Hsinchu Baoshan R&D center to work on 3nm process: TSMC

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focustaiwan.tw, Mar. 09, 2021 – 

Taipei, March 9 (CNA) Taiwan Semiconductor Manufacturing Co. (TSMC), the world's largest contract chipmaker, said on Tuesday that its soon-to-be-opened research and development center in Baoshan Township, Hsinchu, northern Taiwan will be involved in ongoing efforts to develop the advanced 3 nanometer process.

TSMC made the statement following claims in local news media that the chipmaker is planning to expand production using the 3nm process from the South Taiwan Science Park to Hsinchu, in a bid to meet strong global demand.

The reports said the production expansion was being undertaken to compete for orders from U.S. clients such as Apple Inc.

TSMC said the R&D center is phase one of the company's investment project in Baoshan.

The second stage aims to build a more sophisticated 2nm process wafer plant, but there is no fixed timetable for the new production site as it is still pending approval of an environmental assessment.

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