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AMD Might Have to Wait Behind Intel and Apple for TSMC's 3nm Wafers
www.extremetech.com, May. 03, 2022 –
Recently we've reported on the high-stakes bidding war unfolding behind the scenes over TSMC's upcoming 3nm node. Its 5nm process is/was an unquestioned success and its 3nm process node is expected to lead the industry as well. The only question is which companies would have deep enough pockets to secure it. We've speculated previously that it would be Intel and Apple. Now a report from Digitimes confirms this is indeed happening. That by itself is just confirmation of earlier reports, but the new twist is that it might leave AMD out in the cold.
The new reporting is from Digitimes via Wccftech, and it states that AMD is planning on using TSMC 3nm for its Zen 5 CPUs. As a refresher, the company is using TSMC's 5nm node currently on its Zen 4 architecture, which should debut later this year. After that it was apparently hoping to jump to the newer node, but apparently Apple and Intel have already secured the entirety of TSMC's wafer capacity. Apple is reportedly using it for its M2 silicon, and Intel needs it for its Meteor Lake GPU tiles. TSMC is expected to begin production at 3nm later this year, with mass production starting in 2023. However, if TSMC is only capable of filling orders for Intel and Apple through next year, that'll push AMD to the back of the line. This could force the company to have to wait until 2024, or even 2025, to get access to its most advanced node. Digitimes notes that Nvidia and Mediatek might also be affected by TSMC's prioritization of Apple and Intel
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