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TSMC Ranks in Top-10 For Capacity in Three Wafer Size Categories
New Global Wafer Capacity report shows top-10 installed capacity leaders in three different wafer size categories...
www.eetasia.com, Mar. 03, 2021 –
IC Insights recently released its new Global Wafer Capacity 2021-2025 report that provides details, analyses, and forecasts for IC industry capacity by wafer size, process geometry, region, and product type through 2025.
As of December 2020, only TSMC–the world's largest foundry–was listed among the wafer capacity leaders in each of the three wafer size categories. It had the most 200mm wafer capacity last year and ranked second, trailing only Samsung, in 300mm wafer capacity.
It is not surprising that the 300mm ranking includes only DRAM and NAND flash memory suppliers like Samsung, Micron, SK Hynix, and Kioxia/WD; four of the world's largest pure-play foundries TSMC, GlobalFoundries, UMC, and Powerchip (including Nexchip); and Intel, the industry's biggest manufacturer of microprocessors. These companies offer the types of ICs that benefit most from using the largest wafer size available to best amortize the manufacturing cost per die. Moreover, they have the means to continue investing large sums of money in new and improved 300mm fab capacity.
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