As falling silicon technology node-size continues to reduce the power consumption and physical space required for any given ASIC design, whole new embedded ASIC application areas continually open up. Nowhere has this trend been more obvious than in the world of sensor-based, intelligent, connected embedded applications.A key challenge with this growing diversification is the apparent conflict between adding new features vs. reducing product costs, development costs, and getting product to market sooner. Historically, product development teams have had to pick one or the other, but today the market is demanding nearly all: to be competitive requires a product to be available sooner, with more new features, and delivered at lower cost, with higher quality.
ASTC is helping its customers tackle this challenge with a comprehensive, platform based approach: the Intelligent Sensor and Power Management Platform (ISP) .