CEA-Leti Introduces Plastic mmWave System for Applications Requiring Ultra-Low Latency and Ultra-High-Speed Connectivity

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Low-Cost Gb/s Connectivity Overcomes Limits of Copper Wire and Optical Fiber for Automotive, Aeronautics, Telecom, Industry 4.0 and Healthcare Uses

www.leti-cea.com, May. 28, 2021 – 

GRENOBLE, France – May 28, 2021 – As part of its broad focus on millimeter-wave (mmWave) data transfer applications, CEA-Leti has developed a hybrid, ultra-fast, ultra-low latency technology that guides mmWave radio signals through flexible plastic tubing. Called H-Link, the low-cost, energy-saving system ensures Gb/s broadband connectivity that also overcomes the limits of copper wire and optical fiber, such as oxidation of metal and brittleness. In addition to being flexible and less sensitive to vibration and electromagnetism, H-Link's wireless technology delivers transmission speeds of up to 15 Gb/s.

Designed for multiple robotic and other applications, the system meets next-generation wireless-system performance requirements of the automotive, aeronautics, telecom, Industry 4.0 and healthcare sectors. The first-of-its-kind technology can transfer information over distances up to 10 meters at a speed of 15 Gb/s, with an average data transmission speed of 6 Gb/s over a little more than two meters. CEA-Leti's team is now developing new RF components that should reach speeds up to 100 Gbs/s over 10 meters by end of the year.

mmWave systems operate in frequency ranges from 30 to 300 GHz. CEA-Leti's previous work in mmWave communications includes design and use of 5G networks on the MINATEC campus in Grenoble. In addition to being the next challenge to delivering the full potential of 5G, mmWave technology will be required for future innovative services such as fixed, super-high-speed broadband access, industrial automation, healthcare and intelligent transport systems.

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