Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accu... - Apr. 23, 2024Highlights of Three Demo Stations New LDO, High accuracy PVT Sensors, High Performance Clocks, Droop Detectors, and more in N3P Patented Pinless PLL’s and Sensor... > Read Silicon Creations Reaches Milestone of 10 Million Wafers in Production with TSMC - Apr. 22, 2024This marks the latest achievement in two decades of innovation and collaboration between the companies Silicon Creations , a leading supplier of high-performance analog and mixed-signal i... > Read |
T2M-IP Unveils Revolutionary MIPI D-PHY & DSI Controller IP Cores with speed 2.5Gbps/lane, Redefining High-Speed Data Tran... - Apr. 22, 2024– T2M IP, a renowned global business development company specializing in complex system-level semiconductor IP cores solutions, proudly announced its latest addition to the IP cores p... > Read TSMC Reports First Quarter EPS of NT$8.70 - Apr. 19, 2024TSMC (TWSE: 2330, NYSE: TSM) today announced consolidated revenue of NT$592.64 billion, net income of NT$225.49 billion, and diluted earnings per share of NT$8.70 (US$1.38 per ADR unit) for t... > Read |
DVB-S2X Wideband LDPC/ BCH Decoder IP Core Available For Integration From Global IP Core - Apr. 19, 2024- Global IP Core Sales - The DVB-S2X LDPC Decoder is a powerful FEC core decoder for Digital Video Broadcasting via Satellite. It implements extensions to the DVB-S2X design for better perfo... > Read Fraunhofer IIS offers JPEG XS plugin for NVIDIAs Holoscan for Media Architecture - Apr. 16, 2024The Fraunhofer Institute for Integrated Circuits IIS today announces it has developed JPEG XS plugins and microservices especially designed for seamless data processing and exchange with NVI... > Read |
GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers - Apr. 19, 2024– Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that the GLink-3D interface (GUC’s Link for 3D die stacking) for the TSMC 3DFabric SoIC-X 3D stacking pl... > Read |
M31 Successfully Validates 5nm IP Solution to Empower Global AI Applications - Apr. 18, 2024-- M31 Technology Corporation (M31), a leading global provider of silicon intellectual property (IP), announced that its 5nm advanced process IP solution for high-speed interface IPs such as... > Read OPENEDGES Unveils ENLIGHT Pro: A High-Performance NPU IP Quadrupling its Previous Generation's Performance - Apr. 16, 2024--- OPENEDGES Technology, Inc. (OPENEDGES, KOSDAQ: 394280), a total memory subsystem IP provider, is thrilled to announce the launch of ENLIGHT Pro. This state-of-the-art inference neural pr... > Read |
Faraday Partners with Arm to Innovate AI-driven Vehicle ASICs - Apr. 18, 2024Faraday Technology Corporation (TWSE: 3035), a leading provider of ASIC design services and IP solutions, announced it is leveraging the latest Arm® Automotive Enhanced (AE) technology, l... > Read Challenges in designing automotive radar systems - Apr. 16, 2024Radar is cropping up everywhere in new car designs: sensing around the car to detect hazards and feed into decision making for braking, steering, and parking and in the cabin for driver and o... > Read |
Silvaco Announces Expanded Partnership with Micron Technology - Apr. 17, 2024Silvaco Group, Inc. (“Silvaco”), a provider of TCAD, EDA software, and SIP solutions that enable semiconductor design and AI through software and innovation, today announced an ... > Read Alphawave Semi: FY 2023 and 2024 YTD Trading Update and Notice of Results - Apr. 17, 2024– Alphawave IP Group plc (LN: AWE, the “Company” or “Alphawave Semi”), a global leader in high-speed connectivity for the world’s technology infrast... > Read Samsung Develops Industry's Fastest 10.7Gbps LPDDR5X DRAM, Optimized for AI Applications - Apr. 17, 2024Industry-leading features come with 25% higher performance, 30% more capacity and 25% higher power efficiency The new LPDDR5X is the optimal solution for future on-device applications and i... > Read |
IP block covers Wi-Fi 6, Bluetooth 5.4 dual mode and IEEE 802.15.4 for IoT chips - Apr. 16, 2024Ceva has introduced a multi-radio intellectual property package for IoT IC designers that combines Wi-Fi 6, Bluetooth 5.4 and 802.15.4 modems with a 2.4GHz transceiver aimed at TSMC's 22n... > Read ITRI launches AIoT certification center with Arm - Apr. 16, 2024The Industrial Technology Research Institute (ITRI) has established the ITRI・Arm SystemReady™ Lab in Taipei, in partnership with Arm, to enable AIoT certification. This certifi... > Read |
Brazil and Europe sign innovative project with RISC-V technology for HPC - Apr. 15, 2024An international collaboration between BSC and Instituto ELDORADO will enable Brazil to develop open-source RISC-V technologies to accelerate research and development in the areas of semicon... > Read VISC: The New Coprocessing RISC-V Architecture for AI Efficiency - Apr. 13, 2024Red Semiconductor has announced the availability of its Versatile Intrinsic Structured Computing (VISC) architecture for RISC-V. VISC is an extension to RISC-V IP that accelerates complex alg... > Read Winners of the Embedded World awards - Apr. 10, 2024The winners of the show awards and community vote at the Embedded World exhibition covered AI, embedded hardware and a new award for startups. From the more than 100 submissions, a five-mem... > Read |
Xiphera and Kaviaz Technology Announce a Partnership for IP Distribution in Taiwan - Apr. 11, 2024-- Xiphera, Ltd, a Finnish company designing and implementing hardware-based security solutions, announced today a partnership with Kaviaz Technology, a professional EDA/IP distributor based... > Read Tiempo Secure - CryptoNext Security partnership, bringing High-End Post-Quantic IP Security innovation to the next level. - Apr. 10, 2024-- CryptoNext Security, recognized as a key innovator in post-quantum cryptographic technologies, and Tiempo Secure, a leading provider of high-end secure IP semiconductor solutions, proudly ... > Read |