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TSMC's enhanced 3nm process node (N3e) to start production a quarter ahead of schedule
www.phonearena.com, Mar. 05, 2022 –
TSMC and Samsung are the only two foundries right now that are moving closer to producing chips using a 3nm process node. While TSMC plans on continuing using its FinFET transistors for 3nm, Samsung plans on using its GAA (Gate-all-around) architecture for 3nm. According to Wccftech, Wall Street powerhouse Morgan Stanley says that TSMC is moving the production schedule for its enhanced 3nm process node (N3e) ahead by a quarter.
Morgan Stanley says that the production yield for this node has been higher than expected and the foundry might freeze the design of the N3e node by the end of this month. Part of the report was posted on Twitter by a user with the handle RetiredEngineer who took from the financial giant's report that volume production for the N3e process node may start during the second quarter of 2023 rather than the third quarter.
According to Morgan Stanley's report, the logic density of TSMC's N3e process node is approximately 8% less than the original N3 with four fewer EUV layers. The EUV machine uses ultraviolet beams to help create circuit patterns on wafers. Considering how many transistors fit inside a chip these days, these circuit patterns need to be extremely narrow as do the beams that create these patterns.
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