Semiconductor Industry: TSMC Invests in Japan for 3D SoIC

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www.businesskorea.co.kr, Feb. 16, 2021 – 

TSMC plans to create synergies with a range of companies via the establishment of a Japanese research institute for development of materials for 3D SoIC packaging in Japan. TSMC is emphasizing that 3D SoIC will be one of the main growth engines from 2022.

TSMC invests in Japan for 3D SoIC materials development

TSMC’s Japan research center (being established with investment of JPY18.6bn) is to focus on the development of 3D SoIC materials. In detail, the venture aims to create synergies with a range of Japanese materials companies via the establishment of a Japanese research institute for advanced materials technology. Presenting 3D SoIC as one of the main growth engines to be in play from 2022, TSMC is constructing two back-end process fabs for 3D SoIC technology, one of which is to be completed in 2H21.

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