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Intel Outlines Roadmap to Recapture Process Technology Crown by 2025
Intel plans to debut a new generation of central processing chips and a new process node to produce them every year through 2025, when it aims to recapture its crown in process technology from TSMC.
www.electronicdesign.com, Aug. 05, 2021 –
Intel is racing to regain its footing as the unquestioned leader in chip manufacturing technology by 2025.
The Santa Clara, California-based company recently released one of its most ambitious roadmaps in years, full of new process and packaging technologies that Intel argues will close the performance gap with rivals by 2024 and give it process technology leadership the following year. The goal is to roll out a new generation of central processing units (CPUs)–and a new process node to mass-produce it–every year through 2025.
Every generation of processors will be based on more advanced transistors than the last. Intel said that it is bringing features into the fold at every stage of the roadmap, including a new transistor architecture called RibbonFET by 2024 and a new interconnect system called PowerVia the same year. It is also expanding the use of EUV lithography at every node and plans to beat its competitors out of the gate with "high-NA" EUV.
The company revealed the new process and packaging roadmap at its "Intel Accelerated" event last month.
Intel has slipped from the leadership spot in the semiconductor industry in recent years. Behind Intel's woes is a series of manufacturing missteps that forced it to delay its most advanced processors for data centers and personal computers. In February, Intel hired its former chief technology officer Pat Gelsinger as CEO to reinvigorate its chip development process and regain ground being surrendered to a growing crowd of rivals.
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