Samsung Electronics Squaring Off with TSMC in Packaging Technology

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www.businesskorea.co.kr, Nov. 30, 2020 – 

Competition between TSMC and Samsung Electronics, the world's top foundry players, is expanding from micro-fabrication processes to packaging technology.

While micro-fabrication is about making semiconductors smaller, packaging is about stacking multiple chips in a certain area (package) or deploying them more efficiently. The recent evolution of the foundry business from contract manufacturing to comprehensive services has increased the importance of packaging.

Samsung Electronics' foundry business department has recently decided to expand its packaging services to four types by the end of 2021. The Korean semiconductor giant intends to diversify its packaging services by performance and price to give its customers more options.

Currently, Samsung Electronics' flagship packaging service is "X-Cube," a three-dimensional (3D) stacking technology. It is a technology that stacks several wafer chips, which have completed the pre-process, high up.

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