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Intel has changed the name of its process nodes for marketing purposes. Mass production for SEC's GAA process has been delayed. Despite intensifying foundry competition, TSMC is expected to maintain a process technology edge for the time being.

www.businesskorea.co.kr, Jul. 28, 2021 – 

Intel renames process nodes

On Jul 27, Intel held an event and announced a new architecture roadmap and plans to retake the lead in process technology. First, the firm changed its node names, renaming its 10nm technology Intel 7 and 7nm technology Intel 4. The intention is to emphasize that TSMC and Samsung Electronics (SEC)' 7nm and 5nm processes are actually similar to Intel's existing 10nm and 7nm processes. Based on actual pitch, TSMC and SEC's node names were exaggerated, causing Intel to lag behind in terms of marketing.

Intel 4 is scheduled to be mass-produced from 2023 and it will be the first Intel process to utilize EUV technology. Intel 20A is scheduled for mass production from 2024 by applying next-generation architecture named RibbonFET (GAA). Intel 18A is planned for mass production from 2025 and will feature second generation RibbonFET technology. If this technology roadmap progresses smoothly, Intel could gain a technological edge over TSMC from 2025.

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