Video Interview: Progress on FAMES Pilot Line for 10-nm and 7-nm FD-SOI

Find the Latest SoC Solutions
for... Automotive... IoT... Security... Audio... Video

eetimes.com, Dec. 31, 2024 – 

In December 2024, we caught up with Jean-Rene Lequepeys, chief technology officer and deputy director of CEA-Leti, at the IEDM conference in San Francisco, Calif., to talk about the FAMES Pilot Line project. This is a European Union funded project that aims to develop FD-SOI technologies at 10-nm and 7-nm nodes, eNVM solutions, RF components, 3D integration, and PMIC technologies to develop innovative chip architectures to increase performance and lower power consumption of mixed-signal circuits.

In this video interview, Lequepeys gives us the background to this project, its objectives and how over 40 global partners are keen to evaluate the technology.

Background to the FAMES Pilot Line project

FAMES stands for "FD-SOI Pilot Line for Applications with embedded non-volatile Memories, RF, 3D integration & PMIC, to ensure European Sovereignty." As part of the European Chips Act funding, it has a total budget of €830 million (about $865 million) allocated until December 2028, evenly co-funded by the EU and participating member states.

Click here to view the video...

 Back