GUC Tapes Out AI/HPC/Networking Platform on TSMC CoWoS Technology

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Global Unichip has successfully taped out AI/HPC/Networking CoWoS Platform with 7.2Gbps HBM3 Controller and PHY, GLink-2.5D and third-party 112G-LR SerDes IPs.

www.eetasia.com, Jun. 23, 2021 – 

Global Unichip Corp. (GUC) has successfully taped out AI/HPC/Networking CoWoS Platform with 7.2Gbps HBM3 Controller and PHY, GLink-2.5D and third-party 112G-LR SerDes IPs. The main die of the platform contains the world's first HBM3 Controller and PHY IP with a record-high 7.2Gbps performance. The platform meets strict signal and power integrity (SI and PI) requirements of 112G-LR SerDes routed through TSMC CoWoS technologies. GUC's GLink-2.5D interface enables high-bandwidth, low-latency, low-power interconnection of several dies on the CoWoS platform. The success of the tape out breaks the limits of memory bandwidth and unleashes new potential for scalable artificial intelligence (AI), high performance computing (HPC), and networking multi-die solutions.

The platform represents real AI/HPC/Networking applications usage cases which require the high flexibility of SoC floorplans and HBM3 PHY/Controller arrangements on the main die vs. HBM3 memory on interposers. GUC's patent-pending solution allows HBM3 bus routing between PHY and memory at any angle while keeping the same signal width and space as in traditional straight HBM bus routing. It allows shorter routing, better signal integrity, higher speed and lower power consumption than traditional zig-zag HBM bus routing. Our products can support up to 10 HBM3 memories connected to two SoC dies by using splitting PHY technology. GUC's patent-pending solution enables the splitting of the central HBM3 memory bus to PHYs, located on two SoC dies to allow full HBM3 utilization in 2:6 or 2:10 SoC:HBM3 memory use cases.

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