Siemens collaborates with TSMC on design tool certifications

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www.newelectronics.co.uk, Oct. 27, 2021 – 

In an announcement from the TSMC 2021 Online Open Innovation Platform (OIP) Ecosystem Forum, Siemens Digital Industries Software has said that its ongoing collaboration with TSMC has resulted in an array of new product certifications.

Both companies have also announced that they have reached a number of key milestones for cloud-enabled IC design, as well as for TSMC 3DFabric, TSMC's comprehensive family of 3D silicon stacking and advanced packaging technologies.

The Siemens EDA offerings were recently certified for TSMC's N3 and N4 processes and include the Calibre nmPlatform, Siemens' physical verification solution for IC sign-off, as well as the Analog FastSPICE Platform, which provides circuit verification for nanometer analogue, radio frequency (RF), mixed-signal, memory, and custom digital circuits.

Siemens and TSMC have also been working closely on advanced process certifications for Siemens' Aprisa place-and-route solution, to help assist joint customers achieve a smooth and more rapid silicon success with Aprisa at the foundry's most advanced processes.

"TSMC continues to develop innovative silicon processes that enable our mutual customers to bring to market many of the world's most advanced ICs," said Joe Sawicki, executive vice president, IC-EDA for Siemens Digital Industries Software. "Our collaboration with TSMC delivers difference-making technologies that enable our mutual customers to deliver IC innovations to market more quickly."

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