Samsung 3nm Process may be put into production before TSMC

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www.gizchina.com, May. 02, 2022 – 

Samsung reveals in the latest briefing to investors that its 3nm process will start production in the next few weeks. If this comes to fruition, its progress is faster than TSMC. However, TSMC never comments on its competitors. According to TSMC, the 3nm with FinFET architecture will enter mass production in the second half of the year. Industry analysts believe that although Samsung claims that 3nm is entering the countdown to mass production, from the perspective of transistor density and performance, Samsung's 3nm is comparable to TSMC's 5nm and Intel's Intel 4nm process.

Samsung's "3nm" process is the latest theoretically but practically, it still lags behind TSMC. Samsung briefed investors that it is fully preparing to put the GAA-based 3nm process into production in the first half of this year. This means that it will start the mass production process in the next eight weeks.

Samsung claims that relative to its current 7nm FinFET architecture process, the new 3nm process chips can work in a low-voltage environment below 0.75 volts. This will reduce the overall power consumption by 50%. It will also improve the performance by 30%, and reduce the chip size by 45%.

Although Samsung's 3nm process will be comparable to TSMC's 4nm process, the former's bandwidth and leakage control performance will be better. This will most likely result in better performance.

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