Find Top SoC Solutions
for AI, Automotive, IoT, Security, Audio & Video...
You are here : design-reuse-embedded.com  > Interconnect, D2D, C2C  > Chip to Chip

NuLink - Interconnect Solution


Eliyan s Interconnect technology built with standard organic chip packaging delivers the same performance as advanced packaging technology, and enables The Ultimate Chiplet Systems at a fraction of total cost of ownership.
NuLink™ delivers performance and power/area efficiency that no other technology can offer. Our exclusive trade secrets and patent-protected technologies deliver a UCIe compliant interconnect at twice the bandwidth and half the power.
The NuLink architecture leveraged cross-technology innovations to deliver the highest bandwidth and lowest latency, at best-in-class area and power efficiency.

Partner with us

List your Products

Suppliers, list and add your products for free.

More about D&R Privacy Policy

© 2023 Design And Reuse

All Rights Reserved.

No portion of this site may be copied, retransmitted, reposted, duplicated or otherwise used without the express written permission of Design And Reuse.