Siemens Collaborates with TSMC on Design Tool Certifications for Advanced Technologies

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Siemens' ongoing collaboration with longtime foundry partner TSMC has resulted in an array of new product certifications and key milestones for cloud-enabled IC design.

www.eetasia.com, Nov. 01, 2021 – 

Siemens Digital Industries Software's ongoing collaboration with Taiwan Semiconductor Manufacturing Co. Ltd (TSMC) has resulted in an array of new product certifications and key milestones for cloud-enabled IC design, as well as for TSMC 3DFabric, TSMC's comprehensive family of 3D silicon stacking and advanced packaging technologies. The announcement was made at last week's TSMC 2021 Online Open Innovation Platform (OIP) Ecosystem Forum.

The Siemens EDA offerings recently certified for TSMC's N3 and N4 processes include the Calibre nmPlatform, Siemens' industry-leading physical verification solution for IC sign-off, as well as the Analog FastSPICE Platform, which provides leading-edge circuit verification for nanometer analog, radio frequency (RF), mixed-signal, memory, and custom digital circuits. Siemens and TSMC have also been working closely on advanced process certifications for Siemens' Aprisa place-and-route solution, to help assist joint customers achieve smooth and rapid silicon successes with Aprisa at the foundry's most advanced processes.

"TSMC continues to develop innovative silicon processes that enable our mutual customers to bring to market many of the world's most advanced ICs," said Joe Sawicki, executive vice president, IC-EDA for Siemens Digital Industries Software. "Siemens is proud to collaborate with TSMC to continue to deliver difference-making technologies that enable our mutual customers to deliver IC innovations to market more quickly."

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