TSMC to double its capacity expansion

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www.taipeitimes.com, Nov. 11, 2021 – 

Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday said that it plans to roughly double its capacity expansion over the next three years to cope with rapidly growing demand for chips used in high-performance computing (HPC) applications and electronic devices.

The COVID-19 pandemic accelerated a global digital transformation as lockdowns led to a surge in demand for PCs and other devices that connect to the Internet, the Hsinchu-based chipmaker said.

Chip demand also rose due to increased usage of contactless payment tools and the growing popularity of electric vehicles, it said.

"We started speeding up our capacity expansion at the beginning of last year, but the semiconductor supply chain was still unable to catch up ... with demand growth," TSMC senior vice president Y.P. Chin (秦永沛) told a semiconductor forum organized by National Cheng Kung University in Tainan.

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