Italian startup for 3D chiplet package co-design

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MZ Technologies in Italy has launched a design tool for 3D system co-design called Genio

www.eenewseurope.com, Feb. 03, 2021 – 

Monozukuri SpA in Rome, which trades as MZ Technologies, has launched a design tool for the 3D co-packaging of chips and chiplets down to the PCB level.

Genio supports the design of 2D, 2.5D and 3D multi-component systems and operates across multiple levels including die, chiplet, silicon interposer, package and PCB. There are three different versions specifically for 2D, 2.5D and 3D design. The tools uses standard design data formats to integrate with existing commercial EDA tools and this allows dedicated plug-ins to integrate into non-standard custom EDA flows. It has a graphic interface that provides an interactive 3D visualization of the complete system.

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