Globalfoundries extends 22nm FDSOI, holds 12nm

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Globalfoundries is extending its 22FDX manufacturing processes based around the 22nm FDSOI but the 12nm version will not be in production until 2023 or 2024.

www.eenewseurope.com, Sept. 28, 2020 – 

Back in 2016 Globalfoundries was planning for customer tape-outs on it 12nm 12FDX in the first half of 2019.

Globalfoundries preps 12nm FDSOI process

Meanwhile the 22FDX platform at 22nm has been in production since 2017/2018 with the inclusion of MRAM as an embedded non-volatile memory option. More than 350 million chips have been shipped and generated more than $4.5 billion in revenue.

FDSOI, or fully-depleted silicon-on-insulator, is alternative manufacturing option to the FinFET beyond bulk CMOS at 28nm, that brings a number of advantages. The buried oxide layer reduces parasitic capacitance, which improves power consumption and allows for back-biasing to actively trade off power consumption and performance. It can also reduce temperature dependency due to less doping and allows high density circuitry and better wafer utilization. This can bring a number of advantages in mixed-signal and RF circuits, an area where Globalfoundries has been concentrating.

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