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NEWS

Intel to put $3.5bn into packaging

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Intel will invest $3.5 billion in packaging technology at its Rio Rancho, New Mexico plant.

www.electronicsweekly.com, May. 04, 2021 –

The plant employs about 1,800 workers and will be retooled to deliver Foveros packaging technology.

Intel currently develops and produces its EMIB packaging technology, silicon photonics products, and Optane media at Rio Rancho.

The current investment does not include Optane which utilises 3D XPoint technology – the much maligned phase-change memory technology.