|
From design to mass production, a one-stop IP and customization service platform for LLM system
Zarc - Head of Innosilicon IP and Chip Customization Division - Innosilicon
Biography :
| Zarc, Vice President of IP R&D of Innosilicon, graduated with a master's degree in integrated circuits from Huazhong University of Science and Technology in 2009. He has more than 10 years of design experience in the fields of FinFet advanced processes and high-performance chips, involving high-precision technologies in the industry such as HBM3, Chiplet, GDDR6X, LPDDR5X, DDR5, etc. The DDR series IP he developed is the strongest and most comprehensive in the world, and has been successfully applied to billions of high-end SoC chips. It has accumulated hundreds of tape-outs in the world's six major mainstream foundries, and many indicators have broken industry records. He also led the team to take the lead in developing the world's only HBM3/2E Combo IP, GDDR6X/6 Combo IP and other international cutting-edge products. | 高专，芯动科技IP研发副总裁，2009年硕士毕业于华中科技大学微电子专业。在FinFet先进工艺和高性能芯片等领域有10多年设计经验，涉及HBM、Chiplet、GDDR6X、LPDDR5X、DDR5等行业高精尖技术，所开发的DDR系列IP全球最强、覆盖最全，已成功应用于数十亿颗高端SoC芯片，在全球六大主流Foundry累计上百次流片，多项指标突破行业纪录，还带领团队率先开发了全球唯一的HBM3/2E Combo IP、GDDR6X/6 Combo IP等国际前沿产品。 |
Back
Partner with us |
List your ProductsSuppliers, list and add your products for free. |
More about D&R Privacy Policy© 2024 Design And Reuse All Rights Reserved. No portion of this site may be copied, retransmitted, reposted, duplicated or otherwise used without the express written permission of Design And Reuse. |
||||||
Contact Us
Partnership Offers