PCIe 6.0 PHY IP
Rambus
Supercharging AI Inference
with GDDR7

• Learn about selecting the right memory for AI inference
• Discover what’s new with GDDR7 memory
• See how GDDR7 can meet the bandwidth and performance target to meet your AI chip designs
• Find out more about the Rambus GDDR7 Memory Controller IP
Find out more >>

Artificial Intelligence
■ Ceva Embedded AI NPUs Gain Traction in AIoT and MCU Markets, with Multiple Customer Wins and Enhanced AI Software Studio
■ Ceva Expands Embedded AI NPU Ecosystem with New Partnerships That Accelerate Time-to-Market for Smart Edge Devices
■ BrainChip Unveils Edge AI Box Partner Ecosystem for Gestures, Cybersecurity, Image Recognition, and Computer Vision
■ Siemens unveils breakthrough innovations in industrial AI and digital twin technology at CES 2025
■ Samsung Expands ‘AI for All’ Vision at CES 2025 To Bring AI Everyday, Everywhere
[ New Product ] PUFhsm: EVITA-Full Compliant Hardware Security Module for Automotive and Advanced Applications
View
Product Intro
  • Pre-integrated CPU to execute secure boot, updates, deployment, debugging, monitoring, key management, and lifecycle management
 PUF Security

Security Solutions
■ CXL Update Emphasizes Security
■ Flash Memory LDPC Decoder IP Core Available For Integration From Global IP Core
Automotive
■ Ceva Powers Oritek's Next-Gen ADAS chipsets for Smarter, Safer Electric Vehicles
■ VeriSilicon's Display Processing IP DC8200-FS has achieved ISO 26262 ASIL B certification
■ Secure-IC's worldwide leading safe & secure automotive solutions achieve a new breakthrough: Securyzr™ S700 neo series reach ASIL-D grade
Discover M31's Advanced MIPI M-PHY v5.0 IP
m31
• Complies with MIPI M-PHY specification v5.0
• Support UFS host & device application
• Supports High-Speed (HS) G1, G2, G3, G4, G5 A/B modes
• Available for 5/8nm
Explore more >>

Partner News
■ Ansys and Synopsys Announce Agreement with Keysight Technologies for Sale of Ansys PowerArtist
■ Synopsys Responds to the UK Competition and Markets Authority Provisionally Accepting its Proposed Remedies in Phase 1 Regarding its Proposed Acquisition of Ansys
■ QuickLogic Announces Strategic Process for SensiML
■ GUC Monthly Sales Report - December 2024
Business News
■ Eighteen New Semiconductor Fabs to Start Construction in 2025, SEMI Reports





What they said at
IP SoC EU 24

Silicon Lifecycle Management (SLM) in context of Chiplets for Automotive
Graham Woods, Principal Product Manager, Synopsys, Inc.

Solidify the European FDSOI ecosystem and accelerating its industrial deployment; A Chips JU initiative
Martin LABRUNE, European & France Public Affairs, STMicroelectronics

Designing Intelligence from our SOIL
Krishna Pradeep, Soitec

Interview with Jean-Christophe Brignone - SMTS - STMicroelectronics

Interview with Hakim Jaafar - VP Marketing - Dolphin Semiconductor

Interview with Graham Woods - Principal Product Manager - Synopsys, Inc.

Interview with Gordon Fairley - Kudelski IoT

Interview with Dr. Calliope-Louisa Sotiropoulou - CAST, Inc.

Interview with Patrick Döll - Physical IC Design Engineer - Racyics GmbH

Interview with Luca TESTA - Cofounder & COO - Keysom

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