TSMC (TWSE: 2330, NYSE: TSM) today unveiled its newest semiconductor process, advanced packaging, and 3D IC technologies for powering the next generation of AI innovations with silicon leader...
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By joining forces with industry leaders in the Arm Total Design ecosystem, Kalray is helping more companies integrate its AI and data-processing solution into their next-generation chips. Kal...
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-- Numem, the pioneering provider of Memory SOC IPs and Chip/Chiplets, is excited to announce that Numem CEO Jack Guedj will discuss cutting-edge memory solutions at the Design & Reuse IP...
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-- As the latest addition to the Rambus portfolio of industry-leading interface and security digital IP for AI 2.0, the GDDR7 memory controller will provide the breakthrough memory throughput...
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Collaboration on AI-Driven Design Flows for Optimization and Productivity, Advancements in Photonic IC Integration, Plus Broad IP Development on TSMC 2nm Technology -- Synopsys, Inc. (Nas...
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-- M31 Technology Corporation (M31), a leading global provider of silicon intellectual property (IP), announced that the M31 MIPI C/D-PHY Combo IP has obtained silicon validation on the adva...
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By Anton Shilov, embedded.com (April 24, 2024) Ceva’s new line up of IPs include Wi-Fi 6, Wi-Fi 7, Bluetooth 5.4, next-generation Bluetooth, narrowband IEEE 802.15.4 (for Thread, Zi...
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Ceva has introduced a multi-radio intellectual property package for IoT IC designers that combines Wi-Fi 6, Bluetooth 5.4 and 802.15.4 modems with a 2.4GHz transceiver aimed at TSMC's 22n...
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-- Keysight Technologies, Inc. (NYSE: KEYS), Synopsys, Inc. (Nasdaq: SNPS), and Ansys (Nasdaq: ANSS) introduce a new integrated radio frequency (RF) design migration flow from TSMC's N...
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– Alphawave IP Group plc (LSE: AWE, the “Company” or “Alphawave Semi”), a global leader in high-speed connectivity for the world’s technology infras...
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QUALITAS SEMICONDUCTOR CO., LTD. (QUALITAS) (KOSDAQ: 432720), a leading provider of interconnect solutions, proudly announces the appointment of HongKong HuaSun Rich Point Technology Ltd. (HS...
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Record First Quarter Backlog of $6.0 Billion and cRPO of $3.1 Billion Raising 2024 Revenue Outlook -- Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced results for the first qua...
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Siemens and Mercedes-Benz have collaboratively developed a Digital Energy Twin to facilitate the future of sustainable factory planning in the automotive industry.
Under a strategic p...
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Faraday Technology Corporation (TWSE: 3035), a leading provider of ASIC design services and IP solutions, announced it is leveraging the latest Arm® Automotive Enhanced (AE) technology, l...
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A number of former Arm China employees have reportedly followed Allen Wu to new venture The ex-chief executive of Arm China, Allen Wu, has reportedly founded a RISC-V chip company to potentia...
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An international collaboration between BSC and Instituto ELDORADO will enable Brazil to develop open-source RISC-V technologies to accelerate research and development in the areas of semicon...
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Red Semiconductor has announced the availability of its Versatile Intrinsic Structured Computing (VISC) architecture for RISC-V. VISC is an extension to RISC-V IP that accelerates complex alg...
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- Global IP Core Sales - The DVB-S2X LDPC Decoder is a powerful FEC core decoder for Digital Video Broadcasting via Satellite. It implements extensions to the DVB-S2X design for better perfo...
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The Fraunhofer Institute for Integrated Circuits IIS today announces it has developed JPEG XS plugins and microservices especially designed for seamless data processing and exchange with NVI...
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– Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that the GLink-3D interface (GUC’s Link for 3D die stacking) for the TSMC 3DFabric SoIC-X 3D stacking pl...
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