Siemens and ADS deliver HDAP enablement solutions

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Siemens Digital Industries Software, together, with Advanced Semiconductor Engineering (ASE) have developed two new enablement solutions to create and evaluate multiple complex IC package assemblies and interconnects,

www.newelectronics.co.uk, Feb. 11, 2021 – 

The new high-density advanced packaging (HDAP) enablement solutions - which provide an easy-to-use, data-robust graphical environment prior to and during physical design implementation - stem from ASE's participation in the Siemens OSAT Alliance – a program designed to drive faster adoption of new HDAP technologies like 2.5D, 3D IC and Fan-Out wafer-level packaging (FOWLP) for next-generation IC designs.

ASE is a leading provider of independent semiconductor assembling and test manufacturing services.

ASE's latest achievements as part of the OSAT Alliance include an assembly design kit (ADK) that helps customers using ASE's Fan Out Chip on Substrate (FOCoS) and 2.5D Middle End of Line (MEOL) technologies to leverage Siemens' HDAP design flow. Both companies have also agreed to extend their partnership to include the future creation of a single design platform from FOWLP to 2.5D substrate design. All of these joint initiatives leverage Siemens' Xpedition Substrate Integrator software and Calibre 3DSTACK platform.

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