TSMC joins Intel-led chiplet alliance as founding member

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focustaiwan.tw, Mar. 04, 2022 – 

Taipei, March 4 (CNA) Taiwan Semiconductor Manufacturing Co. (TSMC), the world's largest contract chipmaker, has become one of the key players joining hands to co-establish an industry consortium -- the Universal Chiplet Interconnect Express (UCIe) -- led by U.S.-based semiconductor giant Intel Corp.

The UCIe consortium is focused on a single goal: creating an open ecosystem for enabling chiplets designed and manufactured on different process technologies by different vendors to work together when integrated with advanced packaging technologies, Kurt Lender, Intel's Datacenter and AI Group IO technology solution team strategist, said in a statement.

According to Intel, the UCIe alliance's founders have included pure-play wafer foundry players like TSMC, integrated circuit packaging and testing services providers, cloud services providers and intellectual property suppliers in a bid to build an open chipset ecosystem.

In addition to TSMC, Taiwan's ASE Technology Holding Co., the world's largest IC packaging and testing provider, has also joined the UCIe consortium, Intel said.

Among other participants in the UCIe alliance are South Korea's Samsung Electronics Corp., U.S.-based Advanced Micro Devices Inc. (AMD), Google Cloud, Meta Platforms (formerly known as Facebook), Microsoft Corp., Qualcomm Inc., and U.K.-based computer chip designer ARM Holdings.

"To satisfy the ever-increasing demand for more computing power, Intel and many of our colleagues in the semiconductor industry have come to the same conclusion: The future of chip innovation lies in moving to modular designs based on "chiplet" building blocks, essentially moving from system-on-chip (SoC) to System-on-Package (SoP) chip architectures," Intel's Lender said.

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